US4816426A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for manufacturing plastic pin grid arrays and the product produced thereby
Assignee: Olin Corp
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Filing: 1987-05-21
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Granted: 1989-03-28
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Expires: 2007-05-21
Abstract
Abstract A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.
Inventors
- 👤 William G. Bridges
- 👤 Thomas A. Armer
- 👤 Kin-Shiung Chang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:27
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0442; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1076; H05K7/1084; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
152 words
The process of forming an integrated circuit pin grid array package, comprising the steps of: (a) providing an interconnect tape defining a metal interconnect circuit pattern, said tape having first and second opposing surfaces, said circuit pattern defining a plurality of leads; (b) forming a plurality of holes in said metal circuit pattern; (c) providing a plurality of terminal pins; (d) disposing said interconnect tape into a mold: (e) either before or after step (d) a terminal pin through each of said holes whereby said terminal pins extend outward from both the first and second opposing surfaces of said interconnect tape; (f) closing the mold so that a cavity is formed about said terminal pins and said tape; and (g) molding a polymer resin about said pins and tape to at least partially surround and support said terminal pins and tape, said molding step comprising filling the cavity with said polymer resin.
Claim 2
Dependent Claim
152 words
The process of forming an integrated circuit pin grid array package, comprising the steps of: (a) providing an interconnect tape defining a metal interconnect circuit pattern, said tape having first and second opposing surfaces, said circuit pattern defining a plurality of leads; (b) forming a plurality of holes in said metal circuit pattern; (c) providing a plurality of terminal pins; (d) disposing said interconnect tape into a mold: (e) either before or after step (d) a terminal pin through each of said holes whereby said terminal pins extend outward from both the first and second opposing surfaces of said interconnect tape; (f) closing the mold so that a cavity is formed about said terminal pins and said tape; and (g) molding a polymer resin about said pins and tape to at least partially surround and support said terminal pins and tape, said molding step comprising filling the cavity with said polymer resin.
Claim 3
Dependent Claim
67 words
The process of claim 1 wherein said terminal pin includes a pin head disposed at one end of the terminal pin, a shoulder about said terminal pin and a groove between said shoulder and the pin head, said pin head being slightly greater in diameter than said holes so that when said pin head is inserted into said hole, said tape is mechanically locked into said groove.
Claim 4
Dependent Claim
28 words
The process of claim 2 including the step of inserting said terminal pins into said holes prior to the step of disposing said interconnect tape into said mold.
Claim 5
Dependent Claim
28 words
The process of claim 2 including the step of inserting said terminal pins into said holes subsequent to the step of disposing said interconnect tape in said mold.
Claim 6
Dependent Claim
49 words
The process of claim 4 wherein the step of inserting said terminal pins includes the steps of: supporting said terminal pins in said mold; and pressing said interconnect tape against said terminal pins whereby said terminal pins are inserted into said holes and mechanically locked to said interconnect tape.
Claim 7
Dependent Claim
45 words
The process of claim 5 including the steps of: providing said terminal pins supported by a plastic carrier; inserting said terminal pins and carrier into the mold; and removing said carrier from said terminal pins and mold without removing said terminal pins from said mold.
Claim 8
Dependent Claim
20 words
The process of claim 2 including the step of bonding said plurality of terminal pins to said metal circuit pattern.
Claim 9
Dependent Claim
85 words
The process of claim 7 wherein the step of bonding includes the steps of: providing said terminal pins with a solder coating on each of the pin heads; providing a solder coating on at least a first surface of said interconnect circuit pattern adjacent each of said plurality of holes; and heating said terminal pins and said interconnect circuit pattern to reflow said solder coating on said terminal pins and said metal interconnect circuit pattern to bond said terminal pins to said metal circuit pattern.
Claim 10
Dependent Claim
89 words
The process of claim 2 wherein the step of providing said interconnect tape includes the steps of: providing said interconnect tape with said metal circuit pattern bonded to a flexible nonmetallic substrate; forming a plurality of holes in said nonmetallic substrate overlying said plurality of holes in said metal circuit pattern; and forming at least one aperture in said flexible nonmetallic substrate, said aperture arranged so that said leads extend to at least said aperture whereby the leads are adapted to be electrically connected with an integrated circuit device.
Claim 11
Dependent Claim
21 words
The process of claim 9 wherein said polymer resin is selected from the group consisting of thermoset and thermoplastic polymer resins.
