High speed fiberoptic laser module

Claim 2

A semiconductor laser module comprising: a housing; a laser substrate in the housing; a semiconductor laser diode mounted on the laser substrate; an optical fiber connected to the same laser substrate in alignment with the laser; a connection substrate mounted on the base of the housing beside the laser substrate; a metallized lead line on the connection substrate; means for bringing an external electrical signal through the housing and applying the signal to the lead line; means on the connection substrate for matching impedance of the lead line and the laser diode; means for connecting one terminal of the laser diode to the means for matching impedance; and means for connecting the other terminal of the laser diode to ground.

Claim 3

A laser module as recited in claim 1 comprising a thermoelectric cooler supporting only the laser substrate for temperature control thereof.

Claim 4

A laser module as recited in claim 2 comprising a thermistor mounted on the laser substrate for control of the thermoelectric cooler.

Claim 5

A laser module as recited in claim 1 comprising a laser bias circuit on the connection substrate and connected to the non-grounded terminal of the laser diode.

Claim 6

A laser module as recited in claim 4 wherein the means for connecting the bias circuit and resistor to a terminal of the laser diode comprises a metallized pad on the laser substrate connected to the laser diode; a metallized pad on the connection substrate connected to the bias circuit; and at least one wire bonded between such pads.

Claim 7

A laser module as recited in claim 5 wherein the means for connecting a terminal of the laser diode to ground comprises: a metallized pad on the laser substrate connected to a terminal of the laser diode; a metallized pad on the connection substrate connected to ground; and at least one wire bonded to both of the pads.

Claim 8

A laser module as recited in claim 6 wherein the grounded pad on the connection substrate is electrically connected to the module housing.

Claim 9

A laser module as recited in claim 1 wherein the means for bringing an electrical signal through the housing and applying the signal to the lead line comprises a coaxial connector external to the module, a pin extending through a wall of the module and means for connecting the pin to the lead line.

Claim 10

A laser module as recited in claim 8 wherein the pin is directly bonded to the lead line.

Claim 11

A laser module as recited in claim 1 wherein the optical fiber is soldered to the laser substrate.

Claim 12

A laser module as recited in claim 10 comprising a trench in the laser substrate between the laser diode and the solder connection of the optical fiber.

Claim 13

A laser module as recited in claim 1 wherein the housing is a grounded metal can.

Claim 14

A laser module as recited in claim 1 wherein the means for matching impedance comprises a resistor deposited on such a substrate and having sufficient resistance for matching a fifty ohm external circuit.

Claim 15

A laser module as recited in claim 1 comprising a photodiode in the housing adjacent to the junction of the laser for monitoring light emitted by the laser diode.

Claim 16

A laser module as recited in claim 14 wherein the photodiode is mounted on a bridge straddling the metallized lead line on the connection substrate.

Claim 17

A laser module as recited in claim 1 comprising laser bias circuit on such a substrate, the bias circuit comprising a signal isolating resistor deposited on such a substrate in series with the laser diode and a laser bias voltage connector pin external to the module; and capacitive coupling to ground between the bias voltage pin and the signal isolating resistor for further isolating the signal from the bias circuit.

Claim 18

A semiconductor laser module comprising: a grounded metal housing; an optical fiber hermetically sealed through a wall of the housing; a coaxial electric connector on the housing including a pin hermetically sealed through a wall of the housing; an electrical connector having a plurality of connector pins hermetically sealed through a wall of the housing; a ceramic laser substrate rigidly mounted in the housing; a semiconductor laser diode mounted on the laser substrate; means for rigidly securing the optical fiber to the laser substrate with an end in alignment with the laser junction of the laser diode; a separate ceramic connection substrate rigidly mounted in the housing; a metallized ground pad on the connection substrate and electrically connected to the housing; means for electrically interconnecting the ground pad and one terminal of the laser diode; a laser bias circuit deposited on the connection substrate; a signal lead line deposited on the connection substrate and connected to the laser bias circuit by an impedance matching resistor deposited on the connection substrate; means for connecting the pin to the lead line; and means for connecting the laser bias circuit and impedance matching resistor to the other terminal of the laser diode.

Claim 19

A semiconductor laser module comprising: a grounded metal housing; an optical fiber hermetically sealed through a wall of the housing; a coaxial electric connector on the housing including a pin hermetically sealed through a wall of the housing; an electrical connector having a plurality of connector pins hermetically sealed through a wall of the housing; a ceramic laser substrate rigidly mounted in the housing; a semiconductor laser diode mounted on the laser substrate; means for rigidly securing the optical fiber to the laser substrate with an end in alignment with the laser junction of the laser diode; a separate ceramic connection substrate rigidly mounted in the housing; a metallized ground pad on the connection substrate and electrically connected to the housing; means for electrically interconnecting the ground pad and one terminal of the laser diode; a laser bias circuit deposited on the connection substrate; a signal lead line deposited on the connection substrate and connected to the laser bias circuit by an impedance matching resistor deposited on the connection substrate; means for connecting the pin to the lead line; and means for connecting the laser bias circuit and impedance matching resistor to the other terminal of the laser diode.

Claim 20

A laser module as recited in claim 17 comprising a thermoelectric cooler supporting the laser substrate for temperature control thereof.

Claim 21

A laser module as recited in claim 18 comprising a thermistor mounted on the laser substrate for control of the thermoelectric cooler.

Claim 22

A laser module as recited in claim 17 comprising a photodiode in the housing adjacent to the junction of the laser for monitoring light emitted by the laser diode.

Claim 23

A laser module as recited in claim 20 wherein the photodiode is mounted on a bridge straddling the metallized lead line on the connection substrate.

Claim 24

A semiconductor laser module comprising: a housing; a laser substrate in the housing; a semiconductor laser diode mounted on the laser substrate; an optical fiber soldered to the laser substrate with an end in alignment with the junction of the laser; a separate connection substrate in the housing; a metallized lead line on the connection substrate; means for applying an external electrical signal to the lead line; means for matching impedance of the external electrical signal and the laser diode connected between one lead of the laser diode and the lead line; a laser bias circuit deposited on the connection substrate and electrically connected to the lead line and the laser diode; and means for connecting the other terminal of the laser diode to ground.

Claim 25

A semiconductor laser module comprising: a housing; a laser substrate in the housing; a semiconductor laser diode mounted on the laser substrate; an optical fiber soldered to the laser substrate with an end in alignment with the junction of the laser; a separate connection substrate in the housing; a metallized lead line on the connection substrate; means for applying an external electrical signal to the lead line; means for matching impedance of the external electrical signal and the laser diode connected between one lead of the laser diode and the lead line; a laser bias circuit deposited on the connection substrate and electrically connected to the lead line and the laser diode; and means for connecting the other terminal of the laser diode to ground.

Claim 26

A laser module as recited in claim 22 comprising a thermoelectric cooler supporting the laser substrate for temperature control thereof.

Claim 27

A laser module as recited in claim 23 comprising a thermistor mounted on the laser substrate for control of the thermoelectric cooler.

Claim 28

A laser module as recited in claim 22 wherein the means for applying an electrical signal to the lead line comprises a coaxial connector external to the module, a pin extending through a wall of the module and means for connecting the pin to the lead line.