US4814944A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting structure for surface mounted type component with projection extending down from lower surface thereof and method of mounting a surface mounted type component on a printed circuit board
Assignee: Omron Corp
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Filing: 1988-07-13
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Granted: 1989-03-21
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Expires: 2008-07-13
Abstract
Abstract In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection. The projection may extend from a central portion of the bottom surface of the component, or may be provided in plurality as extending from central portions of edges of said bottom surface. And the end of the projection may be roughened.
Inventors
- 👤 Hiroyuki Sagawa
- 👤 Hirofumi Koga
- 👤 Shunichi Agatahama
- 👤 Hideyuki Okumura
- 👤 Kazushige Matsuoka
- 👤 Ryuichi Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 16:09
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H01; H01H; H01H1/00; H01H1/58; H01H2001/5888; H01H50/00; H01H50/02; H01H50/04; H01H50/041; H01H50/043; H01H2050/044; H01H50/14; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10053; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10628; H05K2201/10689; H05K2201/10954; H05K2201/10969; H05K2201/20; H05K2201/2036; H05K3/38; H05K3/381; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
108 words
A mounting structure for a surface mounted type electronic component, comprising: at least one terminal protruding from bottom surface thereof and terminating in a foot portion which is mounted on and soldered to a printed circuit board; and at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the projection has a bonding agent coupled thereto for allowing the projection to be provisionally bonded to the circuit board, wherein the terminal and the projection are positioned and extend toward the same surface of the printed circuit board.
Claim 2
Dependent Claim
108 words
A mounting structure for a surface mounted type electronic component, comprising: at least one terminal protruding from bottom surface thereof and terminating in a foot portion which is mounted on and soldered to a printed circuit board; and at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the projection has a bonding agent coupled thereto for allowing the projection to be provisionally bonded to the circuit board, wherein the terminal and the projection are positioned and extend toward the same surface of the printed circuit board.
Claim 3
Dependent Claim
23 words
A mounting structure for a surface mounted type electronic component according to claim 1, wherein the end portion of said projection is roughened.
Claim 4
Dependent Claim
30 words
A mounting structure for a surface mounted type electronic component according to claim 1, wherein said projection extends from a central portion of said bottom surface of said electronic component.
Claim 5
Dependent Claim
40 words
A mounting structure for a surface mounted type electronic component according to claim 1, wherein a plurality of said projections are provided, each extending from a central portion of a side edge of said bottom surface of said electronic component.
Claim 6
Dependent Claim
55 words
A mounting structure for a surface mounted type electronic component according to claim 2, said component comprising a base portion and a cover portion fitted over said base portion, wherein said projection extends from a central portion of a face of said base portion which is included in said bottom surface of said electronic component.
Claim 7
Dependent Claim
68 words
A mounting structure for a surface mounted type electronic component according to claim 4, said component comprising a base portion and a cover portion fitted over said base portion, wherein said projections each extend from a central portion of a side edge of said cover portion which is included in said bottom surface of said electronic component when the cover portion is fully fitted over the base portion.
Claim 8
Dependent Claim
31 words
mounting structure for a surface mounted type electronic component according to claim 5, wherein said projection is hollowed out so as to contribute to the internal space within said electronic component.
Claim 9
Dependent Claim
156 words
A mounting method for securing a surface mounted type electronic component to a printed circuit board with a circuit board with a circuit portion thereon, comprising the steps of: providing at least one terminal protruding from a bottom surface thereof and terminating in a foot portion; providing at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the projection has a bonding agent coupled thereto, and wherein the steps of providing the terminal and the projection comprises the steps of positioning and extending the terminal and the projection toward the same surface of the printed circuit board; mounting said foot portion to said circuit portion; provisionally securing the projection to said printed circuit board with said foot portion of said terminal overlaying said circuit portion; and thereafter soldering said foot portion to said circuit portion.
Claim 10
Dependent Claim
156 words
A mounting method for securing a surface mounted type electronic component to a printed circuit board with a circuit board with a circuit portion thereon, comprising the steps of: providing at least one terminal protruding from a bottom surface thereof and terminating in a foot portion; providing at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the projection has a bonding agent coupled thereto, and wherein the steps of providing the terminal and the projection comprises the steps of positioning and extending the terminal and the projection toward the same surface of the printed circuit board; mounting said foot portion to said circuit portion; provisionally securing the projection to said printed circuit board with said foot portion of said terminal overlaying said circuit portion; and thereafter soldering said foot portion to said circuit portion.
Claim 11
Dependent Claim
33 words
A mounting method for a surface mounted type electronic component according to claim 8 wherein the step of providing a projection comprises the step of providing a projection having a roughened end portion.
Claim 12
Dependent Claim
42 words
A mounting method for a surface mounted type electronic component according to claim 8, wherein the step of providing a projection comprises the step of providing a projection which extends from a central portion of said bottom surface of said electronic component.
Claim 13
Dependent Claim
49 words
A mounting method for a surface mounted type electronic component according to claim 8, wherein the step of providing a projection comprises the step of providing a plurality of said projections, each extending from a central portion of a side edge of said bottom surface of said electronic component.
Claim 14
Dependent Claim
74 words
A mounting method for a surface mounted type electronic component according to claim 9, further comprises the step of providing a base portion and a cover portion for the component fitted over said base portion, and wherein the step of providing a projection comprises the step of providing a projection which extends from a central portion of a face of said base portion which is included in said bottom surface of said electronic component.
Claim 15
Dependent Claim
87 words
A mounting method for a surface mounted type electronic component according to claim 11, further comprises the step of providing a base portion and a cover portion for the component fitted over said base portion, and wherein the step of providing said projections comprises the step providing said projections in which each extends from a central portion of a side edge of said cover portion which is included in said bottom surface of said electronic component when the cover portion is fully fitted over the base portion.
Claim 16
Dependent Claim
34 words
A mounting method for a surface mounted type electronic component according to claim 8, wherein the step of providing a projection having a bonding agent being a thermosetting adhesive which is cured by heat.
Claim 17
Dependent Claim
51 words
A mounting methiod for a surface mounted type electronic component according to claim 8, wherein the step of providing a projection having a bonding agent comprises the step of providing a projection having a bonding agent being an ultraviolet light setting typoe adhesive which is cured by shining ultraviolet light thereon.
Claim 18
Dependent Claim
112 words
A mounting structure for a surface mounted type electronic component, comprising: at least one terminal protruding from a bottom surface thereof and terminating in a foot portion which is mounted on and soldered to a printed circuit board; and at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the printed circuit board has a bonding agent coated thereon for allowing the projection to be provisionally bonded to the printed circuit board, wherein the terminal and the projection are postioned and extend toward the same surface of the printed circuit board.
Claim 19
Dependent Claim
112 words
A mounting structure for a surface mounted type electronic component, comprising: at least one terminal protruding from a bottom surface thereof and terminating in a foot portion which is mounted on and soldered to a printed circuit board; and at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the printed circuit board has a bonding agent coated thereon for allowing the projection to be provisionally bonded to the printed circuit board, wherein the terminal and the projection are postioned and extend toward the same surface of the printed circuit board.
Claim 20
Dependent Claim
156 words
A mounting method for securing a surface mounted type electronic component to a printed circuit board with a circuit portion thereon, comprising the steps of: providing at least one terminal protruding from a bottom surface of said component and terminating in a foot portion; providing at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the printed circuit board has a bonding agent coated thereon, and wherein the steps of providing the terminal and the projection comprises the steps of positioning and extending the terminal and the projection toward the same surface of the printed circuit board; mounting said foot portion to said circuit portion; provisionally securing the projection to said printed circuit board with said foot portion of said terminal overlaying said circuit portion; and thereafter soldering said foot portion to said circuit portion.
Claim 21
Dependent Claim
156 words
A mounting method for securing a surface mounted type electronic component to a printed circuit board with a circuit portion thereon, comprising the steps of: providing at least one terminal protruding from a bottom surface of said component and terminating in a foot portion; providing at least one projection extending from said bottom surface of said electronic component for a distance generally less than the amount by which said terminal projects from said bottom surface, wherein the printed circuit board has a bonding agent coated thereon, and wherein the steps of providing the terminal and the projection comprises the steps of positioning and extending the terminal and the projection toward the same surface of the printed circuit board; mounting said foot portion to said circuit portion; provisionally securing the projection to said printed circuit board with said foot portion of said terminal overlaying said circuit portion; and thereafter soldering said foot portion to said circuit portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-20 | 1992-09-19 | 1993-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-20 | 1996-09-19 | 1997-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-20 | 2000-09-19 | 2001-03-21 | $7700.00 | Window Closed / Lapsed |