US4458746A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optimum surface contour for conductive heat transfer with a thin flexible workpiece
Assignee: Varian Semiconductor Equipment Associates Inc
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Filing: 1982-05-25
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Granted: 1984-07-10
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Expires: 2002-05-25
Abstract
Abstract For enhanced heat conductive transfer from a semiconductor wafer during ion implantation, the wafer is clamped to a platen having a contour f(r,θ) computed to establish uniform contact pressure over said wafer for a number, n, of discrete clamping locii distributed along the periphery of the wafer. The available area of the wafer is thus maximized.
Inventors
- 👤 Scott C. Holden
- 👤 Peter R. Hanley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 21:47
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7604; H10P72/7606; H01; H01J; H01J37/00; H01J37/30; H01J37/317; H10P72/7611
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
91 words
Apparatus for removal of heat from a thin flexible disk under irradiation by a radiation source, said apparatus comprising: heat sink means for removal of heat transferred thereto from said disk, said heat sink means including a nonplanar contact surface; and means for clamping said disk to said contact surface at a number of discrete locations distributed along the periphery of said contact surface such that said disk conforms to said contact surface, said contact surface having a contour which imposes uniformity of contact pressure over the surface of said disk.
Claim 2
Dependent Claim
91 words
Apparatus for removal of heat from a thin flexible disk under irradiation by a radiation source, said apparatus comprising: heat sink means for removal of heat transferred thereto from said disk, said heat sink means including a nonplanar contact surface; and means for clamping said disk to said contact surface at a number of discrete locations distributed along the periphery of said contact surface such that said disk conforms to said contact surface, said contact surface having a contour which imposes uniformity of contact pressure over the surface of said disk.
Claim 3
Dependent Claim
50 words
The apparatus as defined in claim 1 wherein said means for clamping secures said disk to said contact surface with a clamping force which cooperates with said contact surface to produce a tensile stress component at the outer surface of said disk which tensile stress component approaches the elastic limit.
Claim 4
Dependent Claim
21 words
The apparatus as defined in claim 1 further including a compliant layer located between said flexible disk and said contact surface.
Claim 5
Dependent Claim
15 words
The apparatus as defined in claim 1 wherein said flexible disk comprises a semiconductor wafer.
Claim 6
Dependent Claim
28 words
The apparatus as defined in claim 4 wherein said wafer is clamped to said contact surface at three locations equally spaced along the periphery of said contact surface.
References Cited (Backward Citations)
US3920233A
Cited
US4282924A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-10 | 1988-01-09 | 1988-07-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-10 | 1992-01-09 | 1992-07-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-10 | 1996-01-09 | 1996-07-10 | $7700.00 | Window Closed / Lapsed |