Electron multiplier device

Claim 2

An electron multiplier device comprising: an insulating substrate having opposite first and second substrate surfaces which are parallel with each other, a plurality of through-holes in said substrate having first through-hole surfaces at an obtuse angle with respect to said first substrate surfaces and second through-hole surfaces opposing said first through-hole surfaces, a secondary electron emission layer formed on said first through-hole surfaces, a conductive layer formed on of non-electron emissive materials the second through-hole surface of each respective through-hole separated from the secondary electron emission layer of the respective through-hole, first connection means to connect said secondary electron emission layer of each through-hole to a respective first DC voltage supply through said first substrate surface, and second connection means to connect said conductive layer of each through-hole to a respective second DC voltage supply through said second substrate surface, whereby electrons incident on said through-holes passing through said first substrate surface and impinging on said secondary electron emission layer are multiplied and accelerated toward the second substrate surface when the DC voltage of the first and second DC voltage supplies are respectively connected by said first and second connection means to said secondary emission layer and said conductive layer of each through-hole and the DC voltage of the second DC voltage supply is greater than the DC voltage of the first DC voltage supply.

Claim 3

An electron multiplier device as claimed in claim (1), wherein each through-hole is one of circular, rectangular, and hexagonal in said first substrate surface and the through-holes are closely and regularly arranged.

Claim 4

An electron multiplier device as claimed in claim 1, wherein said insulating substrate is made of SiO 2 and said through-holes are formed by photoetching.

Claim 5

An electron multiplier device as claimed in claim 1, wherein said substrate has a groove formed between and insulating from each other said secondary electron emission layer and said conductive layer in each through-hole.

Claim 6

An electron multiplier as in claim 1, further comprising first and second DC voltage supplies respectively connected by said first and second connecting means to said secondary electron emission layer and said conductive layer, and the DC voltage of the second DC voltage source is greater than the DC voltage of the first DC voltage source.

Claim 7

An electron multiplier device, comprising: a plurality of successively adjacent dinode leaves successively layered on each other, including an upper first leaf and a second leaf, one directly adjacent the other, each of said plurality of leaves including an insulating substrate having opposite first and second substrate surfaces which are parallel with each other, a plurality of through-holes in said substrate, each of said through-holes being inclined to said first and second substrate surfaces and having a first through-hole surface intersecting said first substrate surface at an obtuse angle and a second through-hole surface opposing said first through-hole surface and intersecting said second substrate surface at an obtuse angle, a secondary electron emission layer formed on said first through-hole surfaces, a conductive layer of non-electron emissive materials formed on the second through-hole surface of each respective through-hole separated from the secondary electron emission layer of the respective through-hole, first connection means to connect said secondary electron emission layer of each through-hole to a respective first DC voltage supply associated with the respective leaf, through said first substrate surface, and second connection means to connect said conductive layer of each through-hole to a respective second DC voltage supply associated with the respective leaf, through said second substrate surface, the second connection means of said first leaf being electrically connected to the first connection means of said second leaf so that the conductive layer of each through-hole of said first leaf is at the same electrical potential as the electron emission layer of each through-hole of said second leaf; the respective through-holes of each leaf being aligned with a respective one of the through-holes in each leaf adjacent thereto, the aligned through-holes of adjacent leaves being inclined in opposite directions; whereby electrons incident on each through-hole of said first leaf passing through the first substrate surface thereof and impinging on said secondary electron emission layer are multiplied and accelerated toward the second substrate surface of said first leaf when the first and second DC voltage supplies associated with said first leaf are respectively connected by said first and second connection means to said secondary electron emission layer and said conductive layer of each through-hole and the DC voltage of the second DC voltage supply is greater than the DC voltage of the first DC voltage supply, the electrons accelerated toward the second substrate surface of said first leaf being incident of the through-hole of said second leaf and impinging on the secondary electron emission layer thereof and being further multiplied and accelerated toward the second substrate surface of said second leaf when the first and second DC voltage supplies associated with said second leaf are respectively connected to said first and second connection means of said second leaf to said secondary electron emission layer of said second leaf and said conductive layer of each through-hole of said second leaf, and the DC voltage of the second DC voltage supply associated with said second leaf is greater than the DC voltage of the first DC voltage supply associated with said second leaf, the DC voltage of the second DC voltage supply associated with said first leaf being equal to the DC voltage of the first DC voltage supply associated with said second leaf.

