US4710798A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit chip package
Assignee: Nortel Networks Ltd
•
Filing: 1985-09-12
•
Granted: 1987-12-01
•
Expires: 2005-09-12
Abstract
Abstract An integrated circuit is mounted on, and electrically connected to an underlying substrate by the flip-chip technique. In this technique, the chip is inverted and bonding pads on the chip are soldered to correspondingly located bonding pads on the substrate. By the invention a continuous ribbon or loop of solder or polymer extends between the chip and substrate surfaces and defines a sealed cavity. Because the interior of the cavity is sealed from contaminants, conducting leads of the chip or substrate can be left uncovered within the cavity so reducing the capacitance of high frequency circuits. The substrate can be a connection medium such as a printed circuit board or could be another integrated circuit chip.
Inventors
- 👤 Gabriel Marcantonio
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W70/69; H10W70/698; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
104 words
An integrated circuit chip package comprising: an integrated circuit chip having a plurality of circuit elements contained therein, said circuit elements being electrically extended to a plurality of bonding pads on a surface thereof, a substrate having a plurality of bonding pads on a surface of the substrate, said surface of the substrate facing said surface of the chip, a connection extending from selected bonding pads on the chip to corresponding bonding pads on the substrate, and material extending from said chip surface to said substrate surface for defining a perimeter of a sealed cavity formed between said chip surface and said substrate surface.
Claim 2
Dependent Claim
104 words
An integrated circuit chip package comprising: an integrated circuit chip having a plurality of circuit elements contained therein, said circuit elements being electrically extended to a plurality of bonding pads on a surface thereof, a substrate having a plurality of bonding pads on a surface of the substrate, said surface of the substrate facing said surface of the chip, a connection extending from selected bonding pads on the chip to corresponding bonding pads on the substrate, and material extending from said chip surface to said substrate surface for defining a perimeter of a sealed cavity formed between said chip surface and said substrate surface.
Claim 3
Dependent Claim
14 words
A package as claimed in claim 1, wherein said substrate is an integrated circuit.
Claim 4
Dependent Claim
64 words
A package as claimed in claim 1, wherein said substrate is an interconnection medium having a semiconductor substrate and, formed thereon, a multilayer structure comprising alternating layers of dielectric and conductor, the conducting layers etched into conducting patterns wherein selected regions of said conducting patterns are connected to each other and to the bonding pads of said substrate through vias in the dielectric layers.
Claim 5
Dependent Claim
13 words
A package as claimed in claim 1, wherein said material is solder material.
Claim 6
Dependent Claim
26 words
A package as claimed in claim 1, wherein said material and the bonding pads on the chip are laterally spaced regions of a common metallic film.
Claim 7
Dependent Claim
15 words
A package as claimed in claim 4, wherein the solder is a 95:5 tin:silver solder.
Claim 8
Dependent Claim
31 words
A package as claimed in claim 4, wherein the solder provides a sealing connection between first and second perimeter bonding pads formed respectively on said chip surface and said substrate surface.
Claim 9
Dependent Claim
13 words
A package as claimed in claim 1, wherein said material is a polymer.
Claim 10
Dependent Claim
14 words
A package as claimed in claim 1, wherein said connection is an electrical connection.
Claim 11
Dependent Claim
14 words
A package as claimed in claim 1, wherein said connection is a mechanical connection.
Claim 12
Dependent Claim
17 words
A package as claimed in claim 1, wherein said connection is an electrical and a mechanical connection.
Claim 13
Dependent Claim
13 words
A package as claimed in claim 1, wherein said sealed cavity encloses air.
References Cited (Backward Citations)
US3400383A
Cited
US3388301A
Cited
US3621564A
Cited
US4074342A
Cited
JPS5277684A
Cited
US4126879A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-30 | 1991-06-01 | 1991-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-30 | 1995-06-01 | 1995-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-30 | 1999-06-01 | 1999-12-01 | $7700.00 | Window Closed / Lapsed |