US4396457A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making bumped-beam tape
Assignee: FCI Americas Technology LLC
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Filing: 1982-03-17
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Granted: 1983-08-02
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Expires: 2002-03-17
Abstract
Abstract Mechanically punching bumps in a thin copper or aluminum foil and etching the foil to form beams with a bump at the end of each beam. Alternatively increasing the layers by casting or gluing polyimide film to the foil and etching the polyimide film in designated areas to expose the copper or aluminum.
Inventors
- 👤 Frank C. Bakermans
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/4092; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
124 words
In a method for making a bumped-beam tape for tape bonding semiconductor chips to lead frames, ceramic chip carriers or hybrid substrates, the method employing a pilot punch to engage multiple registration holes on each edge of a substrate containing at least in part a thin copper or aluminum foil, the improvement comprising (a) forming the bumps on the copper or aluminum foil by positioning the foil with the pilot punch in a forming die having a predetermined array of male punch members and causing the punch members to strike the foil with sufficient force to produce deformations in the foil, (b) selectively etching beams in the foil either before or after forming the bumps, and (c) bonding the bumps to a semiconductor chip.
Claim 2
Dependent Claim
124 words
In a method for making a bumped-beam tape for tape bonding semiconductor chips to lead frames, ceramic chip carriers or hybrid substrates, the method employing a pilot punch to engage multiple registration holes on each edge of a substrate containing at least in part a thin copper or aluminum foil, the improvement comprising (a) forming the bumps on the copper or aluminum foil by positioning the foil with the pilot punch in a forming die having a predetermined array of male punch members and causing the punch members to strike the foil with sufficient force to produce deformations in the foil, (b) selectively etching beams in the foil either before or after forming the bumps, and (c) bonding the bumps to a semiconductor chip.
Claim 3
Dependent Claim
115 words
In a method for making a bumped-beam tape for tape bonding semiconductor chips to lead frames, ceramic chip carriers or hybrid substrates, the method employing a pilot punch to engage multiple registration holes on each edge of a substrate containing at least in part a thin copper or aluminum foil, the improvement comprising (a) positioning the foil with the pilot punch in a forming die having a predetermined array of male punch members, causing the punch members to strike the foil producing corresponding deformations in the foil, (b) thereafter selectively etching beams in the foil with one of the deformations at the end of each beam and (c) bonding the deformation to a semiconductor chip.
Claim 4
Dependent Claim
115 words
In a method for making a bumped-beam tape for tape bonding semiconductor chips to lead frames, ceramic chip carriers or hybrid substrates, the method employing a pilot punch to engage multiple registration holes on each edge of a substrate containing at least in part a thin copper or aluminum foil, the improvement comprising (a) positioning the foil with the pilot punch in a forming die having a predetermined array of male punch members, causing the punch members to strike the foil producing corresponding deformations in the foil, (b) thereafter selectively etching beams in the foil with one of the deformations at the end of each beam and (c) bonding the deformation to a semiconductor chip.
Claim 5
Dependent Claim
113 words
In a method for making a bumped-beam tape for tape bonding semiconductor chips to lead frames, ceramic chip carriers or hybrid substrates, the method employing a pilot punch to engage multiple registration holes on each edge of a substrate containing at least in part a thin copper or aluminum foil, the improvement comprising (a) selectively etching multiple beams in the foil, (b) thereafter positioning the etched foil with the pilot punch in a forming die having a predetermined array of male punch members and causing the punch members to strike the foil producing corresponding deformations in the foil at the ends of each beam and (c) bonding the deformations to a semiconductor chip.
Claim 6
Dependent Claim
113 words
In a method for making a bumped-beam tape for tape bonding semiconductor chips to lead frames, ceramic chip carriers or hybrid substrates, the method employing a pilot punch to engage multiple registration holes on each edge of a substrate containing at least in part a thin copper or aluminum foil, the improvement comprising (a) selectively etching multiple beams in the foil, (b) thereafter positioning the etched foil with the pilot punch in a forming die having a predetermined array of male punch members and causing the punch members to strike the foil producing corresponding deformations in the foil at the ends of each beam and (c) bonding the deformations to a semiconductor chip.
Claim 7
Independent Claim
37 words
The method according to claims 2 or 3 wherein the foil is adhesively bonded to a polyester or polyimide film to form the substrate and the film is etched to provide registration holes and a personality hole.
Claim 8
Independent Claim
38 words
The method according to claims 2 or 3 wherein the foil is adhesively bonded to a polyester, polyimide or epoxy-glass film to form the substrate and the film is prepunched to provide registration holes and a personality hole.
Claim 9
Independent Claim
37 words
The method according to claims 2 or 3 wherein a liquid polyimide is cast onto the copper or aluminum foil to form the substrate and the polyimide is etched to provide registration holes and a personality hole.
Claim 10
Independent Claim
27 words
The method according to claims 2 or 3 wherein copper is plated onto a polyimide, polyester or epoxy-glass film having prepunched registration holes to form the substrate.
Claim 11
Independent Claim
35 words
The method according to claims 2 or 3 wherein copper is plated onto a polyimide or polyester film to form the substrate and the film is etched to form registration holes and a personality hole.
Claim 12
Independent Claim
17 words
The method according to claims 2 or 3 wherein the deformations are plated with a nobel metal.
Claim 13
Independent Claim
17 words
The method according to claims 2 or 3 wherein the foil is plated with a nobel metal.
Claim 14
Independent Claim
15 words
The method according to claims 2 or 3 wherein the deformations are plated with gold.
Claim 15
Independent Claim
15 words
The method according to claims 2 or 3 wherein the foil is plated with gold.
Claim 16
Independent Claim
13 words
The method according to claims 2 or 3 wherein the foil is copper.
Claim 17
Independent Claim
13 words
The method according to claims 2 or 3 wherein the foil is aluminum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-08-01 | 1987-01-31 | 1987-08-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-08-01 | 1991-01-31 | 1991-08-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-08-01 | 1995-01-31 | 1995-08-02 | $7700.00 | Window Closed / Lapsed |