US4478692A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrodeposition of palladium-silver alloys
Assignee: Shipley Co Inc
•
Filing: 1983-12-15
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Granted: 1984-10-23
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Expires: 2003-12-15
Abstract
Abstract Aqueous electroplating solutions for the electrodeposition of palladium-silver alloys comprising a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution and process for electrolytically plating palladium-silver alloys.
Inventors
- 👤 Fred I. Nobel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 07:15
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/567
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
73 words
An aqueous electroplating solution for the electrodeposition of palladium-silver alloys comprising a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution without the addition of chloride or bromide ions and to bring the plating potential of palladium and silver sufficiently close to enable the plating of palladium and silver simultaneously to produce an alloy deposit.
Claim 2
Dependent Claim
73 words
An aqueous electroplating solution for the electrodeposition of palladium-silver alloys comprising a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution without the addition of chloride or bromide ions and to bring the plating potential of palladium and silver sufficiently close to enable the plating of palladium and silver simultaneously to produce an alloy deposit.
Claim 3
Dependent Claim
28 words
The aqueous solution of claim 1 in which the palladium compound is palladium diamino dinitrite, palladium sulfate, palladium phosphate, a palladium organo sulfonate or a palladium organo phosphonate.
Claim 4
Dependent Claim
25 words
The aqueous solution of claim 2 which contains a sufficient amount of a nitrite salt to improve the current density range of the plating solution.
Claim 5
Dependent Claim
22 words
The aqueous solution of claim 3 which contains a palladium to silver ratio, as metal, of at least about 6 to 1.
Claim 6
Dependent Claim
20 words
The aqueous solution of claim 4 in which the strong acid is in excess of about 50 m/l or g/l.
Claim 7
Dependent Claim
22 words
The aqueous plating solution of claim 5 in which the strong acid is an organo phosphonic acid, sulfuric acid or phosphoric acid.
Claim 8
Dependent Claim
76 words
A process for electrolytically plating palladium-silver alloys which comprises electrolyzing an aqueous solution containing a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution without the addition of chloride or bromide irons and to bring the plating potential of palladium and silver sufficiently close to enable the plating of palladium and silver simultaneously to produce an alloy deposit.
Claim 9
Dependent Claim
76 words
A process for electrolytically plating palladium-silver alloys which comprises electrolyzing an aqueous solution containing a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution without the addition of chloride or bromide irons and to bring the plating potential of palladium and silver sufficiently close to enable the plating of palladium and silver simultaneously to produce an alloy deposit.
Claim 10
Dependent Claim
26 words
The process according to claim 7 in which the palladium compound is palladium diamino dinitrite, palladium sulfate, palladium phosphate, a palladium phosphonate or a palladium sulfonate.
Claim 11
Dependent Claim
29 words
The process according to claim 8 in which the electrolytic solution contains a sufficient amount of a nitrite salt to improve the current density range of the plating solution.
Claim 12
Dependent Claim
22 words
The process according to claim 8 in which the palladium to silver ratio, as metal, is at least about 6 to 1.
Claim 13
Dependent Claim
20 words
The process according to claim 10 in which the strong acid is in excess of about 50 ml/l or g/l.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-10-23 | 1988-04-23 | 1988-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-10-23 | 1992-04-23 | 1992-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-10-23 | 1996-04-23 | 1996-10-23 | $7700.00 | Window Closed / Lapsed |