US4643798A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composite and circuit board having conductive layer on resin layer and method of manufacturing
Assignee: Mitsubishi Electric Corp
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Filing: 1985-04-09
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Granted: 1987-02-17
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Expires: 2005-04-09
Abstract
Abstract In manufacturing a composite having a conductive layer on the surface of a resin layer, first the resin layer of a mixture of a resin material and filler elements is formed on a substrate and the resin material of the surface of the resin layer is selectively etched with respect to the filler elements to expose a portion of the filler elements, and then the filler elements, as exposed on the selectively etched surface of the resin layer, are selectively etched with respect to the resin material to form unevenness. Then catalyst nuclei are formed for electroless plating on the selectively etched surface having the unevenness and then a conductive metallic layer is formed by an electroless plating process on the selectively etched surface having unevenness. As a result, a composite of the above described structure is provided.
Inventors
- 👤 Mitsuyuki Takada
- 👤 Yoshiyuki Morihiro
- 👤 Hayato Takasago
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:08
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/2006; C23C18/22; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; H05K3/38; H05K3/386; H05K3/387; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0215; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0773; H05K2203/10; H05K2203/107
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
271 words
A method of manufacturing a composite having a conductive layer on a surface of a resin layer, comprising the steps of preparing a substrate having a main surface, forming on said main surface of said substrate a resin layer comprising a mixture of a resin material and filler elements of fine geometry, said resin material being etchable with respect to said filler elements, said filler elements being etchable with respect to said resin material, selectively etching said resin material of the surface of said resin layer with respect to said filler elements to expose a portion of said filler elements, selectively etching said filler elements, as exposed on said selectively etched surface of said resin layer with respect to the resin material, to form unevenness including concavities formed as a result of etching of said exposed filler elements, forming catalyst nuclei for electroless plating on said selectively etched surface having said unevenness of said resin layer, and electroless plating a conductive metal layer on said selectively etched surface having said unevenness having said catalyst nuclei formed, wherein said resin material comprises a thermo-setting material being thermo-settable at a predetermined thermo-setting temperature, said resin material being etched with respect to said filler elements prior to thermo-setting of said resin material, said filler elements being selectively etched with respect to said resin material after said resin material has been thermo-set, and which further comprises the step of heating said resin material to said predetermined thermosetting temperature after said step of etching said resin material at the surface of said resin layer and before said step of selectively etching said filler elements, as exposed.
Claim 2
Independent Claim
271 words
A method of manufacturing a composite having a conductive layer on a surface of a resin layer, comprising the steps of preparing a substrate having a main surface, forming on said main surface of said substrate a resin layer comprising a mixture of a resin material and filler elements of fine geometry, said resin material being etchable with respect to said filler elements, said filler elements being etchable with respect to said resin material, selectively etching said resin material of the surface of said resin layer with respect to said filler elements to expose a portion of said filler elements, selectively etching said filler elements, as exposed on said selectively etched surface of said resin layer with respect to the resin material, to form unevenness including concavities formed as a result of etching of said exposed filler elements, forming catalyst nuclei for electroless plating on said selectively etched surface having said unevenness of said resin layer, and electroless plating a conductive metal layer on said selectively etched surface having said unevenness having said catalyst nuclei formed, wherein said resin material comprises a thermo-setting material being thermo-settable at a predetermined thermo-setting temperature, said resin material being etched with respect to said filler elements prior to thermo-setting of said resin material, said filler elements being selectively etched with respect to said resin material after said resin material has been thermo-set, and which further comprises the step of heating said resin material to said predetermined thermosetting temperature after said step of etching said resin material at the surface of said resin layer and before said step of selectively etching said filler elements, as exposed.
Claim 3
Dependent Claim
22 words
A method of manufacturing a composite in accordance with claim 1, wherein said filler elements are made of an inorganic insulating material.
Claim 4
Dependent Claim
23 words
A method of manufacturing a composite in accordance with claim 2, wherein said filler elements of said inorganic insulating material comprise glass powder.
Claim 5
Dependent Claim
27 words
A method of manufacturing a composite in accordance with claim 2, wherein said filler elements of said inorganic insulating material comprise crystal of said inorganic insulating material.
Claim 6
Dependent Claim
23 words
A method of manufacturing a composite in accordance with claim 2, wherein said filler elements of said inorganic insulating material comprise glass fibers.
Claim 7
Dependent Claim
19 words
A method of manufacturing a composite in accordance with claim 1, wherein said filler elements are made of metal.