Claim 12
Dependent Claim
28 words
The process of claim 10 wherein said polymer resin is a thermoset polymer resin selected from the group consisting of epoxies, 1-2 polybutadienes, silicone, poly(bismaleimides) and polyimide polymers.
Claim 13
Dependent Claim
31 words
The process of claim 10 wherein said polymer resin is a thermoplastic polymer resin selected from the group consisting of polyphenylsulfide, polysulfone, polyarylether, polyamide, polyether ketone, polyethersulfone, polyetherimide and fluoro polymers.
Claim 14
Dependent Claim
22 words
The process of claim 10 wherein said step of molding is selected from the group consisting of transfer molding and injection molding.
Claim 15
Dependent Claim
133 words
The process of claim 13 wherein said mold includes: a base component having a recess with a first base surface, said first surface having a plurality of holes for receiving said terminal pins; and a cover component abutting against said base component for enclosing said recess and forming said cavity, said cover component having a first projection extending into said cavity, said first projection having an outer surface for contacting said tape and a central surface to extend through the aperture in said tape whereby said step of molding forms a package having embedded tape and pins with only the portion of the tape surface disposed against the outer surface of the first projection being free of the polymer resin, said package also having a recess adapted to receive an integrated circuit device.
Claim 16
Dependent Claim
35 words
The process of claim 14 including the steps of: inserting an integrated circuit device in said recess; electrically interconnecting said integrated circuit device to said leads; and sealing said integrated circuit device within said recess.
Claim 17
Dependent Claim
24 words
The process of claim 15 including the steps of: providing a sealing cap to cover said recess; and sealing said recess with said cap.
Claim 18
Dependent Claim
108 words
The process of claim 13 wherein said mold includes: a base component having a recess with a first base surface, said first base surface having a plurality of holes for receiving said terminal pins; said base component having a second projection extending into said cavity for supporting the leads of said tape; and a cover component abutting agaist said base component for enclosing said cavity, said cover component having a first projection etending into said cavity and abutting against said second projection whereby said step of molding forms a package having embedded tape and pins with a centrally disposed integrated circuit device connect recess extending through the package.
Claim 19
Dependent Claim
41 words
The process of claim 17 including the steps of: constructing said leads to extend over said aperture in cantilever fashion; inserting an integrated circuit device in said recess; electrically interconnecting said integrated circuit device to said leads; and sealing said recess.
Claim 20
Dependent Claim
26 words
The process of claim 18 including the steps of: providing lid and base sealing caps to cover said recess; and sealing said recess with said caps.
Claim 21
Dependent Claim
68 words
The process of claim 13 wherein said mold includes: a base component having a recess with a first base surface, said first base surface having a plurality of holes for receiving said terminal pins; and a cover component abutting against said base component for enclosing said recess and forming said cavity whereby said molding step forms a package having the tape and pins embedded in the polymer resin.
Claim 22
Dependent Claim
27 words
The process of claim 20 including the steps of: inserting an integrated circuit device in said recess; and electrically interconnecting said integrated circuit device to said leads.
Claim 23
Dependent Claim
105 words
The process of claim 13 wherein said mold includes: a base component having a recess with a first base surface, said first base surface having a plurality of holes for receiving said terminal pins; and a cover component abutting against said base component for enclosing said recess and forming said cavity, said cover component having a plurality of indentations in an inner surface to receive the ends of said terminal pins whereby the upper surface of the metal interconnect circuit pattern contacts the inner surface of said cover component and prevents polymer resin from substantially covering the upper surface of the metal interconnect circuit pattern.
Claim 24
Dependent Claim
21 words
The process of claim 22 further including the step of bonding said plurality of terminal pins to said metal circuit pattern.
Claim 25
Dependent Claim
34 words
The process of claim 23 including the steps of: providing an electronic device package having a plurality of leads; and bonding said plurality of leads to the leads of said metal interconnect circuit pattern.
Claim 26
Dependent Claim
25 words
The process of claim 24 wherein said integrated pin grid array package is an adapter adapted to connect said electronic package to a circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-27 | 1992-09-26 | 1993-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-27 | 1996-09-26 | 1997-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-27 | 2000-09-26 | 2001-03-28 | $7700.00 | Window Closed / Lapsed |