Dry film resist containing two or more photosensitive strata

Claim 1

A dry film resist, in particular for use for the production of imagewise structured etch resists or plating resists or imagewise structured permanent protective and insulating layers, comprising a dimensionally stable temporary base (T) and, applied on this, a solid positive-working resist layer (R) which can be rendered soluble by exposure to actinic light and which consists of two or more strata (S) which have different basic solubilities, wherein the stratum (U) adjacent to the temporary base (T) consists of a photosensitive material which, by exposure to actinic light, is rendered soluble or dispersible in a solvent in which it was previously insoluble, and that stratum (LS) of the photosensitive resist layer (R) which is not bonded to the temporary base (T) has a higher basic solubility in the developer used for washing out the exposed resist layer (R) than has the stratum (U), and can be laminated with a substrate to be permanently modified or protected, lamination being effected with the use of pressure and, if necessary, heat, to produce good adhesion to the substrate different basic solubility are photosensitive containing, as photosensitive component, a compound which possesses two or more aromatic and/or heteroaromatic o-nitrocarbinol ester groups of the general formula ##STR3## where A is a radical of an unsubstituted or substituted aromatic or heteroaromatic ring system possessing 5 to 14 ring members, and X is hydrogen, alkyl of 1 to 8 carbon atoms or unsubstituted or substituted aryl or aralkyl.