US4485234A
Expired / Lapsed
US
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Method of preparing polyamide acid for processing of semiconductors
Assignee: Resonac Corp
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Filing: 1984-02-15
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Granted: 1984-11-27
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Expires: 2004-02-15
Abstract
Abstract An improved method of preparing polyamide acid for processing of semiconductors from a diamine and a tetracarboxylic acid dianhydride with a diaminocarbonamide, is provided (1) by reacting the components at below 40 DEG C. until the reduced viscosity reaches above 0.5 dl/g. at 30 DEG C., and then, (2) by adjusting the reduced viscosity to more than 0.3 dl/g, at 30 DEG 0 C. and the solution viscosity to 500-3,000 cps at 25 DEG C. by heating at 50 DEG -100 DEG C. By applying the polyamide acid obtained by the method to semiconductor apparatus, they get sufficient heat-resistance without pin holes, and their reliability may be greatly improved.
Inventors
- 👤 Daisuke Makino
- 👤 Yasuo Miyadera
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 03:18
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1003; C08G73/1007; C08G73/1028; H10P14/63; H10P14/6326; H10P14/6342
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
207 words
A method of preparing polyamide acid useful for processing of semi-conductors from (i) at least one diamine and (ii) a tetracarboxylic acid dianhydride and a diaminocarbonamide in an inert solvent, which comprises the steps of (1) reacting (i) at least one diamine and (ii) at least one tetracarboxylic acid dianhydride and at least one diaminocarbonamide, at a temperature below 40° C. to form a polyamide acid having a reduced viscosity above 0.5 dl/g at 30° C., and (2) heating said polyamide acid in an inert solvent at a temperature between 50° C. and 100° C. to lower the viscosity of said polyamide acid whereby the reduced viscosity of said polyamide acid is more than 0.3 dl/g at 30° C. and the solution viscosity of said polyamide acid in the inert solvent is 500 to 3,000 centipoises at 25° C., the reduced viscosity being measured by forming a 0.1 dl/g solution of said polyamide acid in dimethylsulfoxide and measuring the viscosity of the solution with a Ubbelohde's viscometer in accordance with Japanese Industrial Standard K 5400, and the solution viscosity being measured by measuring the viscosity of the solution of said polyamide acid in dimethylsulfoxide with a Brookfield type viscometer in accordance with Japanese Industrial Standard K 6901.
Claim 2
Independent Claim
207 words
A method of preparing polyamide acid useful for processing of semi-conductors from (i) at least one diamine and (ii) a tetracarboxylic acid dianhydride and a diaminocarbonamide in an inert solvent, which comprises the steps of (1) reacting (i) at least one diamine and (ii) at least one tetracarboxylic acid dianhydride and at least one diaminocarbonamide, at a temperature below 40° C. to form a polyamide acid having a reduced viscosity above 0.5 dl/g at 30° C., and (2) heating said polyamide acid in an inert solvent at a temperature between 50° C. and 100° C. to lower the viscosity of said polyamide acid whereby the reduced viscosity of said polyamide acid is more than 0.3 dl/g at 30° C. and the solution viscosity of said polyamide acid in the inert solvent is 500 to 3,000 centipoises at 25° C., the reduced viscosity being measured by forming a 0.1 dl/g solution of said polyamide acid in dimethylsulfoxide and measuring the viscosity of the solution with a Ubbelohde's viscometer in accordance with Japanese Industrial Standard K 5400, and the solution viscosity being measured by measuring the viscosity of the solution of said polyamide acid in dimethylsulfoxide with a Brookfield type viscometer in accordance with Japanese Industrial Standard K 6901.
Claim 3
Dependent Claim
75 words
The method of claim 1, wherein the reaction of said diamine to form said polyamide acid is carried out until said reduced viscosity at 30° C. reaches above 0.7 dl/g in the first step of said method, and wherein said polyamide acid is heated to lower the reduced viscosity to between 0.35 and 0.45 dl/g and the solution viscosity to between 800 and 1,500 centipoises at 25° C. in said second step of said method.
Claim 4
Dependent Claim
110 words
The method of claim 2, wherein said diamine is selected from the group consisting of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, benzidine, m-phenylene-diamine, p-phenylenediamine, 1,5-naphthalenediamine and 2,6-naphthalenediamine; said tetracarboxylic acid dianhydride is selected from the group consisting of pyromellitic acid dianhydride, 3,3'4,4'-diphenyltetracarboxylic acid dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, cyclopentanetetracarboxylic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 2,3,5,6-pyridinetetracarboxylic acid dianhydride, 1,4,5,8-naphthalenetetracarboxylic acid dianhydride, 3,4,9,10-perylenetetracarboxylic acid dianhydride and 4,4'-sulfonyldiphthalic acid dianhydride; and said diaminocarbonamide is selected from the group consisting of 4,4'-diaminodiphenyl ether-3-carbonamide, 3,4'-diaminodiphenyl ether-4-carbonamide, 3,4-diaminodiphenyl ether-3'-carbonamide, 3,3'-diaminodiphenyl ether-4-carbonamide, 4,4'-diaminodiphenylmethane-3-carbonamide, 3,4'-diaminodiphenylmethane-4-carbonamide, 3,4'-diaminodiphenylmethane-3'-carbonamide, 3,3'-diaminodiphenylmethane-4-carbonamide, 4,4'-diaminodiphenyl sulfone-3-carbonamide, 3,4'-diaminodiphenyl sulfone-4-carbonamide, 3,4'-diaminodiphenyl sulfone-3'-carbonamide, 3,3'-diaminodiphenyl sulfone-4-carbonamide, 4,4'-diaminodiphenyl sulfide-3-carbonamide, 3,4'-diaminodiphenyl sulfide-4-carbonamide, 3,3'-diaminodiphenyl sulfide-4-carbonamide, 3,4'-diaminodiphenyl sulfide-3'-carbonamide and 1,4-diaminobenzene-2-carbonamide.
Claim 5
Dependent Claim
22 words
The method of claim 2, wherein 4,4'-diaminodiphenylether, 4,4'-diaminodiphenylether-3-carbonamide, pyromellitic acid dianhydride and 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride are reacted in the reaction step (1).
Claim 6
Dependent Claim
10 words
The polyamide acid produced by the process of claim 2.
Claim 7
Dependent Claim
10 words
The polyamide acid produced by the process of claim 3.
Claim 8
Dependent Claim
10 words
The polyamide acid produced by the process of claim 4.
References Cited (Backward Citations)
US4447596A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-11-27 | 1988-05-28 | 1988-11-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-11-27 | 1992-05-28 | 1992-11-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-11-27 | 1996-05-28 | 1996-11-27 | $7700.00 | Window Closed / Lapsed |