Method of making a LDD mosfet
Abstract
Abstract A method (FIG. 3) for producing MOS transistors of the type having shallow, lightly doped, source/drain structure. In this method sidewall fillets (7) of n-type doped dielectric material are defined adjacent to the sides of the oxide (1) and metal electrode (3) features. These fillets (7) are then employed to provide self aligned masking during implantation of heavy dopant of either n- or p- type (9; 13). In a subsequent rapid anneal step, the implant dopant is activated and n-type dopant diffused into the substrate (5) from the fillets (7) to provide lightly doped source/drain structures (11; 15). Examples of this method are described for producing phosphorus-arsenic n - /n + are phosphorus-boron p - /p + source/drain structures.
Inventors
- 👤 David J. Foster
- 👤 Andrew J. Pickering
Bibliographic Details
Claims Analysis
Total Claims: 7References Cited (Backward Citations)
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