US4725478A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-miniaturizable printed circuit board
Assignee: WR Grace and Co Conn
•
Filing: 1985-09-04
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Granted: 1988-02-16
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Expires: 2005-09-04
Abstract
Abstract The present invention relates to the manufacture of printed circuit boards and, particularly, to a process of miniaturizing said printed circuit board.
Inventors
- 👤 Eckart Mathias
- 👤 William A. Feehley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:35
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K3/00; H05K3/0011; H05K3/22; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0125; H05K2201/0129; H05K2203/00; H05K2203/11; H05K2203/1105; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/913; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24893; Y10T428/24901; Y10T428/24917
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
41 words
A process for miniaturizing printed circuitry which comprises depositing a curable conductive ink in a desired pattern on a heat shrinkable polymeric substrate and, thereafter, applying heat to said substrate to simultaneously or successively shrink said substrate and cure said ink.
Claim 2
Dependent Claim
41 words
A process for miniaturizing printed circuitry which comprises depositing a curable conductive ink in a desired pattern on a heat shrinkable polymeric substrate and, thereafter, applying heat to said substrate to simultaneously or successively shrink said substrate and cure said ink.
Claim 3
Dependent Claim
44 words
The process according to claim 1 wherein the heating is carried out in two steps, firstly at 120° C. to initiate shrinkage of said substrate and subsequently at about 150° C. to effect final shrinkage of said substrate and curing of the conductive ink.
Claim 4
Dependent Claim
30 words
The process according to claim 1 wherein the shrinking of said substrate and the curing of said ink is carried out simultaneously at a temperature of at least 150° C.
Claim 5
Dependent Claim
14 words
The process according to claim 1 wherein said heat shrinkable polymeric substrate is polystyrene.
Claim 6
Dependent Claim
12 words
The process according to claim 1 wherein said conductive ink is solventless.
Claim 7
Dependent Claim
23 words
The process according to claim 1 wherein said conductive ink is deposited on said heat shrinkable polymeric substrate via a screen printing method.
Claim 8
Dependent Claim
24 words
The process according to claim 1 wherein the printed circuit area reduction achieved without detrimentally effecting tracing resolution and conductivity is at least four-fold.
Claim 9
Dependent Claim
13 words
An article comprising a curable conductive ink on a heat shrinkable polymeric substrate.
Claim 10
Dependent Claim
13 words
An article comprising a curable conductive ink on a heat shrinkable polymeric substrate.
Claim 11
Dependent Claim
11 words
The article of claim 8 wherein the conductive ink is solventless.
Claim 12
Dependent Claim
15 words
The article of claim 8 wherein the conductive ink is present in a circuit pattern.
Claim 13
Dependent Claim
13 words
An article comprising a cured conductive ink on a heat shrunken polymeric substrate.
Claim 14
Dependent Claim
13 words
An article comprising a cured conductive ink on a heat shrunken polymeric substrate.
Claim 15
Dependent Claim
15 words
The article of claim 11 wherein the conductive ink is present in a circuit pattern.
Claim 16
Dependent Claim
63 words
A process from miniaturizing a printed circuit which comprises screen printing in a circuit pattern, a conductive ink onto a heat shrinkable polymeric substrate and then in either order (1) heating the thus printed substrate to a temperature sufficient to cause said substrate to shrink and (2) exposing the printed substrate to UV radiation for a time sufficient to cure said conductive ink.
Claim 17
Dependent Claim
63 words
A process from miniaturizing a printed circuit which comprises screen printing in a circuit pattern, a conductive ink onto a heat shrinkable polymeric substrate and then in either order (1) heating the thus printed substrate to a temperature sufficient to cause said substrate to shrink and (2) exposing the printed substrate to UV radiation for a time sufficient to cure said conductive ink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-02-15 | 1991-08-17 | 1992-02-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-02-15 | 1995-08-17 | 1996-02-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-02-15 | 1999-08-17 | 2000-02-16 | $7700.00 | Window Closed / Lapsed |