Two-part epoxy composition

Claim 2

An epoxy resin composition comprising: a. a curable epoxide group-containing compound having one or more oxirane groups, b. in-situ polymerized, colloidally-dispersed, elastomeric particles insoluble in said epoxide group-containing compound, said elastomeric particles comprising a polymer having a glass transition temperature of 25° C. or less and is selected from polymers derived from at least one of (1) ethylenically-unsaturated group-containing monomers and (2) diisocyanates and coreactive difunctional compounds that are curable to elastomeric compounds, and c. a poly(oxyhydrocarbolene)diamine compound as curing agent.

Claim 3

The epoxy resin composition according to claim 1 wherein said composition, when tested by the "APS" Test, provides a bond that has a T-Peel strength at -55° C. of at least 40N/25 mm, T-Peel strength at 24° C. of at least 170N/25 mm, Lap Shear strength at 24° C. of at least 30 MPA, and Lap Shear strength at 82° C. of at least 2 MPa.

Claim 4

The composition according to claim 1 further comprising an epoxy composition curing agent as cocurative.

Claim 5

The composition according to claim 3 wherein said cocurative is present in an amount in the range of 0.05 to 20 mole percent of said curing agent.

Claim 6

A solventless, fluid two-part composition of matter capable of curing to an epoxy adhesive resin, said two-part composition disposed in a package with the parts of the composition stored in separate compartments in the package, said parts being capable of being mixed when the composition is to be applied, comprising: a. in one part (1) a curable composition of matter comprising: (a) 0.75 to 1.0 part by weight of curable epoxide group-containing compound having one or more oxirane groups, and (b) 0.05 to 1.0 part by weight of colloidally dispersed elastomeric particles that are insoluble in the epoxide group-containing compound, comprising (i) 75 to 98 percent by weight of an elastomeric polymer of one or more monomers polymerized in situ in said epoxide group-containing compound, said polymer being insoluble in said epoxide group-containing compound, said polymer having a glass transition temperature of 25° C. or less and being selected from polymers derived from at least one of (1) ethylenically-unsaturated group-containing monomers and (2) diisocyanates and coreactive difunctional compounds that are curable to elastomeric compounds, and (ii) 25 to 2 percent by weight of a stabilizer having the formula PQ, in which Q is a polymeric segment that has a molecular weight of at least 1000 and is soluble in said epoxide group-containing and P is selected from (a) a functional group covalently attached to Q and also becomes attached to the elastomeric particle during particle growth by formation of a covalent or ionic bond with the elastomeric particle, and (b) a polymeric segment that has a molecular weight of at least 1000 and that becomes absorbed into the elastomeric particle because it is soluble in said elastomeric polymer of said monomer composition but insoluble in said epoxide group-containing compound, and b. in a second part (1) 0 to 0.25 part of said curable epoxide group-containing compound described under (a)(.1)(a) above, (2) a chemically effective amount of at least one epoxide curing agent comprising at least one poly(oxyhydrocarbolene)diamine having the formula: H.sub.2 N--RO(R.sup.1 O).sub.n RNH.sub.2 I wherein R is a linear or branched chain alkylene group having 2 to 4 carbon atoms, R 1 is an hydrocarbolene group having 2 to 8 carbon atoms selected from straight and branched chain alkylene groups having 2 to 4 carbon atoms, cycloalkylene groups having 4 to 8 carbons, and arene groups having 6 to carbon atoms, and n is a number having a value of 1 to 10 such that the number average molecular weight of said curing agent is from 17 to 750; and with the provisos (i) that when R 1 is a branched chain alkylene the value of n is at least 5, and (ii) that the ratio of said curable composition to said curing agent is such that there is present in the adhesive composition 0.75 to 1.1 equivalents of --NH group per equivalent of epoxide group and (3) optionally, a curing accelerator; and upon mixing, said composition being capable of providing as determined by the "APS" Test, a cured epoxy resin having T-Peel strength at -55° C. of at least 40N/25 mm, T-Peel strength at 24° C. of at least 170N/25 mm, Lap Shear strength at 24° C. of at least 30 MPa, and Lap Shear strength at 82° C. of at least 2 MPa.

