US4532186A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit substrate with resistance layer and process for producing the same
Assignee: Nitto Denko Corp
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Filing: 1983-06-16
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Granted: 1985-07-30
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Expires: 2003-06-16
Abstract
Abstract A circuit substrate with a resistance layer and a process for producing the same are disclosed. The circuit substrate comprises an electrically insulating layer, a resistance layer bonded to at least one surface of the electrically insulating layer and a highly conductive material layer bonded to the resistance layer, and has a high sheet resistance value. The resistance layer comprises an alloy containing tin, nickel, sulfur and optionally specific elements.
Inventors
- 👤 Kazuyoshi Shibagaki
- 👤 Yoshihisa Mori
- 👤 Takahiko Moriuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:02
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/06; H01C17/075; H01C17/14; H01C17/16; H01C7/00; H01C7/006; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/05; H05K2203/0502; H05K2203/0505; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/064; H05K3/22; H05K3/24; H05K3/243; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/1266; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
93 words
A circuit substrate with a resistance layer comprising an electrically insulating layer, a resistance layer bonded to at least one surface of the electrically insulating layer and a highly conductive material layer bonded to the resistance layer, wherein the resistance layer comprises an alloy containing 30 to 85% by weight of tin, and 70 to 15% by weight of nickel, each based on the total weight of tin and nickel, and sulfur in an amount corresponding to a relative strength ratio to nickel contained of 5 to 70% determined by the ESCA measurement.
Claim 2
Dependent Claim
93 words
A circuit substrate with a resistance layer comprising an electrically insulating layer, a resistance layer bonded to at least one surface of the electrically insulating layer and a highly conductive material layer bonded to the resistance layer, wherein the resistance layer comprises an alloy containing 30 to 85% by weight of tin, and 70 to 15% by weight of nickel, each based on the total weight of tin and nickel, and sulfur in an amount corresponding to a relative strength ratio to nickel contained of 5 to 70% determined by the ESCA measurement.
Claim 3
Dependent Claim
32 words
The circuit substrate of claim 1, wherein the alloy further contains at least one element X selected from the group consisting of copper, silver, zinc, manganese, iron, cobalt, molybdenum, tungsten and palladium.
Claim 4
Dependent Claim
46 words
The circuit substrate of claim 2, the alloy contains 30 to 84.99% by weight of tin, 15 to 69.99% by weight of nickel and 0.01 to 30% by weight of the element X, each based on the total weight of tin, nickel and the element X,
Claim 5
Dependent Claim
25 words
The circuit substrate of claim 1, wherein a sheet resistance value of the resistance layer is from 400 ohms to about 10 kilo-ohms per square.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-29 | 1989-01-28 | 1989-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-29 | 1993-01-28 | 1993-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-29 | 1997-01-28 | 1997-07-30 | $7700.00 | Window Closed / Lapsed |