US4466852A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for demounting wafers
Assignee: AT&T Inc
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Filing: 1983-10-27
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Granted: 1984-08-21
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Expires: 2003-10-27
Abstract
Abstract Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).
Inventors
- 👤 Richard K. Beltz
- 👤 Donald M. Large
- 👤 Daniel D. Leffel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:39
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/34; B24B37/345; Y; Y10; Y10S; Y10S134/00; Y10S134/902; Y10S156/00; Y10S156/918; Y10S156/93; Y10T; Y10T156/00; Y10T156/11; Y10T156/19; Y10T29/00; Y10T29/49; Y10T29/49815; Y10T29/49821
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
50 words
A method of demounting a wafer from an adherent surface, comprising: applying, via a passageway through the adherent surface, to and between the adherent surface and a mounting surface of the wafer, a fluid with sufficient pressure to dislodge the wafer; and removing the dislodged wafer from the adherent surface.
Claim 2
Independent Claim
50 words
A method of demounting a wafer from an adherent surface, comprising: applying, via a passageway through the adherent surface, to and between the adherent surface and a mounting surface of the wafer, a fluid with sufficient pressure to dislodge the wafer; and removing the dislodged wafer from the adherent surface.
Claim 3
Independent Claim
67 words
A method of demounting a wafer from an adherent surface, comprising: extending a passageway from fluid supply means, through the adherent surface to and in communication with, a mounting surface of the wafer; and applying fluid via a passsageway through the adherent surface to and between the mounting surface of the wafer and the adherent surface with sufficient pressure to dislodge the wafer from the adherent surface.
Claim 4
Independent Claim
67 words
A method of demounting a wafer from an adherent surface, comprising: extending a passageway from fluid supply means, through the adherent surface to and in communication with, a mounting surface of the wafer; and applying fluid via a passsageway through the adherent surface to and between the mounting surface of the wafer and the adherent surface with sufficient pressure to dislodge the wafer from the adherent surface.
Claim 5
Dependent Claim
35 words
A method as in claim 2 wherein the adherent surface is provided on a compressible pad on a wafer carrier further comprising: extending the passageway through the pad to the mounting surface of the wafer.
Claim 6
Dependent Claim
50 words
A method as in claim 3 wherein the step of extending the passageway further includes: extending the passageway through the adherent surface at a location between about the center and the periphery of the mounting surface of a wafer such that the fluid is initially applied off-center of the wafer.
Claim 7
Dependent Claim
51 words
A method as in claim 4 wherein the applying step further comprises: applying a liquid with sufficient pressure to dislodge the wafer but with insufficient pressure to fully disengage the wafer from the carrier such that the wafer rides upon a liquid film on a surface and is readily removed therefrom.
Claim 8
Dependent Claim
63 words
A method as in claim 5 wherein the applying step further comprises: applying the liquid with supply means including a nozzle which penetrates through the passageway a distance sufficient to push the wafer off the liquid film; and extending said nozzle through the passageway and against the wafer a distance sufficient to push the wafer off the liquid film and off the carrier.
Claim 9
Dependent Claim
15 words
A method as in claim 4 wherein the fluid applied via the passageway is water.
Claim 10
Dependent Claim
15 words
A method as in claim 4 wherein the fluid applied via the passageway is air.
Claim 11
Dependent Claim
65 words
Apparatus for demounting a wafer from an adherent surface comprising: a passageway extending from fluid supply means, through the adherent surface to and in communication with a mounting surface of the wafer; and means for applying the fluid via the passageway to and between the mounting surface of the wafer and the adherent surface with sufficient pressure to dislodge the wafer from the adherent surface.
Claim 12
Dependent Claim
65 words
Apparatus for demounting a wafer from an adherent surface comprising: a passageway extending from fluid supply means, through the adherent surface to and in communication with a mounting surface of the wafer; and means for applying the fluid via the passageway to and between the mounting surface of the wafer and the adherent surface with sufficient pressure to dislodge the wafer from the adherent surface.
Claim 13
Dependent Claim
42 words
Apparatus as in claim 9 wherein the adherent surface is on a wafer carrier and is provided by the surface of an at least partially compressible pad further comprising: the passageway extending through the pad to the mounting surface of the wafer.
Claim 14
Dependent Claim
49 words
Apparatus as in claim 10 wherein the passageway further includes: the passageway extending through the adherent surface at a location between about the center and the periphery of the mounting surface of a wafer such that the fluid is initially applied off-center of the wafer in a leveraged manner.
Claim 15
Dependent Claim
56 words
Apparatus as in claim 11 wherein the means for applying the fluid further comprises: means for applying a liquid with sufficient pressure to dislodge the wafer but with insufficient pressure to fully disengage the wafer from the carrier such that the wafer rides upon a liquid film on the adherent surface and is readily removed therefrom.
Claim 16
Dependent Claim
60 words
Apparatus as in claim 12 wherein the means for applying the liquid further comprises: a nozzle which penetrates through the passageway a distance sufficient to push the wafer off the liquid film; and means for extending said nozzle through the passageway and against the wafer a distance sufficient to push the wafer off the liquid film and off the carrier.
Claim 17
Dependent Claim
14 words
Apparatus as in claim 11 wherein the fluid applied via the passageway is water.
Claim 18
Dependent Claim
14 words
Apparatus as in claim 11 wherein the fluid applied via the passageway is air.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-08-21 | 1988-02-20 | 1988-08-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-08-21 | 1992-02-20 | 1992-08-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-08-21 | 1996-02-20 | 1996-08-21 | $7700.00 | Window Closed / Lapsed |