Claim 8

An electron multiplier device, comprising: a plurality of successively adjacent dinode leaves successively layered on each other, including an upper first leaf and a second leaf, one directly adjacent the other, each of said plurality of leaves including an insulating substrate having opposite first and second substrate surfaces which are parallel with each other, a plurality of through-holes in said substrate, each of said through-holes being inclined to said first and second substrate surfaces and having a first through-hole surface intersecting said first substrate surface at an obtuse angle and a second through-hole surface opposing said first through-hole surface and intersecting said second substrate surface at an obtuse angle, a secondary electron emission layer formed on said first through-hole surfaces, a conductive layer of non-electron emissive materials formed on the second through-hole surface of each respective through-hole separated from the secondary electron emission layer of the respective through-hole, first connection means to connect said secondary electron emission layer of each through-hole to a respective first DC voltage supply associated with the respective leaf, through said first substrate surface, and second connection means to connect said conductive layer of each through-hole to a respective second DC voltage supply associated with the respective leaf, through said second substrate surface, the second connection means of said first leaf being electrically connected to the first connection means of said second leaf so that the conductive layer of each through-hole of said first leaf is at the same electrical potential as the electron emission layer of each through-hole of said second leaf; the respective through-holes of each leaf being aligned with a respective one of the through-holes in each leaf adjacent thereto, the aligned through-holes of adjacent leaves being inclined in opposite directions; whereby electrons incident on each through-hole of said first leaf passing through the first substrate surface thereof and impinging on said secondary electron emission layer are multiplied and accelerated toward the second substrate surface of said first leaf when the first and second DC voltage supplies associated with said first leaf are respectively connected by said first and second connection means to said secondary electron emission layer and said conductive layer of each through-hole and the DC voltage of the second DC voltage supply is greater than the DC voltage of the first DC voltage supply, the electrons accelerated toward the second substrate surface of said first leaf being incident of the through-hole of said second leaf and impinging on the secondary electron emission layer thereof and being further multiplied and accelerated toward the second substrate surface of said second leaf when the first and second DC voltage supplies associated with said second leaf are respectively connected to said first and second connection means of said second leaf to said secondary electron emission layer of said second leaf and said conductive layer of each through-hole of said second leaf, and the DC voltage of the second DC voltage supply associated with said second leaf is greater than the DC voltage of the first DC voltage supply associated with said second leaf, the DC voltage of the second DC voltage supply associated with said first leaf being equal to the DC voltage of the first DC voltage supply associated with said second leaf.

Claim 9

An electron multiplier device as in claim 6, wherein said substrate of each of said leaves has a groove formed between and insulating from each other said secondary electron emission layer and said conductive layer in each through-hole.

Claim 10

An electron multiplier device as in claim 6, further comprising a first leaf first DC voltage supply connected by said first connecting means of said first leaf to said secondary electron emission layer of said first leaf, a first leaf second DC voltage supply connected by said second connecting means of said first leaf to said conductive layer of said first leaf and by said secondary electron emission layer of said second leaf to said secondary electron emission layer of said second leaf, and a second leaf DC voltage supply connected by said second connecting means of said second leaf to said conductive layer of said second leaf, the DC voltage of said first leaf first voltage supply being less than the DC voltage of said second leaf voltage source.

Claim 11

An electron multiplier device as in claim 8, wherein said substrate of each of said leaves has a groove formed between and insulating from each other said secondary electron emission layer and said conductive layer in each through-hole.

Claim 12

An electron multiplier device as in claim 6, wherein the first connecting means and second connecting means of each leaf are respectively formed on the first substrate surface and second substrate surface thereof, so as to respectively make direct physical and electrical contact with the second connecting means and first connecting means of respective ones of said leaves directly adjacent thereto.

Claim 13

An electron multiplier device as in claim 6, wherein said conductive layer is formed of inactive conductive materials.