US4399006A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Silver plating
Assignee: Shipley Co Inc
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Filing: 1979-07-19
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Granted: 1983-08-16
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Expires: 1999-07-19
Abstract
Abstract The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
Inventors
- 👤 Fred I. Nobel
- 👤 William Brasch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:26
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/46; C25D5/00; C25D5/34
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
121 words
A process for the electrodeposition of silver on a conductive copper or copper alloy substrate which comprises as a step of said process strike plating the substrate in the areas desired to be electroplated with a silver strike solution containing less than about 5 g/l of silver metal in the form of an alkali silver thiosulfate complex, free thiosulfate, and a mercaptan in an amount sufficient to prevent or retard silver deposition by immersion on the substrate and, as a further step of said process, subsequently electroplating the strike plated areas of the substrate by electrodeposition of silver thereon to the desired thickness from an electrodeposition bath solution which contains higher amounts of silver than are contained in the strike solution.
Claim 2
Dependent Claim
121 words
A process for the electrodeposition of silver on a conductive copper or copper alloy substrate which comprises as a step of said process strike plating the substrate in the areas desired to be electroplated with a silver strike solution containing less than about 5 g/l of silver metal in the form of an alkali silver thiosulfate complex, free thiosulfate, and a mercaptan in an amount sufficient to prevent or retard silver deposition by immersion on the substrate and, as a further step of said process, subsequently electroplating the strike plated areas of the substrate by electrodeposition of silver thereon to the desired thickness from an electrodeposition bath solution which contains higher amounts of silver than are contained in the strike solution.
Claim 3
Dependent Claim
16 words
The process of claim 1 in which the mercaptan is thiolactic acid, thiomalic acid or thioglycerol.
Claim 4
Dependent Claim
16 words
The process of claim 1 wherein the silver strike solution is substantially free of free cyanide.
Claim 5
Dependent Claim
74 words
The process of electrodepositing silver on a copper or copper alloy conductive substrate which comprises as a step of said process treating the substrate with a mercaptan compound in the absence of a silver compound, and as a subsequent step of said process electroplating silver thereover with a silver cyanide plating solution containing 10 g/l of free cyanide or less or a silver thiosulfate plating solution containing 5 g/l of silver metal or less.
Claim 6
Dependent Claim
74 words
The process of electrodepositing silver on a copper or copper alloy conductive substrate which comprises as a step of said process treating the substrate with a mercaptan compound in the absence of a silver compound, and as a subsequent step of said process electroplating silver thereover with a silver cyanide plating solution containing 10 g/l of free cyanide or less or a silver thiosulfate plating solution containing 5 g/l of silver metal or less.
Claim 7
Dependent Claim
20 words
The process of claim 4 in which the mercaptan compound is a mercapto derivative of polyglycol or an organic acid.
Claim 8
Dependent Claim
17 words
The process of claim 4 in which the mercaptan compound is thiomalic acid, thioglycerol or thiolactic acid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-08-15 | 1987-02-14 | 1987-08-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-08-15 | 1991-02-14 | 1991-08-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-08-15 | 1995-02-14 | 1995-08-16 | $7700.00 | Window Closed / Lapsed |