US4750030A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin-molded semiconductor device having heat radiating plate embedded in the resin
Assignee: NEC Corp
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Filing: 1986-12-16
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Granted: 1988-06-07
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Expires: 2006-12-16
Abstract
Abstract A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common insulator web attached to the metallic heat radiating plates. When the lead frame is placed in the cavity of a mold, the metallic heat radiating plates are correctly positioned in the mold cavity by the insulating web and the connected leads. By effecting a resin molding under this condition, the metallic heat radiating plates are molded in resin such that a layer of resin with a uniform thickness cover the back surface of the respective metallic heat radiating plates.
Inventors
- 👤 Mikio Hatakeyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/481; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/858; H10H20/8585; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
142 words
A resin-molded semiconductor device comprising: a metallic heat radiating plate; a semiconductor pellet attached to said heat radiating plate; a first lead for external connection connected at its one end to said heat radiating plate; at least one second lead for external connection having an end disposed in the vicinity of said metallic heat radiating plate; means for electrically connecting an electrode of said semiconductor pellet to said second lead; an insulator web attached to one end of said metallic heat radiating plate and extending therefrom to the outside of said metallic heat radiating plate; and a resin member covering said metallic heat radiating plate, said semiconductor pellet, said connecting means and a part of said insulator web, said insulator web having a portion exposed from said resin member and said metallic heat radiating plate being completely covered by said resin member.
Claim 2
Dependent Claim
142 words
A resin-molded semiconductor device comprising: a metallic heat radiating plate; a semiconductor pellet attached to said heat radiating plate; a first lead for external connection connected at its one end to said heat radiating plate; at least one second lead for external connection having an end disposed in the vicinity of said metallic heat radiating plate; means for electrically connecting an electrode of said semiconductor pellet to said second lead; an insulator web attached to one end of said metallic heat radiating plate and extending therefrom to the outside of said metallic heat radiating plate; and a resin member covering said metallic heat radiating plate, said semiconductor pellet, said connecting means and a part of said insulator web, said insulator web having a portion exposed from said resin member and said metallic heat radiating plate being completely covered by said resin member.
Claim 3
Dependent Claim
51 words
The resin-molded semiconductor device as claimed in claim 1, wherein said metallic heat radiating plate and said resin member are provided with threaded holes to form a hole in said semiconductor device, the inner wall of the threaded hole of said metallic heat radiating plate being covered by said resin member.
Claim 4
Dependent Claim
33 words
The resin-molded semiconductor device as claimed in claim 1, wherein said heat radiating plate is provided at said one end with a metallic projection, said insulator web being secured to said metallic projection.
Claim 5
Dependent Claim
45 words
The resin-molded semiconductor device as claimed in claim 1, wherein a portion of said resin member covering the opposite surface of said metallic heat radiating plate to the surface where said semiconductor pellet is attached has a substantially uniform thickness of 0.35 to 0.65 mm.
Claim 6
Dependent Claim
30 words
The resin-molded semiconductor device as claimed in claim 1, wherein the surface of said insulator web exposed from said resin member is flush with the surface of said resin member.
References Cited (Backward Citations)
US3423516A
Cited
US3629672A
Cited
US4507675A
Cited
US4503452A
Cited
JPS59215751A
Cited
JPS607750A
Cited
JPS60229352A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-07 | 1991-12-07 | 1992-06-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-07 | 1995-12-07 | 1996-06-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-07 | 1999-12-07 | 2000-06-07 | $7700.00 | Window Closed / Lapsed |