US4743489A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer wiring substrate
Assignee: Aventis Pharma SA
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Filing: 1986-11-05
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Granted: 1988-05-10
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Expires: 2006-11-05
Abstract
Abstract A multilayer wiring substrate for mounting a plurality of electronic circuit elements wherein individual wiring layers are separately by insulating layers of an organic material. A plurality of contact pads are formed on the uppermost insulating layer and are connected to wiring members by pressure bonding at least one ceramic buffer member is provided beneath the contact pads to prevent pressure applied during bonding from affecting the wiring layers.
Inventors
- 👤 Shinichi Hasegawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:46
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0187; H05K2201/20; H05K2201/2009; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/04; H05K2203/049; H05K2203/13; H05K2203/1377; H05K2203/1383; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/5366; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/931; H10W72/934; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926; Y10T428/31504; Y10T428/31551; Y10T428/31616; Y10T428/3162; Y10T428/31623
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
99 words
A multilayer wiring substrate for mounting a plurality of electronic circuit elements comprising: a plurality of wiring layers having wirings to be connected to said electronic circuit elements; a plurality of insulating layers including an organic material for providing insulation between said wiring layers; a plurality of pads formed on the uppermost one of said insulating layers and connected to wiring members by pressure bonding; and at least one buffer member provided beneath said pads and made of a ceramic material to prevent pressure applied during bonding of said wiring members to said pads from affecting said wiring layers.
Claim 2
Dependent Claim
99 words
A multilayer wiring substrate for mounting a plurality of electronic circuit elements comprising: a plurality of wiring layers having wirings to be connected to said electronic circuit elements; a plurality of insulating layers including an organic material for providing insulation between said wiring layers; a plurality of pads formed on the uppermost one of said insulating layers and connected to wiring members by pressure bonding; and at least one buffer member provided beneath said pads and made of a ceramic material to prevent pressure applied during bonding of said wiring members to said pads from affecting said wiring layers.
References Cited (Backward Citations)
US4578304A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-05-10 | 1991-11-09 | 1992-05-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-05-10 | 1995-11-09 | 1996-05-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-05-10 | 1999-11-09 | 2000-05-10 | $7700.00 | Window Closed / Lapsed |