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US4530587A Expired / Lapsed US ⏱️ 0.0 years remaining

Step type mask aligner

Assignee: Canon Inc
•
Filing: 1983-11-28
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Granted: 1985-07-23
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Expires: 2003-11-28
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Abstract

Abstract A mask aligner for stepping and exposing a wafer in accordance with a shot arrangement, including an input device to which wafer dimension, chip dimension and a chip pattern for one shot are inputted, a selector for selecting a shot arrangement mode from plural shot arrangement modes based on the above input signals, a controller for effecting the shots in accordance with the selected modes to minimize the time required for exposing the one entire wafer or to maximize the number of chips exposed per unit.

Inventors

  • 👤 Masao Kosugi
  • 👤 Tadashi Konuki
  • 👤 Kazuo Iizuka

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 11:22
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70433

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 115 words
An exposure apparatus, comprising: means for producing relative stepping movement between a mask and a radiation sensitive member; means for providing a first signal relating to an arrangement of plural chip patterns of the mask for one shot for exposing the radiation sensitive member to the chip patterns; means for providing a second signal relating to a dimension of one chip pattern; means for providing a third signal relating to a dimension of the radiation sensitive member; means for selecting a shot arrangement from plural possible shot arrangements on the basis of the first, second and third signals; and means for controlling said relative stepping movement producing means in accordance with the selected shot arrangement.
Claim 2
Dependent Claim 115 words
An exposure apparatus, comprising: means for producing relative stepping movement between a mask and a radiation sensitive member; means for providing a first signal relating to an arrangement of plural chip patterns of the mask for one shot for exposing the radiation sensitive member to the chip patterns; means for providing a second signal relating to a dimension of one chip pattern; means for providing a third signal relating to a dimension of the radiation sensitive member; means for selecting a shot arrangement from plural possible shot arrangements on the basis of the first, second and third signals; and means for controlling said relative stepping movement producing means in accordance with the selected shot arrangement.
Claim 3
Dependent Claim 29 words
An apparatus according to claim 1, further comprising means for providing said selecting means which a signal relating to a size of ineffective area of the radiation sensitive member.
Claim 4
Dependent Claim 13 words
An apparatus according to claim 1, further comprising means for illuminating the mask.
Claim 5
Dependent Claim 21 words
An apparatus according to claim 1, further comprising means for projecting an image of the mask onto the radiation sensitive member.
Claim 6
Dependent Claim 19 words
An apparatus according to claim 4, wherein the radiation sensitive member is a silicon wafer having a photoresist layer.
Claim 7
Dependent Claim 20 words
An apparatus according to claim 1, wherein said first signal means and second signal means are manually supplied with information.
Claim 8
Dependent Claim 20 words
An apparatus according to claim 1, wherein said third signal means automatically measures the dimension of the radiation sensitive member.
Claim 9
Independent Claim 101 words
A method of step exposure, comprising the steps of: providing a pattern signal relating to an arrangement of plural chip patterns for one shot of exposure; providing a chip signal relating to a dimension of one chip pattern; providing a wafer signal relating to a dimension of the radiation sensitive member; forming a plurality of shot arrangement modes, on the basis of the pattern signal, chip signal and wafer signals; selecting a shot arrangement mode from the plurality of shot arrangement modes; and repeatedly exposing the wafer by shots and producing relative step movement in accordance with the selected shot arrangement.
Claim 10
Independent Claim 101 words
A method of step exposure, comprising the steps of: providing a pattern signal relating to an arrangement of plural chip patterns for one shot of exposure; providing a chip signal relating to a dimension of one chip pattern; providing a wafer signal relating to a dimension of the radiation sensitive member; forming a plurality of shot arrangement modes, on the basis of the pattern signal, chip signal and wafer signals; selecting a shot arrangement mode from the plurality of shot arrangement modes; and repeatedly exposing the wafer by shots and producing relative step movement in accordance with the selected shot arrangement.
Claim 11
Dependent Claim 24 words
A method according to claim 8, wherein, when the shot arrangement modes are formed, an ineffective area of the wafer is taken into account.
Claim 12
Dependent Claim 30 words
A method according to claim 8, wherein the selected shot arrangement mode provides the shortest time for all the shots to be made in the effective area of the wafer.
Claim 13
Dependent Claim 25 words
A method according to claim 8, wherein the selected shot arrangement mode provides the largest number, per unit time, of shots in the effective area.

References Cited (Backward Citations)

US3716296A Cited
US3722996A Cited
US4155642A Cited
US4427292A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-07-22 1989-01-21 1989-07-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-07-22 1993-01-21 1993-07-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-07-22 1997-01-21 1997-07-23 $7700.00 Window Closed / Lapsed

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