US4858077A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board
Assignee: Hitachi Ltd
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Filing: 1988-11-25
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Granted: 1989-08-15
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Expires: 2008-11-25
Abstract
Abstract A condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the individual throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearances therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes can reduce electric noises owing to the presence of the condenser without impairing the signal transmission speed, when applied to a board for a large-scale electronic computer, thereby making the computing speed faster than the conventional one.
Inventors
- 👤 Hiroichi Shinohara
- 👤 Hideo Suzuki
- 👤 Satoru Ogihara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 05:12
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/772; H10W44/00; H10W44/601; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0187; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4061; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H10W70/65; H10W70/654; H10W70/655; H10W70/67; H10W70/68; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/073; H10W72/07331; H10W72/07337; H10W72/20; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
159 words
A semiconductor module which comprises a multi-layer board, a carrier board provided on the multi-layer board and a semiconductor device provided on the carrier board, the carrier board being a condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the corresponding throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearances therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes.
Claim 2
Dependent Claim
159 words
A semiconductor module which comprises a multi-layer board, a carrier board provided on the multi-layer board and a semiconductor device provided on the carrier board, the carrier board being a condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the corresponding throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearances therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes.
Claim 3
Dependent Claim
29 words
A semiconductor module according to claim 1, wherein the distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges is 5 to 200 μm.
Claim 4
Dependent Claim
26 words
A semiconductor module according to claim 1, wherein the ceramic insulating material and the ceramic dielectric condenser material are sinterable at not more than 1,000° C.
Claim 5
Dependent Claim
28 words
A semiconductor module according to claim 1, wherein the conductor for the electrode, circuit and throughholes is a metal or alloy sinterable at not more than 1,000° C.
Claim 6
Dependent Claim
130 words
A condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the individual throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearances therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes.
Claim 7
Dependent Claim
130 words
A condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the individual throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearances therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes.
Claim 8
Dependent Claim
32 words
A condenser-containing, ceramic multi-layer circuit board according to claim 5, wherein the distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges is 5 to 200 μm.
Claim 9
Dependent Claim
29 words
A condenser-containing, ceramic multi-layer circuit board according to claim 5, wherein the ceramic insulating material and the ceramic dielectric condenser material are sinterable at not more than 1,000° C.
Claim 10
Dependent Claim
31 words
A condenser-containing, ceramic multi-layer circuit board according to claim 5, wherein the conductor for the electrode, circuit and throughholes is a metal or alloy sinterable at not more than 1,000° C.
Claim 11
Dependent Claim
162 words
A computer which comprises a semiconductor module which comprises a multi-layer board, a carrier board provided on the multi-layer board and a semiconductor device provided on the carrier board, the carrier board being a condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the corresponding throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearance therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes.
Claim 12
Dependent Claim
162 words
A computer which comprises a semiconductor module which comprises a multi-layer board, a carrier board provided on the multi-layer board and a semiconductor device provided on the carrier board, the carrier board being a condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the corresponding throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearance therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes.
Claim 13
Dependent Claim
28 words
A computer according to claim 9, wherein the distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges is 5 to 200 μm.
Claim 14
Dependent Claim
25 words
A computer according to claim 9, wherein the ceramic insulating material and the ceramic dielectric condenser material are sinterable at not more than 1,000° C.
Claim 15
Dependent Claim
27 words
A computer according to claim 9, wherein the conductor for the electrode, circuit and throughholes is a metal or alloy sinterable at not more than 1,000° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-14 | 1993-02-13 | 1993-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-14 | 1997-02-13 | 1997-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-14 | 2001-02-13 | 2001-08-15 | $7700.00 | Window Closed / Lapsed |