US4529353A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer handling apparatus and method
Assignee: Nokia Bell Labs
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Filing: 1983-01-27
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Granted: 1985-07-16
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Expires: 2003-01-27
Abstract
Abstract Compact apparatus characterized by cleanliness of operation, high throughput and low cost is designed for automatically loading and unloading wafer-carrying trays that are designed to be mounted in the reaction chamber of a processing system. A key component of the apparatus comprises a unique wafer vacuum chuck.
Inventors
- 👤 Robert E. Dean
- 👤 Edward A. Dein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 00:29
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/78; B; B65; B65G; B65G47/00; B65G47/74; B65G47/90; B65G47/91; H10P72/30; H10P72/34; H10P72/3411; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/137; Y10S414/141
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
184 words
A method for handling wafers in a device fabrication sequence, said method comprising the steps of transporting a wafer active side up from a storage medium to an initial loading position, engaging the inactive side of the wafer with a first pickup device, transporting the wafer to a fixture, depositing the wafer in the fixture inactive side up, engaging the inactive side of the wafer with a second pickup device mounted on a transport stage, moving the transport stage to a position directly overlying a wafer-receiving aperture in a tray member, and, by means of said second-mentioned pickup device, inserting the wafer inactive side up into said aperture, wherein at least three spaced-apart spring-clip elements are mounted on said tray member peripherally disposed around the aperture for resiliently engaging a wafer, wherein said method further comprises the steps of by means of pistons mounted on said transport stage, retracting said spring-clip elements before the wafer is inserted into the aperture in said tray member, and, after insertion, disengaging the pistons from said spring-clip elements to allow the elements to resiliently engage the inserted wafer.
Claim 2
Independent Claim
184 words
A method for handling wafers in a device fabrication sequence, said method comprising the steps of transporting a wafer active side up from a storage medium to an initial loading position, engaging the inactive side of the wafer with a first pickup device, transporting the wafer to a fixture, depositing the wafer in the fixture inactive side up, engaging the inactive side of the wafer with a second pickup device mounted on a transport stage, moving the transport stage to a position directly overlying a wafer-receiving aperture in a tray member, and, by means of said second-mentioned pickup device, inserting the wafer inactive side up into said aperture, wherein at least three spaced-apart spring-clip elements are mounted on said tray member peripherally disposed around the aperture for resiliently engaging a wafer, wherein said method further comprises the steps of by means of pistons mounted on said transport stage, retracting said spring-clip elements before the wafer is inserted into the aperture in said tray member, and, after insertion, disengaging the pistons from said spring-clip elements to allow the elements to resiliently engage the inserted wafer.
Claim 3
Independent Claim
177 words
A method for handling wafers in a device fabrication sequence, said method comprising the steps of by means of a first pickup device mounted on a transport stage, engaging the inactive side of a wafer mounted in an aperture in a wafer-carrying tray member thereby removing the wafer from said tray member, moving the transport stage and the wafer engaged by the pickup device thereof to a position directly overlying a wafer-receiving fixture, depositing the wafer inactive side up in said fixture, engaging the inactive side of the wafer with a second pickup device, transporting the wafer to and depositing it active side up at a loading position, and moving the wafer by means of a conveyor from said loading position to a storage medium, wherein at least three spaced-apart spring-clip elements are mounted on said tray member peripherally disposed around the aperture for resiliently engaging said wafer, wherein said method further comprises the step of by means of pistons mounted on said transport stage, retracting said spring-clip elements before the wafer is removed from said tray.
Claim 4
Independent Claim
177 words
A method for handling wafers in a device fabrication sequence, said method comprising the steps of by means of a first pickup device mounted on a transport stage, engaging the inactive side of a wafer mounted in an aperture in a wafer-carrying tray member thereby removing the wafer from said tray member, moving the transport stage and the wafer engaged by the pickup device thereof to a position directly overlying a wafer-receiving fixture, depositing the wafer inactive side up in said fixture, engaging the inactive side of the wafer with a second pickup device, transporting the wafer to and depositing it active side up at a loading position, and moving the wafer by means of a conveyor from said loading position to a storage medium, wherein at least three spaced-apart spring-clip elements are mounted on said tray member peripherally disposed around the aperture for resiliently engaging said wafer, wherein said method further comprises the step of by means of pistons mounted on said transport stage, retracting said spring-clip elements before the wafer is removed from said tray.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-15 | 1989-01-14 | 1989-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-15 | 1993-01-14 | 1993-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-15 | 1997-01-14 | 1997-07-16 | $7700.00 | Window Closed / Lapsed |