Method for fabrication of electroscopic display devices and transmissive display devices fabricated thereby

Claim 1

An information display device, comprising: first and second substantially transparent substrates, each having an interior surface spaced from and facing the interior surface of the other substrate; at least one conductive electrode fabricated upon the interior surface of a first one of said substrates; a conductive electrode fabricated directly upon the interior surface of the second one of said substrates and comprising at least one support portion directly attached to the second substrate interior surface, at least one plate portion having a substantially circular periphery and at least one sector-shaped aperture formed therethrough within said periphery, and a plurality of arcuate spring arms each having a first end attached to a point on the periphery of an associated plate portion substantially equally spaced from adjacent spring arm attachment points and having a second end connected to an associated fixed support portion for mechanically biasing said plate portion toward said second substrate interior surface; said plate portion being adapted for movement, against the force of said arcuate spring arms, toward said electrode fabricated upon said first substrate interior surface, responsive to the coupling of a potential between the electrodes on the interior surface of said first and second substrates, and with the position of each of said at least one sector-shaped apertures rotating about a plate portion center as said plurality of arcuate spring arms are flexed by movement of said plate portion toward and away from said second substrate interior surface; and a multiplicity of reflective members each fixed to said second substrate interior surface and positioned such that light entering said display through said second substrate and reflected from that surface of said plate portion closest to said second substrate, when said plate portion is electrostatically moved closest to said first substrate electrode, is reflected from said fixed reflective members through said plate portion apertures and said first substrate and the electrode thereon.

Claim 7

A method for fabricating a perforated conductive plate moveably positionable with respect to a surface of a substrate, and having spring members attached between the periphery of the plate and at least one fixed mounting portion mounted upon the substrate surface, comprising the steps of: providing the substrate of a preselected material; fabricating at least one layer of an etchable material directly upon the substrate surface, said at least one layer having a surface furthest from the substrate surface; fabricating upon the at least one layer furthest surface a layer of a masking material having apertures therethrough positioned at locations at which the plate, spring members and mounting portions are to be located; fabricating, within the apertures of the masking layer, a topmost layer of a relatively etch-resistant conductive material; removing the masking material; etching the at least one etchable material layer away at least between the plate and spring member portions of the topmost layer and said substrate surface; and preventing etching of at least a support pillar of said at least one etchable material layer, between the substrate surface and each of the fixed mounting portions.

Claim 8

A method for fabricating a perforated conductive plate moveably positionable with respect to a surface of a substrate, and having spring members attached between the periphery of the plate and at least one fixed mounting portion mounted upon the substrate surface, comprising the steps of: providing the substrate of a preselected material; fabricating at least one layer of an etchable material directly upon the substrate surface, said at least one layer having a surface furthest from the substrate surface; fabricating upon the at least one layer furthest surface a layer of a masking material having apertures therethrough positioned at locations at which the plate, spring members and mounting portions are to be located; fabricating, within the apertures of the masking layer, a topmost layer of a relatively etch-resistant conductive material; removing the masking material; etching the at least one etchable material layer away at least between the plate and spring member portions of the topmost layer and said substrate surface; and preventing etching of at least a support pillar of said at least one etchable material layer, between the substrate surface and each of the fixed mounting portions.