Flip chip module

Claim 2

A flip chip module comprising: a film having solder receptor pads and interconnect lines, said film further, having folding areas; a plurality of dice bonded to specific ones of said solder receptor pads; a plurality of pin headers bonded to specific ones of said solder receptor pads; a heat radiating cover for covering said film including said plurality of dice, said film being folded at said folding areas and disposed within said heat radiating cover; and compressible means for holding said plurality of dice in contact with said heat radiating cover.

Claim 3

The flip chip module of claim 1 wherein the film is comprised of a polyimide material.

Claim 4

The flip chip module of claim 1 further comprising plated through-holes at various points along the interconnect lines.

Claim 5

The flip chip module of claim 1 having means for stress relief in the folding areas of the film.

Claim 6

The flip chip module of claim 1 wherein the plurality of dice and the plurality of pin headers face opposite directions after the film has been folded at the folding areas.

Claim 7

The flip chip module of claim 1 further comprising an insulating layer disposed between at least some of the plurality of dice and the heat radiating cover.

Claim 8

The flip chip module of claim 1 wherein the heat radiating cover is removable.

Claim 9

The flip chip module of claim 1 wherein the heat radiating cover is comprised of copper.

Claim 10

The flip chip module of claim 1 wherein the heat radiating cover is comprised of aluminum.

Claim 11

The flip chip module of claim 1 wherein compressable means includes a coil spring.

Claim 12

The flip chip module of claim 1 wherein compressable means includes a resilient foam.

Claim 13

The flip chip module of claim 1 wherein the plurality of dice are one of epoxied and bonded to said heat radiating cover.

Claim 14

The flip chip module of claim 1 wherein said flip chip module is hermetically sealed.

Claim 15

A flip chip module comprising: a polyimide film having solder receptor pads, interconnect lines and plated through-holes, said film further having folding areas including stress relief means; a plurality of dice bonded to specific ones of said solder receptor pads; a plurality of pin headers bonded to specific ones of said solder receptor pads; a removable metal heat radiating cover for covering said film including said plurality of dice, after said film has been folded at said folding areas; an insulating layer disposed between said plurality of dice and said metal heat radiating cover; and spring means for retaining said plurality of dice flush against said insulating layer and in turn, keeping said insulating layer flush against said metal heat radiating cover.

Claim 16

A flip chip module comprising: a polyimide film having solder receptor pads, interconnect lines and plated through-holes, said film further having folding areas including stress relief means; a plurality of dice bonded to specific ones of said solder receptor pads; a plurality of pin headers bonded to specific ones of said solder receptor pads; a removable metal heat radiating cover for covering said film including said plurality of dice, after said film has been folded at said folding areas; an insulating layer disposed between said plurality of dice and said metal heat radiating cover; and spring means for retaining said plurality of dice flush against said insulating layer and in turn, keeping said insulating layer flush against said metal heat radiating cover.

Claim 17

The flip chip module of claim 14 wherein the plurality of dice and the plurality of pin headers face opposite direction after the film has been folded at the folding areas.

Claim 18

The flip chip module of claim 14 wherein the spring means is a coil spring.

Claim 19

The flip chip module of claim 14 wherein the spring means is a resilient foam.

Claim 20

The flip chip module of claim 14 wherein said flip chip module is hermetically sealed.