US4468296A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for electroplating palladium
Assignee: Nokia of America Corp
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Filing: 1982-12-10
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Granted: 1984-08-28
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Expires: 2002-12-10
Abstract
Abstract The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form of and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.
Inventors
- 👤 Joseph A. Abys
- 👤 Yutaka Okinaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 02:17
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/50; C25D3/52
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
93 words
A process for electroplating a metallic substance on a surface, said metallic substance comprising palladium comprising the step of passing current through a cathode, an electroplating bath, said electroplating bath comprising palladium complexed with at least one aliphatic polyamine with 3-20 carbon atoms, and an anode with cathode potential great enough to electroplate palladium, said electroplating bath having conductivity greater than 10 -3 mho-cm and said electroplating bath comprising a source of palladium characterized in that at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide.
Claim 2
Dependent Claim
93 words
A process for electroplating a metallic substance on a surface, said metallic substance comprising palladium comprising the step of passing current through a cathode, an electroplating bath, said electroplating bath comprising palladium complexed with at least one aliphatic polyamine with 3-20 carbon atoms, and an anode with cathode potential great enough to electroplate palladium, said electroplating bath having conductivity greater than 10 -3 mho-cm and said electroplating bath comprising a source of palladium characterized in that at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide.
Claim 3
Dependent Claim
39 words
The process of claim 1 in which the palladium ammine hydroxide is added as a solid comprising a palladium diammine hydroxide with nominal formula (Pd)(NH 3 ) 2 OH) n (OH) n where n varies from 1 to 6.
Claim 4
Dependent Claim
52 words
The process of claim 1 in which the palladium ammine hydroxide is added in the form of an aqueous solution comprising at least one palladium ammine hydroxide with nominal formula (Pd(NH 3 ) x OH) n (OH) n where n varies from 1 to 6 and x varies from 2 to 4.
Claim 5
Dependent Claim
15 words
The process of claim 1 in which the electroplating bath comprises palladium complexed with ammonia.
Claim 6
Dependent Claim
21 words
The process of claim 1 in which the palladium is complexed with at least one aliphatic diamine with 3-10 carbon atoms.
Claim 7
Dependent Claim
13 words
The process of claim 5 in which the palladium is complexed with 1,3-diaminopropane.
Claim 8
Dependent Claim
17 words
The process of claim 1 in which the concentration of palladium is between 0.01 molar and saturation.
Claim 9
Dependent Claim
17 words
The process of claim 7 in which the concentration of palladium is between 0.05 and 1.0 molar.
Claim 10
Dependent Claim
27 words
The process of claim 7 in which the concentration of aliphatic polyamine is between 0.5 times the molar concentration of palladium to the saturation of aliphatic polyamine.
Claim 11
Dependent Claim
24 words
The process of claim 9 in which the molar concentration of aliphatic polyamine is between 2 and 12 times the mole concentration of palladium.
Claim 12
Dependent Claim
20 words
The process of claim 1 in which the temperature of the electroplating bath is between 40 and 60 degrees C.
Claim 13
Dependent Claim
17 words
The process of claim 1 in which the pH of the electroplating bath is greater than 7.
Claim 14
Dependent Claim
18 words
The process of claim 12 in which the pH of the electroplating bath is between 7.5 and 13.5.
Claim 15
Dependent Claim
18 words
The process of claim 13 in which the pH of the electroplating solution is between 9.0 and 12.5.
Claim 16
Dependent Claim
13 words
The process of claim 1 in which the electroplating solution comprises a buffer.
Claim 17
Dependent Claim
13 words
The process of claim 15 in which the buffer is a phosphate buffer.
Claim 18
Dependent Claim
16 words
The process of claim 16 in which the buffer concentration is between 0.1 and 2 molar.
Claim 19
Dependent Claim
13 words
The process of claim 17 in which the buffer concentration is 1.0±0.2 molar.
Claim 20
Dependent Claim
17 words
The process of claim 1 in which the metallic substance is at least 10 mole percent palladium.
Claim 21
Dependent Claim
14 words
The process of claim 19 in which the metallic substance consists essentially of palladium.
References Cited (Backward Citations)
SU254293A1
Cited
US3925170A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-08-28 | 1988-02-27 | 1988-08-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-08-28 | 1992-02-27 | 1992-08-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-08-28 | 1996-02-27 | 1996-08-28 | $7700.00 | Window Closed / Lapsed |