Claim 8
Dependent Claim
31 words
A method of manufacturing a composite in accordance with claim 6, wherein said metal is a member selected from the group consisting of copper and aluminum, said filler elements being granule.
Claim 9
Independent Claim
310 words
A method of manufacturing a circuit board having a conductive layer of a predetermined pattern on a surface of a resin layer, comprising the steps of preparing a substrate having a main surface, forming on said main surface of said substrate a resin layer comprising a mixture of a resin material and filler elements of fine geometry, said resin material being selectively etchable with repect to said filler elements, said filler elements being selectively etchable with respect to said resin material, selectively etching the surface of said resin material layer in an area of the surface according to a predetermined pattern to expose a portion of said filler elements in said area in said predetermined pattern of the surface of said resin layer, selectively etching said filler elements, as exposed on said selectively etched surface of said area in said predetermined pattern of said resin layer, to form unevenness therein including concavities formed as a result of etching of said exposed filler elements, forming catalyst nuclei for electroless plating on said selectibely etched surface in said predetermined pattern of said resin layer having said unevenness of said resin layer, and electroless plating selectively a conductive metal layer on said selectively etched surface in said predetermined pattern having said unevenness having said catalyst nuclei formed, wherein said resin material comprises a thermo-setting material being thermo-settable at a predetermined thermo-setting temperature, said resin material being etched with respect to said filler elements prior to thermo-setting of said resin material, said filler elements being selectively etched with respect to said resin meaterial following thermo-setting of said resin material, and which thereby further comprises the step of heating said resin material to said predetermined thermosetting temperature after said step of selectively etching said resin material on the surface of said resin layer and before said step of selectively etching said filler element, as exposed.
Claim 10
Independent Claim
310 words
A method of manufacturing a circuit board having a conductive layer of a predetermined pattern on a surface of a resin layer, comprising the steps of preparing a substrate having a main surface, forming on said main surface of said substrate a resin layer comprising a mixture of a resin material and filler elements of fine geometry, said resin material being selectively etchable with repect to said filler elements, said filler elements being selectively etchable with respect to said resin material, selectively etching the surface of said resin material layer in an area of the surface according to a predetermined pattern to expose a portion of said filler elements in said area in said predetermined pattern of the surface of said resin layer, selectively etching said filler elements, as exposed on said selectively etched surface of said area in said predetermined pattern of said resin layer, to form unevenness therein including concavities formed as a result of etching of said exposed filler elements, forming catalyst nuclei for electroless plating on said selectibely etched surface in said predetermined pattern of said resin layer having said unevenness of said resin layer, and electroless plating selectively a conductive metal layer on said selectively etched surface in said predetermined pattern having said unevenness having said catalyst nuclei formed, wherein said resin material comprises a thermo-setting material being thermo-settable at a predetermined thermo-setting temperature, said resin material being etched with respect to said filler elements prior to thermo-setting of said resin material, said filler elements being selectively etched with respect to said resin meaterial following thermo-setting of said resin material, and which thereby further comprises the step of heating said resin material to said predetermined thermosetting temperature after said step of selectively etching said resin material on the surface of said resin layer and before said step of selectively etching said filler element, as exposed.
Claim 11
Dependent Claim
23 words
A method of manufacturing a circuit board in accordance with claim 8, wherein said filler elements are made of an inorganic insulating material.
Claim 12
Dependent Claim
24 words
A method of manufacturing a circuit board in accordance with claim 9, wherein said filler elements of said inorganic insulating material comprise glass powder.
Claim 13
Dependent Claim
28 words
A method of manufacturing a circuit board in accordance with claim 9, wherein said filler elements of said inorganic insulating material comprise crystal of said inorganic insulating material.
Claim 14
Dependent Claim
24 words
A method of manufacturing a circuit board in accordance with claim 9, wherein said filler elements of said inorganic insulating material comprise glass fibers.
Claim 15
Dependent Claim
20 words
A method of manufacturing a circuit board in accordance with claim 8, wherein said filler elements are made of metal.
Claim 16
Dependent Claim
32 words
A method of manufacturing a circuit board in accordance with claim 13, wherein said metal is a member selected from the group consisting of copper and aluminum, said filler elements being granule.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-16 | 1990-08-18 | 1991-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-16 | 1994-08-18 | 1995-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-16 | 1998-08-18 | 1999-02-17 | $7700.00 | Window Closed / Lapsed |