← Back to Patent Explorer
US4608332A Expired / Lapsed US ⏱️ 0.0 years remaining

Electron lithography mask manufacture

Assignee: US Philips Corp
•
Filing: 1984-05-01
•
Granted: 1986-08-26
•
Expires: 2004-05-01
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A layer of electron sensitive resist on a semiconductor substrate is exposed to a patterned electron beam emitted from an erasable photocathode mask in an electron image projector. The mask is formed from a transparent plate, such as quartz, on which a layer of caesium iodide or other photoemissive material is provided. A photoemissive pattern is defined in this layer by selective direct exposure to a beam of photons, electrons, or ions, preferably in an evacuated environment containing carbon whereby the photoemission of the exposed areas of the layer is lowered. Alternatively, using a beam of charged particles with a relatively high current density, the exposed parts of the layer are actually removed by evaporation. In either case, the patterned layer can be removed by rinsing in water and the transparent plate can be reused with the same or different photoemissive pattern.

Inventors

  • 👤 Rodney Ward

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 05:31
CPC Classifications
B; B82; B82Y; B82Y10/00; H; H01; H01J; H01J37/00; H01J37/30; H01J37/317; H01J37/3174; B82Y40/00; G; G03; G03F; G03F7/00; G03F7/20; G03F7/2037; H01J2237/00; H01J2237/06; H01J2237/063; H01J2237/06325; H01J2237/06333; H01J2237/30; H01J2237/317; H01J2237/3175; H01J2237/31777; H01J2237/31779; Y; Y10; Y10S; Y10S430/00; Y10S430/143

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 103 words
A method of lithographically defining a pattern in a layer of electron sensitive resist on a substrate comprising the steps of defining a photoemissive pattern by selectively exposing a layer of photoemissive material on a transparent plate to radiation, said radiation causing local modification in electron emissive properties of said photoemissive material, illuminating said photoemissive pattern on said transparent plate with electromagnetic radiation to form an electron emissive mask, said step of illuminating causing a patterned beam of electrons to be emitted from said photoemissive pattern, and exposing a layer of electron sensitive resist on a substrate to said patterned beam of electrons.
Claim 2
Independent Claim 103 words
A method of lithographically defining a pattern in a layer of electron sensitive resist on a substrate comprising the steps of defining a photoemissive pattern by selectively exposing a layer of photoemissive material on a transparent plate to radiation, said radiation causing local modification in electron emissive properties of said photoemissive material, illuminating said photoemissive pattern on said transparent plate with electromagnetic radiation to form an electron emissive mask, said step of illuminating causing a patterned beam of electrons to be emitted from said photoemissive pattern, and exposing a layer of electron sensitive resist on a substrate to said patterned beam of electrons.
Claim 3
Dependent Claim 36 words
A method according to claim 1, wherein said photoemissive pattern is defined by selectively exposing said layer of photoemissive material to said radiation for effecting said local modification in photoemission of said layer of photoemissive material.
Claim 4
Dependent Claim 18 words
A method according to claim 2, wherein said layer of photoemissive material is exposed in an evacuated environment.
Claim 5
Dependent Claim 14 words
A method according to claim 3, wherein said evacuated environment contains residues of carbon.
Claim 6
Dependent Claim 35 words
A method according to claim 1, wherein said photoemissive pattern is defined by selectively exposing said layer of photoemissive material to said radiation for effecting local removal of parts of said layer of photoemissive material.
Claim 7
Dependent Claim 18 words
A method according to claim 5, wherein said layer of photoemissive material is exposed to an evacuated environment.
Claim 8
Dependent Claim 14 words
A method according to claim 6, wherein said evacuated environment contains residues of carbon.
Claim 9
Dependent Claim 21 words
A method according to claim 1 or claim 2 or claim 5, wherein said layer of photoemissive material is caesium iodide.
Claim 10
Dependent Claim 21 words
A method according to claim 1 or claim 2 or claim 5, wherein said radiation is a beam of charged particles.
Claim 11
Dependent Claim 17 words
A method according to claim 9, wherein said beam of charged particles is a beam of electrons.

References Cited (Backward Citations)

US3686028A Cited
US3983401A Cited
US4088896A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-08-25 1990-02-24 1990-08-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-08-25 1994-02-24 1994-08-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-08-25 1998-02-24 1998-08-26 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag