US4539222A
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US
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Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed
Assignee: International Business Machines Corp
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Filing: 1983-11-30
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Granted: 1985-09-03
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Expires: 2003-11-30
Abstract
Abstract A process for forming a desired metal pattern on a substrate which comprises forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating to depolymerize the thermally depolymerizable polymer, and removing the thermally depolymerizable polymer and metal thereover in a mild solvent.
Inventors
- 👤 Herbert R. Anderson, Jr.
- 👤 Constance J. Araps
- 👤 Catherine A. Lotsko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 05:18
CPC Classifications
H; H10; H10P; H10P76/00; H10P76/20; H10P76/202; H10P95/00; H10P95/08; Y; Y10; Y10S; Y10S438/00; Y10S438/942; Y10S438/948; Y10S438/951
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
81 words
A process for forming a metal pattern on a substrate which comprises: forming a mask of at least one thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern; blanket coating the substrate and the mask with a metal; heating to thermally depolymerize the thermally depolymerizable polymer; and thereafter immersing the resulting assembly in a solvent to lift-off the depolymerized polymer and any metal thereover leaving metal in the desired pattern on the substrate.
Claim 2
Dependent Claim
81 words
A process for forming a metal pattern on a substrate which comprises: forming a mask of at least one thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern; blanket coating the substrate and the mask with a metal; heating to thermally depolymerize the thermally depolymerizable polymer; and thereafter immersing the resulting assembly in a solvent to lift-off the depolymerized polymer and any metal thereover leaving metal in the desired pattern on the substrate.
Claim 3
Dependent Claim
19 words
The process of claim 1 wherein the depolymerizable polymer is selected from the group consisting of polymethylmethacrylate and poly-α-methylstyrene.
Claim 4
Dependent Claim
21 words
The process of claim 1 wherein the weight average molecular weight of the depolymerizable polymer is about 2,000 to about 1,000,000.
Claim 5
Dependent Claim
21 words
The process of claim 1 wherein the weight average molecular weight of the depolymerizable polymer is about 15,000 to about 50,000.
Claim 6
Dependent Claim
37 words
The process of claim 2 wherein the average weight molecular weight of the polymethylmethacrylate is from about 20,000 to about 50,000 and the weight average molecular weight of the poly-α-methylstyrene is from about 20,000 to about 50,000.
Claim 7
Dependent Claim
11 words
The process of claim 2 wherein the depolymerizable polymer is polymethylmethacrylate.
Claim 8
Dependent Claim
11 words
The process of claim 2 wherein the depolymerizable polymer is poly-α-methylstyrene.
Claim 9
Dependent Claim
26 words
The process of claim 1 wherein the heating to thermally depolymerize the depolymerizable polymer is at a temperature of from about 280° to about 330° C.
Claim 10
Dependent Claim
96 words
The process of claim 1 wherein the mask is formed by forming a layer of the thermally depolymerizable polymer on the substrate and then removing portions of the layer in areas where the desired metal pattern is to be applied, and subsequent to forming the layer of the thermally depolymerizable polymer, but prior to heating to thermally depolymerize the depolymerizable polymer, heating is conducted at a temperature insufficient to thermally depolymerize the depolymerizable polymer but at a temperature sufficient to cause the residual solvent and other volatile materials to be removed from the thermally depolymerizable polymer.
Claim 11
Dependent Claim
23 words
The process of claim 1 wherein the solvent lift-off is conducted at a temperature of from about 25° C. to about 50° C.
Claim 12
Dependent Claim
19 words
The process of claim 1 wherein the solvent lift-off is conducted in about 5 seconds to about 2 minutes.
Claim 13
Dependent Claim
12 words
The process of claim 1 wherein said substrate is a semiconductor substrate.
Claim 14
Dependent Claim
13 words
The process of claim 1 wherein said substrate is an alumina ceramic substrate.
Claim 15
Dependent Claim
12 words
The process of claim 1 wherein said substrate is a glass-ceramic substrate.
Claim 16
Dependent Claim
126 words
Process according to claim 1, wherein the forming of the mask comprises (a) forming a first resist layer comprised of the thermally depolymerizable polymer on the substrate, (b) forming a reactive ion etching (RIE) etch stop barrier on the first resist, the barrier being resistant to RIE in an oxygen atmosphere, (c) coating the RIE barrier with a photoresist, (d) exposing portions of the photoresist and developing the photoresist to remove portions of the photoresist in the areas where the desired metal pattern is to be applied, (e) removing the RIE barrier in the areas where the photoresist has been removed, and (f) removing the thermally depolymerizable layer by reactive ion etching in an oxygen atmosphere in the areas where the RIE barrier has been removed.
Claim 17
Dependent Claim
48 words
Process according to claim 15, wherein before forming the RIE barrier, the first resist layer is heated at a temperature insufficient to thermally depolymerize the depolymerizable polymer, but at a temperature sufficient to cause residual solvent and other volatile materials to be removed from the thermally depolymerizable polymer.
Claim 18
Dependent Claim
36 words
Process according to claim 1, wherein the thermally depolymerizable polymer is one in which thermal depolymerization is initiated at a temperature at least 50° C. greater than the temperature at which the blanket metallization is deposited.
Claim 19
Dependent Claim
23 words
Process according to claim 1, wherein the heating of the thermally depolymerizable polymer is at a temperature of at least about 280° C.
Claim 20
Dependent Claim
14 words
Process according to claim 1, wherein solvent lift-off is conducted at about room temperature.
Claim 21
Dependent Claim
16 words
Process according to claim 1, wherein the solvent for the solvent lift-off is diglyme or toluene.
Claim 22
Dependent Claim
24 words
Process as defined in claim 1, wherein the solvent lift-off is conducted at a temperature of from about 25° C. to about 50° C.
Claim 23
Dependent Claim
29 words
Process according to claim 1, wherein the solvent for the solvent lift-off does not swell any other high molecular weight organic based dielectric materials or organic barrier layers present.
Claim 24
Dependent Claim
14 words
Process according to claim 1, wherein the thermally depolymerizable polymer is an unzippable polymer.
Claim 25
Dependent Claim
13 words
Process according to claim 1, wherein the thermal depolymerization is performed without irradiation.
Claim 26
Dependent Claim
34 words
Process according to claim 1, wherein the thermally depolymerizable polymer had the following repeating regular structure: ##STR4## where X=CH 3 , CN, CF 3 , tert-butyl and ##STR5## where X is as defined above.
Claim 27
Dependent Claim
25 words
Process according to claim 1, wherein the mask further contains a reactive ion etching (RIE) etch stop barrier on top of the thermally depolymerizable polymer.
Claim 28
Dependent Claim
40 words
Process according to claim 26, wherein the thermally depolymerizable polymer is one in which thermal depolymerization is initiated at a temperature at least 50° C. greater than the temperature at which the etch stop barrier and blanket metallization are deposited.
References Cited (Backward Citations)
US3535137A
Cited
US3934057A
Cited
US3985597A
Cited
US4004044A
Cited
US4224361A
Cited
US4181755A
Cited
US4272561A
Cited
US4328263A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-09-02 | 1989-03-04 | 1989-09-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-09-02 | 1993-03-04 | 1993-09-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-09-02 | 1997-03-04 | 1997-09-03 | $7700.00 | Window Closed / Lapsed |