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US4394191A Expired / Lapsed US ⏱️ 0.0 years remaining

Stacked polycrystalline silicon film of high and low conductivity layers

Assignee: Hitachi Ltd
•
Filing: 1980-12-17
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Granted: 1983-07-19
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Expires: 2000-12-17
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Abstract

Abstract A polycrystalline silicon film is implanted with an impurity in large amounts and is heated to be annealed, whereupon it is irradiated with a laser beam to be annealed. Thus, a polycrystalline silicon film of very low resistivity consisting of a second layer whose activated impurity concentration is equal to or below a solid solubility and a first layer whose activated impurity concentration is above the solid solubility is formed.

Inventors

  • 👤 Yasuo Wada
  • 👤 Hiroo Usui
  • 👤 Makoto Ohkura
  • 👤 Masanobu Miyao
  • 👤 Masao Tamura
  • 👤 Takashi Tokuyama

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 14:23
CPC Classifications
H; H10; H10P; H10P34/00; H10P34/40; H10P34/42; H10D; H10D62/00; H10D62/40; H10D62/60; Y; Y10; Y10S; Y10S438/00; Y10S438/934

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 83 words
A polycrystalline silicon film comprising a second layer and a first layer formed on the second layer, the second layer being formed by impurity doping and thermal annealing prior to forming the first layer, said second layer having an activated impurity concentration that is not higher than a solid solubility, and the first layer being formed on said second layer and having an activated impurity concentration that is higher than the solid solubility, whereby a polycrystalline film having a low resistivity is formed.
Claim 2
Dependent Claim 83 words
A polycrystalline silicon film comprising a second layer and a first layer formed on the second layer, the second layer being formed by impurity doping and thermal annealing prior to forming the first layer, said second layer having an activated impurity concentration that is not higher than a solid solubility, and the first layer being formed on said second layer and having an activated impurity concentration that is higher than the solid solubility, whereby a polycrystalline film having a low resistivity is formed.
Claim 3
Dependent Claim 28 words
A polycrystalline silicon film according to claim 1, wherein thicknesses of said polycrystalline silicon film and said first layer are approximately 0.3-0.5 μm and approximately 0.2 μm, respectively.
Claim 4
Dependent Claim 33 words
A polycrystalline silicon film according to claim 1 or 2, wherein resistivities of said first layer and said second layer are approximately 2.5×10 -4 Ω·cm and approximately 4×10 -4 -6×10 -4 Ω·cm, respectively.
Claim 5
Dependent Claim 30 words
A polycrystalline silicon film according to claim 1, 2 or 3, wherein an impurity of said film is an element selected from the group consisting of phosphorus, arsenic and boron.
Claim 6
Dependent Claim 59 words
A polycrystalline silicon film according to claim 1, formed by doping an impurity into a polycrystalline silicon film, thermally annealing the polycrystalline silicon film, to form said layer having said activated impurity concentration not higher than a solid solubility, and then irradiating the resultant polycrystalline film with a laser beam to form said first layer on said second layer.
Claim 7
Dependent Claim 57 words
A polycrystalline silicon film according to claim 1, formed, after implanting the impurity, by a step of thermal annealing the polycrystalline silicon film to increase the grain size of the crystals of the first layer, so that a high mobility and a high activated impurity concentration are achieved in the polycrystalline silicon film at the same time.
Claim 8
Dependent Claim 24 words
A polycrystalline silicon film according to claim 5, wherein the grain size of the crystals of the first layer increases after the thermal annealing.
Claim 9
Dependent Claim 27 words
A polycrystalline silicon film according to claim 5 or 7, wherein the activated impurity concentration of said first layer increases after said irradiating with a laser beam.
Claim 10
Dependent Claim 33 words
A polycrystalline silicon film according to claim 5, formed, after said thermally annealing but before said irradiating, by a second implanting of an impurity, into the surface region of the polycrystalline silicon film.
Claim 11
Dependent Claim 78 words
A polycrystalline silicon film comprising a second layer whose activated impurity concentration is not higher than a solid solubility but whose activated impurity concentration is formed by impurity doping and thermally annealing the second layer to form an activated impurity concentration nearly equal said solid solubility, and a first layer which is formed on said second layer and whose activated impurity concentration is higher than the solid solubility, whereby a polycrystalline film having a low resistivity is formed.
Claim 12
Dependent Claim 78 words
A polycrystalline silicon film comprising a second layer whose activated impurity concentration is not higher than a solid solubility but whose activated impurity concentration is formed by impurity doping and thermally annealing the second layer to form an activated impurity concentration nearly equal said solid solubility, and a first layer which is formed on said second layer and whose activated impurity concentration is higher than the solid solubility, whereby a polycrystalline film having a low resistivity is formed.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-07-18 1987-01-17 1987-07-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-07-18 1991-01-17 1991-07-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-07-18 1995-01-17 1995-07-19 $7700.00 Window Closed / Lapsed

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