Duplex metal alloy/polymer compositions

Claim 2

A duplex metal/organic polymer multilayer composite structure, the structure comprising: (a) at least one normally solid, formable thermoplastic polymer layer, said polymer layer having a forming temperature in degrees Kelvin, a first planar surface and a second planar surface, the first and second planar surfaces being generally parallel to each other; (b) a first normally solid metal layer, the first metal layer being intimately adhered to at least one planar surface of the polymer layer, said first metal layer being formed from an alloy of two or more metals, said first metal layer having a thickness within the range of from 0.01 micrometers to 0.5 micrometers, the alloy melting at a temperature, or over a range of temperatures, that is within a temperature range of from about 85 to about 150 percent of the forming temperature of the thermoplastic polymer layer, said temperatures being in degrees Kelvin, and (c) a second normally solid metal layer, the second metal layer being intimately adhered to the first metal layer, said second metal layer being formed from a metal or an alloy of two or more metals that melts at a temperature, or over a range of temperatures, which is lower than that at which, or over which, melting of the metal alloy of the first metal layer occurs, said temperatures being in degrees Kelvin.

Claim 3

The composite of claim 1 wherein the alloy of the first metal layer has a solidus temperature which is within a range of from about 85 to about 98 percent of the forming temperature of the thermoplastic polymer layer and a liquidus temperature which is within a range of from about 102 to about 150 percent of the forming temperature of the thermoplastic polymer layer, said temperatures being in degrees Kelvin.

Claim 4

The composite of claim 1 wherein the alloy of the first metal layer is an alloy containing two or more metals selected from the group consisting of cadmium, indium, tin, antimony, lead, bismuth, or zinc.

Claim 5

The composite of claim 3 wherein the alloy also contains copper in an amount of from about 5 to about 40 percent by weight of alloy.

Claim 6

The composite of claim 3 wherein the alloy also contains silver in an amount of from about 5 to about 75 percent by weight of alloy.

Claim 7

The composite of claim 1 wherein the second metal layer is formed from an alloy of two or more metals selected from the group consisting of cadmium, indium, tin, antimony, lead, bismuth and zinc.

Claim 8

The composite of claim 6 wherein the second metal layer has a solidus temperature, a liquidus temperature and a eutectic temperature.

Claim 9

The composite of claim 1 wherein the second metal layer is formed from an eutectic binary alloy selected from the group consisting of tin-lead, lead-bismuth, lead-tin, bismuth-tin, bismuth-cadmium, bismuth-indium, cadmium-indium, cadmium-zinc, and cadmium-tin alloys.

Claim 10

The composite of claim 1 wherein the thermoplastic polymer layer is selected from the group consisting of polycarbonates, polyesters, acrylic resins, monovinylidene aromatic polymers, vinyl halide polymers, vinylidene halide polymers, or polyacetals.

Claim 11

The composite structure of claim 1 wherein the first and second metal layers are in such a proportional relationship with respect to each other that, when taken together and heated to a specific temperature, they comprise a segregated metal alloy of two or more metals, the specific temperature being (1) between the solidus temperature and the liquidus temperature of the first metal layer and (2) greater than the liquidus temperature of the second metal layer, the segregated metal alloy having a melting temperature or melting temperature range, that is within a temperature range of from about 80 to about 135 percent of the forming temperature of the thermoplastic polymer, said temperatures being in degrees Kelvin.

Claim 12

The composite of claim 10 wherein the metal of the first metal layer has a solidus temperature which is within a temperature range of from about 85 to about 98 percent of the forming temperature of the thermoplastic polymer and a liquidus temperature which is within a temperature range of from about 102 to about 150 percent of the forming temperature of the thermoplastic polymer, said temperatures being in degrees Kelvin, and the second metal layer has a liquidus temperature which is less than the liquidus temperature of the first metal layer.

Claim 13

The composite of claim 10 wherein the first metal layer is of such a composition and proportion relative to the second metal layer that intermetallic phases formed by interaction between the metal layers do not increase the liquidus temperature of the second metal layer beyond 135 percent of the forming temperature of the thermoplastic polymer layer, said temperatures being in degrees Kelvin.

Claim 14

The composite of claim 7 wherein the first metal layer is of such a composition and proportion relative to the second metal layer that intermetallic phases formed by interaction between the metals layers do not increase the liquidus temperature of the second metal layer by more than 30 degrees Kelvin above the eutectic temperature of the second metal layer.

Claim 15

The composite of claim 13 wherein the metal of the second metal layer is at least 75 weight percent liquid, based on weight of said second metal layer, at a temperature which is not more than 25 degrees Kelvin above said second metal layer's eutectic temperature.

Claim 16

The composite of claim 14 wherein the metal of the second metal layer is an alloy which comprises at least 30 weight percent tin and at least 40 weight percent bismuth, both percentages being based upon weight of alloy.

Claim 17

A duplex metal/organic polymer multilayer composite structure, the structure comprising: (a) at least one normally solid, formable thermoplastic polymer layer, said polymer layer having a forming temperature in degrees Kelvin, a first planar surface and a second planar surface, the first and second planar surfaces being generally parallel to each other; (b) a first normally solid metal layer, the first metal layer being intimately adhered to at least one planar surface of the polymer layer, the metal layer having a thickness within the range of from 0.01 micrometers to 0.5 micrometers, said metal layer being formed from one normally solid metal selected from the group consisting of copper, silver, nickel and manganese; and (c) a second normally solid metal layer, the second metal layer being intimately adhered to the first metal layer, the second metal layer being formed from a metal or an alloy of two or more metals, said second metal layer being in such a proportional relationship with respect to the first metal layer that the two metal layers, when taken together and heated to the forming temperature of the polymer layer, comprise a segregated alloy of at least two metals, the segregated alloy having a melting temperature or melting temperature range that is within a temperature range of from about 80 to about 135 percent of the forming temperature of the polymer layer, said temperatures being in degrees Kelvin.

Claim 18

A duplex metal/organic polymer multilayer composite structure, the structure comprising: (a) at least one normally solid, formable thermoplastic polymer layer, said polymer layer having a forming temperature in degrees Kelvin, a first planar surface and a second planar surface, the first and second planar surfaces being generally parallel to each other; (b) a first normally solid metal layer, the first metal layer being intimately adhered to at least one planar surface of the polymer layer, the metal layer having a thickness within the range of from 0.01 micrometers to 0.5 micrometers, said metal layer being formed from one normally solid metal selected from the group consisting of copper, silver, nickel and manganese; and (c) a second normally solid metal layer, the second metal layer being intimately adhered to the first metal layer, the second metal layer being formed from a metal or an alloy of two or more metals, said second metal layer being in such a proportional relationship with respect to the first metal layer that the two metal layers, when taken together and heated to the forming temperature of the polymer layer, comprise a segregated alloy of at least two metals, the segregated alloy having a melting temperature or melting temperature range that is within a temperature range of from about 80 to about 135 percent of the forming temperature of the polymer layer, said temperatures being in degrees Kelvin.