Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
69 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one layer of electrical resistance material adhering to the support layer; and a conductive material layer adhering to the resistance material layer, the electrical resistance material layer comprising an electroplated nickel-phosphorous composition wherein at least the top about ten atomic layers of the electrical resistance material layer are free of sulfur.
Claim 2
Dependent Claim
69 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one layer of electrical resistance material adhering to the support layer; and a conductive material layer adhering to the resistance material layer, the electrical resistance material layer comprising an electroplated nickel-phosphorous composition wherein at least the top about ten atomic layers of the electrical resistance material layer are free of sulfur.
Claim 3
Dependent Claim
25 words
The printed circuit board material of claim 1 wherein the conductive material layer comprises copper foil and the support layer comprises a reinforced organic resin.
Claim 4
Dependent Claim
19 words
The printed circuit board material of claim 1 wherein the conductive material layer consists of high topographical copper foil.
Claim 5
Dependent Claim
27 words
The printed circuit board material of claim 1 wherein the surface of the electrical resistance layer is substantially pit free and continuous at a magnification of 400×.
Claim 6
Dependent Claim
40 words
A composition for an electrical resistance material layer in a multilayered printed circuit board comprising electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus and wherein at least the top about ten atomic layers are sulfur free.
Claim 7
Dependent Claim
40 words
A composition for an electrical resistance material layer in a multilayered printed circuit board comprising electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus and wherein at least the top about ten atomic layers are sulfur free.
Claim 8
Dependent Claim
24 words
An electrical resistance material layer according to claim 5 wherein there is present from about 8 to about 30 percent by weight of phosphorus.
Claim 9
Dependent Claim
62 words
In a multilayered printed circuit board material having an insulating support layer, an electrical resistance material layer and a conductive material layer, wherein the electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus, the improvement wherein the surface of the electrical resistance layer is substantially pit free and continuous at a magnification of 400×.
Claim 10
Dependent Claim
62 words
In a multilayered printed circuit board material having an insulating support layer, an electrical resistance material layer and a conductive material layer, wherein the electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus, the improvement wherein the surface of the electrical resistance layer is substantially pit free and continuous at a magnification of 400×.
Claim 11
Dependent Claim
26 words
A circuit board material according to claim 7 wherein at least the top about ten atomic layers of the electrical resistance material layer are sulfur free.
Claim 12
Dependent Claim
18 words
A circuit board material according to claim 8 wherein the electrical resistance material layer is substantially sulfur free.
Claim 13
Dependent Claim
28 words
A circuit board material according to claim 7 wherein the top about ten atomic layers of the electrical resistance material layer contain less than 2% by weight sulfur.