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US4808967A Expired / Lapsed US ⏱️ 0.0 years remaining

Circuit board material

Assignee: Ohmega Electronics Inc
•
Filing: 1985-05-29
•
Granted: 1989-02-28
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Expires: 2005-05-29
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Abstract

Abstract A multilayered circuit board material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer is formed from electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.

Inventors

  • 👤 James M. Rice
  • 👤 Bruce P. Mahler

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 14:24
CPC Classifications
H; H01; H01C; H01C7/00; H01C7/006; C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/562; H01C17/00; H01C17/06; H01C17/075; H01C17/14; H01C17/16; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/00; H05K3/02; H05K3/022; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/12847; Y10T428/12854

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 69 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one layer of electrical resistance material adhering to the support layer; and a conductive material layer adhering to the resistance material layer, the electrical resistance material layer comprising an electroplated nickel-phosphorous composition wherein at least the top about ten atomic layers of the electrical resistance material layer are free of sulfur.
Claim 2
Dependent Claim 69 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one layer of electrical resistance material adhering to the support layer; and a conductive material layer adhering to the resistance material layer, the electrical resistance material layer comprising an electroplated nickel-phosphorous composition wherein at least the top about ten atomic layers of the electrical resistance material layer are free of sulfur.
Claim 3
Dependent Claim 25 words
The printed circuit board material of claim 1 wherein the conductive material layer comprises copper foil and the support layer comprises a reinforced organic resin.
Claim 4
Dependent Claim 19 words
The printed circuit board material of claim 1 wherein the conductive material layer consists of high topographical copper foil.
Claim 5
Dependent Claim 27 words
The printed circuit board material of claim 1 wherein the surface of the electrical resistance layer is substantially pit free and continuous at a magnification of 400×.
Claim 6
Dependent Claim 40 words
A composition for an electrical resistance material layer in a multilayered printed circuit board comprising electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus and wherein at least the top about ten atomic layers are sulfur free.
Claim 7
Dependent Claim 40 words
A composition for an electrical resistance material layer in a multilayered printed circuit board comprising electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus and wherein at least the top about ten atomic layers are sulfur free.
Claim 8
Dependent Claim 24 words
An electrical resistance material layer according to claim 5 wherein there is present from about 8 to about 30 percent by weight of phosphorus.
Claim 9
Dependent Claim 62 words
In a multilayered printed circuit board material having an insulating support layer, an electrical resistance material layer and a conductive material layer, wherein the electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus, the improvement wherein the surface of the electrical resistance layer is substantially pit free and continuous at a magnification of 400×.
Claim 10
Dependent Claim 62 words
In a multilayered printed circuit board material having an insulating support layer, an electrical resistance material layer and a conductive material layer, wherein the electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30 percent by weight of phosphorus, the improvement wherein the surface of the electrical resistance layer is substantially pit free and continuous at a magnification of 400×.
Claim 11
Dependent Claim 26 words
A circuit board material according to claim 7 wherein at least the top about ten atomic layers of the electrical resistance material layer are sulfur free.
Claim 12
Dependent Claim 18 words
A circuit board material according to claim 8 wherein the electrical resistance material layer is substantially sulfur free.
Claim 13
Dependent Claim 28 words
A circuit board material according to claim 7 wherein the top about ten atomic layers of the electrical resistance material layer contain less than 2% by weight sulfur.

References Cited (Backward Citations)

US2643221A Cited
US3077442A Cited
US3743583A Cited
US3808576A Cited
US3857683A Cited
US4554219A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-02-28 1992-08-29 1993-02-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-02-28 1996-08-29 1997-02-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-02-28 2000-08-29 2001-02-28 $7700.00 Window Closed / Lapsed

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