US4540462A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate for semiconductor modules and method of manufacture
Assignee: Toshiba Corp
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Filing: 1983-12-06
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Granted: 1985-09-10
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Expires: 2003-12-06
Abstract
Abstract A method for manufacturing a semiconductor substrate. A copper sheet is placed on a surface of a ceramic plate and bonded thereto. A circuit pattern is then formed on the copper sheet by an etching process.
Inventors
- 👤 Nobuyuki Mizunoya
- 👤 Hajime Kohama
- 👤 Yasuyuki Sugiura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 21:52
CPC Classifications
H; H10; H10W; H10W99/00; H05; H05K; H05K3/00; H05K3/38; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
73 words
A method of manufacturing a substrate having a predetermined copper pattern for a semiconductor module comprising the steps of: providing a ceramic plate; providing a copper sheet; putting the copper sheet on a surface of the ceramic plate; bonding the copper sheet to the ceramic plate surface by heating them; forming the predetermined pattern on the copper sheet; and etching the copper sheet in accordance with the predetermined pattern to form the substrate.
Claim 2
Independent Claim
73 words
A method of manufacturing a substrate having a predetermined copper pattern for a semiconductor module comprising the steps of: providing a ceramic plate; providing a copper sheet; putting the copper sheet on a surface of the ceramic plate; bonding the copper sheet to the ceramic plate surface by heating them; forming the predetermined pattern on the copper sheet; and etching the copper sheet in accordance with the predetermined pattern to form the substrate.
Claim 3
Dependent Claim
25 words
A method according to claim 1 wherein the step of providing a copper sheet comprises the step of providing a tough pitch electrolytic copper sheet.
Claim 4
Dependent Claim
28 words
A method according to claim 1 further comprising before the step of putting the copper sheet on the ceramic plate, a step of oxidation treating the copper sheet.
Claim 5
Dependent Claim
43 words
A method according to claim 1 further comprising, before the step of putting the copper sheet on the ceramic plate, the step of applying a bonding agent to the surface of the ceramic plate onto which the copper sheet is to be put.
Claim 6
Dependent Claim
21 words
A method according to claim 4 further comprising the step of oxidation treating the bonding agent applied to the ceramic plate.
Claim 7
Dependent Claim
24 words
A method according to claim 4 wherein the step of providing a ceramic plate comprises the step of providing a non-oxide type ceramic plate.
Claim 8
Dependent Claim
42 words
A method according to claim 6 wherein the step of providing a non-oxide type ceramic plate comprises the step of providing a non-oxide type ceramic plate of a compound selected from the group consisting of: silicon nitride, aluminum nitride and silicon carbide.
Claim 9
Dependent Claim
30 words
A method according to claim 1 wherein the step bonding comprises the step of heating the ceramic plate and copper sheet to a temperature in the range of 1065°-1083° C.
Claim 10
Independent Claim
77 words
A method of manufacturing a substrate having a predetermind copper pattern for a semiconductor module comprising the steps of: providing a ceramic plate; providing two copper sheets; putting the copper sheets on opposite surfaces of the ceramic plate; bonding the copper sheets to the ceramic plate by heating them; forming the predetermined pattern on at least one of the copper plates; and etching at least the copper plate having the pattern formed therein to form the substrate.
Claim 11
Independent Claim
77 words
A method of manufacturing a substrate having a predetermind copper pattern for a semiconductor module comprising the steps of: providing a ceramic plate; providing two copper sheets; putting the copper sheets on opposite surfaces of the ceramic plate; bonding the copper sheets to the ceramic plate by heating them; forming the predetermined pattern on at least one of the copper plates; and etching at least the copper plate having the pattern formed therein to form the substrate.
Claim 12
Dependent Claim
23 words
A method according to claim 9 wherein the steps of providing copper sheets comprises the step of providing tough pitch electrolytic copper sheets.
Claim 13
Dependent Claim
28 words
A method according to claim 9 further comprising before the step of putting the copper sheets on the ceramic plate, the step of oxidation treating the copper sheets.
Claim 14
Dependent Claim
43 words
A method according to claim 9 further comprising, before the step of putting the copper sheets on the ceramic plate, the step of applying a bonding agent to the surfaces of the ceramic plate onto which the copper sheets are to be put.
Claim 15
Dependent Claim
21 words
A method according to claim 12 further comprising the step of oxidation treating the bonding agent applied to the ceramic plate.
Claim 16
Dependent Claim
24 words
A method according to claim 12 wherein the step of providing a ceramic plate comprises the step of providing a non-oxide type ceramic plate.
Claim 17
Dependent Claim
42 words
A method according to claim 14 wherein the step of providing a non-oxide type ceramic plate comprises the step of providing a non-oxide type ceramic plate of a compound selected from the group consisting of silicon nitride, aluminum nitride and silicon carbide.
Claim 18
Dependent Claim
30 words
A method according to claim 9 wherein the step bonding comprises the step of heating the ceramic plate and copper sheet to a temperature in the range of 1065°-1083° C.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-09-09 | 1989-03-11 | 1989-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-09-09 | 1993-03-11 | 1993-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-09-09 | 1997-03-11 | 1997-09-10 | $7700.00 | Window Closed / Lapsed |