Method of producing a flexible circuit and master grid therefor

Claim 3

A method as in claim 1 including the step of perforating said insulating layer adjacent to said switch arrays in said established circuit path to provide for said physical separation.

Claim 4

A method as in claim 1 including the step or providing a paper mock-up pattern of said flexible circuit before said step of selectively interrupting.

Claim 5

A method as in claim 1 where included in said grid patterns are line switches formed as strip conductors on said flexible insulating layer forming part of said conductive path means between adjacent switch arrays and including the step of utilizing said line switches to remap the arrangement of the matrix of parallel conductors between a pair of switch arrays.

Claim 6

A method as in claim 1 where there are, in said planar grid pattern, at least three adjacent switch arrays with respect to some of said switch arrays and where in said interrupting step said conductive path means is interrupted for two of said adjacent switch arrays.

Claim 7

A flexible circuit master grid comprising: an elongated flexible insulating layer; a grid pattern of switch arrays on said flexible insulating layer, all of which lie in a common plane, with each of said switch arrays having a matrix of parallel conductors electrically connected by conductive path means to conductor matrices of adjacent switch arrays, each of said switch arrays including means for selectively interrupting some of said conductive path means to at least one of said adjacent switch arrays whereby a circuit path is established by the remaining uninterrupted conductive means.

Claim 8

A flexible circuit master grid comprising: an elongated flexible insulating layer; a grid pattern of switch arrays on said flexible insulating layer, all of which lie in a common plane, with each of said switch arrays having a matrix of parallel conductors electrically connected by conductive path means to conductor matrices of adjacent switch arrays, each of said switch arrays including means for selectively interrupting some of said conductive path means to at least one of said adjacent switch arrays whereby a circuit path is established by the remaining uninterrupted conductive means.

Claim 9

A flexible circuit master grid as in claim 5 where said elongated layer is a continuous roll having said grid pattern thereon.

Claim 10

A flexible circuit master grid as in claim 7 wherein said grid pattern includes a plurality of line switch means carried by said insulating layer and located between adjacent switch arrays forming part of said conductive means for allowing remapping of said parallel conductors of said switch arrays.

Claim 11

A flexible circuit master grid as in claim 8 including a circuit mounting area on said insulating layer and where said line switch means include circuit connection pad means adjacent to said circuit mounting area on said insulating layer for connection to electrical circuit components mounted on said area.

Claim 12

A flexible circuit master grid as in claim 6 where said interrupting means includes an aperture through said insulating layer underlying each of said matrix of parallel conductors.

Claim 13

A flexible circuit master grid comprising: an elongated flexible insulating layer; a grid pattern of conductive arrays on said flexible insulating layer, said grid pattern being composed of a checkerboard-like arrangement of said arrays with a typical array having other adjacent arrays at its top and bottom and left and right all lying in the same plane; each of said arrays having first and second parallel sets of conductors with the sets being orthogonal and with said first set on one side of said flexible insulating layer and said second set on the other side of said flexible insulating layer; connecting means extending through said insulating layer for respectively permanently connecting each conductor of said first set of conductors of each of said arrays to a corresponding conductor of said second set of conductors of said same array; said master grid including means for electrically interconnecting said typical array to said other arrays above and below and to the left and right.

Claim 14

A flexible circuit master grid comprising: an elongated flexible insulating layer; a grid pattern of conductive arrays on said flexible insulating layer, said grid pattern being composed of a checkerboard-like arrangement of said arrays with a typical array having other adjacent arrays at its top and bottom and left and right all lying in the same plane; each of said arrays having first and second parallel sets of conductors with the sets being orthogonal and with said first set on one side of said flexible insulating layer and said second set on the other side of said flexible insulating layer; connecting means extending through said insulating layer for respectively permanently connecting each conductor of said first set of conductors of each of said arrays to a corresponding conductor of said second set of conductors of said same array; said master grid including means for electrically interconnecting said typical array to said other arrays above and below and to the left and right.

Claim 15

A circuit master grid as in claim 11 where said means for interconnecting said arrays includes contact pads associated with each conductor of said first and second set.

Claim 16

A method of providing a flexible circuit from a master grid as described in claim 11 comprising the step of physically cutting adjacent arrays apart to form a predetermined planar pattern including the step of cutting said means for electrically interconnecting said arrays.

Claim 17

A method as in claim 13 where said master grid includes registration holes and where a base with posts is provided and including the step of placing said master grid on said posts before cutting.

Claim 18

A method as in claim 14 where said cutting is done by punching and where said base includes a soft backing and including the step of punching through said master grid to permanently embed the punched out portion in said soft backing.

Claim 19

A method as in claim 13 including the step of cutting another flexible circuit from said master grid in addition and similar to said one and in a similar planar configuration and sandwiching said two flexible circuits together with electrical insulation between them.