US4740414A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic/organic multilayer interconnection board
Assignee: Boeing Co
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Filing: 1986-11-17
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Granted: 1988-04-26
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Expires: 2006-11-17
Abstract
Abstract A multilayer board comprising a novel construction of ceramic and organic layers to reduce difficulties commonly encountered by board materials and components attached thereto having differing thermal coefficients of expansion. The multilayer board comprises an inorganic ceramic surface which is affixedly attached via a compliant adhesive to a conventional plated up post or plated thru hole organic multilayer board.
Inventors
- 👤 Joseph M. Shaheen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4647; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/4611; H05K3/4626; H05K3/4688; H05K1/03; H05K1/0306; H05K1/0313; H05K1/117; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09145; H05K2201/0919; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K3/22; H05K3/24; H05K3/243; H05K3/38; H05K3/386; H05K3/4602; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
65 words
A ceramic/organic multilayer board functioning to reduce the thermal coefficient of expansion mismatches between component carriers mounted on said multilayer board comprising in combination: an organic inner layer having a top and bottom surface; a duality of compliant adhesive layers each respectively positioned on said top and said bottom surface; and a duality of inorganic ceramic layers each respectively affixed to said compliant adhesive layers.
Claim 2
Dependent Claim
65 words
A ceramic/organic multilayer board functioning to reduce the thermal coefficient of expansion mismatches between component carriers mounted on said multilayer board comprising in combination: an organic inner layer having a top and bottom surface; a duality of compliant adhesive layers each respectively positioned on said top and said bottom surface; and a duality of inorganic ceramic layers each respectively affixed to said compliant adhesive layers.
Claim 3
Dependent Claim
23 words
The ceramic/organic multilayer board as set forth in claim 1, wherein said organic inner layer further comprises a plurality of electrically conductive pathways.
Claim 4
Dependent Claim
40 words
The ceramic/organ ic multilayer board as set forth in claim 1 wherein said compliant adhesive layers are selected from a group of materials, having good thermal conductivity and a low modulus of elasticity comprising epoxy nitrile or modified acrylic adhesive.
Claim 5
Dependent Claim
33 words
The ceramic/organic multilayer board as set forth in claim 1, wherein said inorganic ceramic layers are constructed from a group of materials comprising mullite, beryllium, silicon nitride, aluminum nitride and any combination thereof.
Claim 6
Dependent Claim
36 words
The ceramic/organic multilayer board as set forth in claim 2, wherein said ceramic layers further comprise electrically conductive footprints positioned thereon and being connected through said adhesive layers to said plurality of said electrically conductive pathways.
Claim 7
Dependent Claim
31 words
The ceramic/organic multilayer board as set forth in claim 1, wherein said ceramic layers are cut short to expose said organic inner layer for the direct electrical connection to foreign devices.
Claim 8
Dependent Claim
33 words
The ceramic/organic multilayer board as set forth in claim 2, wherein said inner layer's top and said bottom surfaces have conductive pads thereon electrically connected to said plurality of said electrically conductive pathways.
Claim 9
Dependent Claim
68 words
A ceramic/organic multilayer composite structure comprising in combination: a conventional organic multilayer board having a top side and a bottom side; an adhesive applied to said top and to said bottom side; and an inorganic ceramic layer affixed to said top and to said bottom side via said adhesive, said adhesive being disposed between said conventional multilayer board's top and bottom sides and between said inorganic ceramic layers.
Claim 10
Dependent Claim
68 words
A ceramic/organic multilayer composite structure comprising in combination: a conventional organic multilayer board having a top side and a bottom side; an adhesive applied to said top and to said bottom side; and an inorganic ceramic layer affixed to said top and to said bottom side via said adhesive, said adhesive being disposed between said conventional multilayer board's top and bottom sides and between said inorganic ceramic layers.
Claim 11
Dependent Claim
35 words
The ceramic/organic multilayer composite structure as set forth in claim 8, wherein said ceramic/organic multilayer board has electrical connections selected from the group comprising plated thru holes, plated up posts, and a combination of both.
Claim 12
Dependent Claim
35 words
The ceramic/organic multilayer composite structure of claim 8, wherein said adhesive is selected from a group of materials having good thermal conductivity and a low modulus of elasticity comprising epoxy nitrile or modified acrylic adhesive.
Claim 13
Dependent Claim
43 words
The ceramic/organic multilayer board composite structure of claim 8, wherein said inorganic ceramic layers are constructed from a group of materials having a thermal coefficient of expansion similar to that of alumina comprising mullite, beryllium, silicon nitride, aluminum nitride and any combination thereof.
Claim 14
Dependent Claim
31 words
The ceramic/organic multilayer board composite structure as set forth in claim 11, wherein said ceramic layers further comprises electrically conductive footprints positioned on the surface of each said inorganic ceramic layer.
Claim 15
Dependent Claim
26 words
The ceramic/organic multilayer board composite structure as set forth in claim 12, wherein said electrically conductive footprints are connected through said adhesive to said multilayer board.
Claim 16
Dependent Claim
34 words
A multilayer board comprising in combination: an organic layer forming a printed circuit board; a compliant adhesive layer positioned on said organic layer; and an inorganic ceramic layer positioned atop said compliant adhesive layer.
Claim 17
Dependent Claim
34 words
A multilayer board comprising in combination: an organic layer forming a printed circuit board; a compliant adhesive layer positioned on said organic layer; and an inorganic ceramic layer positioned atop said compliant adhesive layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-26 | 1991-10-26 | 1992-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-26 | 1995-10-26 | 1996-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-26 | 1999-10-26 | 2000-04-26 | $7700.00 | Window Closed / Lapsed |