US4716059A
Expired / Lapsed
US
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Composites of metal with carbon fluoride and method of preparation
Assignee: Honeywell International Inc
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Filing: 1987-02-26
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Granted: 1987-12-29
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Expires: 2007-02-26
Abstract
Abstract Carbon fluoride and metal are co-deposited from an electroless plating bath onto a suitable solid, forming a thin surface layer having low surface energy and good lubricity. Carbon fluoride particles having an average size from 0.2 to 8 mu m are dispersed in an aqueous solution using 0.5 to 2 volume percent of surfactants comprising a nonionic surfactant having an HLB number of 10 to 20, optionally including up to a maximum 20% of a cationic surfactant based on the amount of nonionic surfactant used. Sufficient presuspended carbon fluoride particles are combined with an electroless metal plating bath to provide 1-50 grams of carbon fluoride per liter of the bath.
Inventors
- 👤 Jung T. Kim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 00:34
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/52
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
127 words
A process for the simultaneous electroless deposition of particulate carbon fluoride and metals comprising: (a) suspending up to 20 wt. % carbon fluoride particles having an average particle size of 0.2 to 8 μm in an aqueous solution comprising, (1) about 0.5 to 2.0 % by volume of a non-ionic surfactant having an HLB number of 10 to 20, and optionally (2) up to about 20% by volume of a cationic surfactant relative to said non-ionic surfactant of (a) (1), (b) adding the suspension of carbon fluoride particles of (a) to an electroless metal plating bath; (c) suspending a solid in the electroless metal plating bath containing suspended carbon fluoride particles for a period of time sufficient to co-deposit the desired amount of carbon fluoride and metal.
Claim 2
Dependent Claim
127 words
A process for the simultaneous electroless deposition of particulate carbon fluoride and metals comprising: (a) suspending up to 20 wt. % carbon fluoride particles having an average particle size of 0.2 to 8 μm in an aqueous solution comprising, (1) about 0.5 to 2.0 % by volume of a non-ionic surfactant having an HLB number of 10 to 20, and optionally (2) up to about 20% by volume of a cationic surfactant relative to said non-ionic surfactant of (a) (1), (b) adding the suspension of carbon fluoride particles of (a) to an electroless metal plating bath; (c) suspending a solid in the electroless metal plating bath containing suspended carbon fluoride particles for a period of time sufficient to co-deposit the desired amount of carbon fluoride and metal.
Claim 3
Dependent Claim
13 words
The process of claim 1 wherein said HLB number is 13 to 15.
Claim 4
Dependent Claim
20 words
The process of claim 1 wherein the carbon fluoride particles have an average particle size of less than 3 μm.
Claim 5
Dependent Claim
23 words
The process of claim 1 wherein the amount of carbon fluoride in the solution of (a) is from 1 g/l to 50 g/l.
Claim 6
Dependent Claim
21 words
The process of claim 1 wherein the total amount of non-ionic and cationic surfactants is about 0.5 to 2 volume %.
Claim 7
Dependent Claim
31 words
The process of claim 1 wherein the metal plating bath comprises an aqueous solution of compounds of at least one member of the group consisting of nickel, copper, cobalt and gold.
Claim 8
Dependent Claim
18 words
The process of claim 6 wherein said metal plating bath comprises an aqueous solution of a nickel compound.
Claim 9
Dependent Claim
75 words
An electroless plating bath comprising a mixture of: (a) An aqueous suspension of carbon fluoride particles having an average particle size of 0.2 to 8 μm, said suspension comprising (1) about 0.5 to 2.0% by volume of a non-ionic surfactant having an HLB number of 10 to 20, and optionally (2) up to about 20% by volume of a cationic surfactant relative to said non-ionic surfactant of (a) (1); (b) an electroless metal plating solution.
Claim 10
Dependent Claim
75 words
An electroless plating bath comprising a mixture of: (a) An aqueous suspension of carbon fluoride particles having an average particle size of 0.2 to 8 μm, said suspension comprising (1) about 0.5 to 2.0% by volume of a non-ionic surfactant having an HLB number of 10 to 20, and optionally (2) up to about 20% by volume of a cationic surfactant relative to said non-ionic surfactant of (a) (1); (b) an electroless metal plating solution.
Claim 11
Dependent Claim
14 words
The plating bath of claim 8 wherein said HLB number is 13 to 15.
Claim 12
Dependent Claim
21 words
The plating bath of claim 8 wherein the carbon fluoride particles have an average particle size of less than 3 μm.
Claim 13
Dependent Claim
24 words
The plating bath of claim 8 wherein the amount of carbon fluoride is the suspension of (a) is from 1 g/l to 50 g/l.
Claim 14
Dependent Claim
22 words
The plating bath of claim 8 wherein the total amount of non-ionic and cationic surfactants is about 0.5 to 2 volume percent.
Claim 15
Dependent Claim
33 words
The plating bath of claim 8 wherein said electroless metal plating solution comprises an aqueous solution of compounds of at least one member of the group consisting of nickel, copper cobalt and gold.
Claim 16
Dependent Claim
19 words
The plating bath of claim 13 wherein said metal plating solution comprises an aqueous solution of a nickel compound.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-12-28 | 1991-06-29 | 1991-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-12-28 | 1995-06-29 | 1995-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-12-28 | 1999-06-29 | 1999-12-29 | $7700.00 | Window Closed / Lapsed |