Claim 7

A solventless, fluid two-part composition of matter capable of curing to an epoxy adhesive resin, said two-part composition disposed in a package with the parts of the composition stored in separate compartments in the package, said parts being capable of being mixed when the composition is to be applied, comprising: a. in one part (1) a curable composition of matter comprising: (a) 0.75 to 1.0 part by weight of curable epoxide group-containing compound having one or more oxirane groups, and (b) 0.05 to 1.0 part by weight of colloidally dispersed elastomeric particles that are insoluble in the epoxide group-containing compound, comprising (i) 75 to 98 percent by weight of an elastomeric polymer of one or more monomers polymerized in situ in said epoxide group-containing compound, said polymer being insoluble in said epoxide group-containing compound, said polymer having a glass transition temperature of 25° C. or less and being selected from polymers derived from at least one of (1) ethylenically-unsaturated group-containing monomers and (2) diisocyanates and coreactive difunctional compounds that are curable to elastomeric compounds, and (ii) 25 to 2 percent by weight of a stabilizer having the formula PQ, in which Q is a polymeric segment that has a molecular weight of at least 1000 and is soluble in said epoxide group-containing and P is selected from (a) a functional group covalently attached to Q and also becomes attached to the elastomeric particle during particle growth by formation of a covalent or ionic bond with the elastomeric particle, and (b) a polymeric segment that has a molecular weight of at least 1000 and that becomes absorbed into the elastomeric particle because it is soluble in said elastomeric polymer of said monomer composition but insoluble in said epoxide group-containing compound, and b. in a second part (1) 0 to 0.25 part of said curable epoxide group-containing compound described under (a)(.1)(a) above, (2) a chemically effective amount of at least one epoxide curing agent comprising at least one poly(oxyhydrocarbolene)diamine having the formula: H.sub.2 N--RO(R.sup.1 O).sub.n RNH.sub.2 I wherein R is a linear or branched chain alkylene group having 2 to 4 carbon atoms, R 1 is an hydrocarbolene group having 2 to 8 carbon atoms selected from straight and branched chain alkylene groups having 2 to 4 carbon atoms, cycloalkylene groups having 4 to 8 carbons, and arene groups having 6 to carbon atoms, and n is a number having a value of 1 to 10 such that the number average molecular weight of said curing agent is from 17 to 750; and with the provisos (i) that when R 1 is a branched chain alkylene the value of n is at least 5, and (ii) that the ratio of said curable composition to said curing agent is such that there is present in the adhesive composition 0.75 to 1.1 equivalents of --NH group per equivalent of epoxide group and (3) optionally, a curing accelerator; and upon mixing, said composition being capable of providing as determined by the "APS" Test, a cured epoxy resin having T-Peel strength at -55° C. of at least 40N/25 mm, T-Peel strength at 24° C. of at least 170N/25 mm, Lap Shear strength at 24° C. of at least 30 MPa, and Lap Shear strength at 82° C. of at least 2 MPa.

Claim 8

The composition according to claim 5 wherein said poly(oxyhydrocarbolene)diamine curing agent has the formula: H.sub.2 N--CH.sub.2 CH.sub.2 CH.sub.2 O--W--CH.sub.2 CH.sub.2 CH.sub.2 --NH.sub.2 wherein W is a divalent linking group selected from ##STR18## in which a is 1 to 5, and b is 4 to 10.

Claim 9

The composition according to claim 5 wherein said poly(oxyhydrocarbolene)diamine curing agent has the formula: H.sub.2 N--CH.sub.2 CH.sub.2 O(CH.sub.2 CH.sub.2 O).sub.c CH.sub.2 CH.sub.2 --NH.sub.2 wherein c is 4 to 10.

Claim 10

The composition according to claim 7 wherein said curing agent is selected from the class consisting of diethyleneglycoldipropionamine, triethyleneglycoldipropionamine, and tetraethyleneglycoldipropionamine.

Claim 11

The composition according to claim 5 wherein said curable epoxide group-containing compound is selected from the mono- and polyglycidyl ethers of (1) mono- and polyhydric alcohols and phenols, and (2) mono- and polyglycidyl esters of mono- and polycarboxylic acids that are fluid at a temperature below 50° C.

Claim 12

The composition according to claim 9 wherein said epoxide group-containing compound is a diglycidyl ether of bisphenol A.

Claim 13

The cured composition according to claim 5.

Claim 14

The composition according to claim 1 further comprising a curing accelerator.

Claim 15

The composition according to claim 12 wherein said curing accelerator is present in an amount of 0.05 to 15 weight percent based on the weight of the curing agent.

Claim 16

An article comprising a substrate and a layer of the cured composition according to claim 5 on at least one surface thereof.

Claim 17

A laminate comprising a layer of the cured composition according to claim 5 sandwiched between two substrates.

Claim 18

The composition according to claim 1 wherein said coreactive difunctional compound of paragraph (b)(.2) is a diol, diamine, or alkanolamine.

Claim 19

The two-part composition according to claim 5 wherein said coreactive difunctional compound of paragraph (a)(.1)(b)(i) is a diol, diamine, or alkanolamine.