US4859614A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing semiconductor device with leads adhered to supporting insulator sheet
Assignee: Fujitsu Ltd
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Filing: 1987-11-30
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Granted: 1989-08-22
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Expires: 2007-11-30
Abstract
Abstract A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.
Inventors
- 👤 Takehisa Sugahara
- 👤 Toyokatu Nakagawa
- 👤 Junichi Yano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 20:11
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W70/40; H10W70/453; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1084; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
138 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing a package containing a semiconductor chip and having one-piece lead frames made of a single type of electrically conductive material, each said lead frame comprising: a supporting end portion; and plural leads, each of said leads having two ends, one end of each lead coupled to said semiconductor chip and the other end of each lead coupled to each other via said supporting end portion for supporting said leads; adhering said supporting end portion of each of said lead frames and a part of each of said leads to an insulating sheet; and clipping off portions of said insulating sheet and said supporting end portion of each of said lead frames adhering thereto, leaving said leads supported by said parts thereof adhering to said insulating sheet.
Claim 2
Independent Claim
138 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing a package containing a semiconductor chip and having one-piece lead frames made of a single type of electrically conductive material, each said lead frame comprising: a supporting end portion; and plural leads, each of said leads having two ends, one end of each lead coupled to said semiconductor chip and the other end of each lead coupled to each other via said supporting end portion for supporting said leads; adhering said supporting end portion of each of said lead frames and a part of each of said leads to an insulating sheet; and clipping off portions of said insulating sheet and said supporting end portion of each of said lead frames adhering thereto, leaving said leads supported by said parts thereof adhering to said insulating sheet.
Claim 3
Independent Claim
163 words
A method for manufacturing and testing semiconductor devices, comprising the steps of: preparing a package containing a semiconductor chip and having one-piece lead frames made of a single type of electrically conductive material, each said lead frames comprising: a supporting end portion; and plural leads, each of said leads having two ends, one end of each lead coupled to said semiconductor chip and the other end of each lead coupled to each other via said supporting end portion for supporting said leads; adhering said supporting end portion of each of said lead frames and a part of each of said leads to an insulating sheet; clipping off portions of said insulating sheet to which said supporting end portion of each of said lead frames are adhered, along with said supporting end portion, wherein said leads remain supported by said parts thereof adhering to said insulating sheet; and testing and semiconductor device by contacting measuring probes to said leads supported by said insulating sheet.
Claim 4
Independent Claim
163 words
A method for manufacturing and testing semiconductor devices, comprising the steps of: preparing a package containing a semiconductor chip and having one-piece lead frames made of a single type of electrically conductive material, each said lead frames comprising: a supporting end portion; and plural leads, each of said leads having two ends, one end of each lead coupled to said semiconductor chip and the other end of each lead coupled to each other via said supporting end portion for supporting said leads; adhering said supporting end portion of each of said lead frames and a part of each of said leads to an insulating sheet; clipping off portions of said insulating sheet to which said supporting end portion of each of said lead frames are adhered, along with said supporting end portion, wherein said leads remain supported by said parts thereof adhering to said insulating sheet; and testing and semiconductor device by contacting measuring probes to said leads supported by said insulating sheet.
Claim 5
Dependent Claim
23 words
A method as set forth in claim 1 or 2, further comprising the step of attaching a cooling fin assembly to said package.
Claim 6
Dependent Claim
15 words
A method as set forth in claim 1 or 2, wherein said leads are "L"-shaped.
Claim 7
Dependent Claim
18 words
A method as set forth in claim 1 or 2, wherein said insulating sheet comprises a plastic film.
Claim 8
Dependent Claim
16 words
A method as set forth in claim 1 or 2, wherein said insulating sheet comprises paper.
Claim 9
Dependent Claim
28 words
A method as set forth in claim 1 or 2, wherein said insulating sheet comprises a non-woven fabric formed from glass fibers and at least one resinous material.
Claim 10
Dependent Claim
56 words
The method of claim 2, wherein said clipping off of said portions of said insulating sheet results in a plurality of holes in said insulating sheet, each corresponding to a respective group of said leads, and said leads of said package are aligned for said testing by means including further holes provided in said insulating sheet.
Claim 11
Dependent Claim
27 words
The method of claim 8, wherein said adhering of said lead frames to said insulating sheet involves located said package in an opening in said insulating sheet.
Claim 12
Dependent Claim
32 words
The method of claim 9, comprising further clipping said insulating sheet after said testing, to leave a respective portion of said insulating sheet adhering to and supporting each said group of leads.
Claim 13
Dependent Claim
18 words
The method of claim 10, comprising mounting said package on a printed circuit board after said further clipping.
Claim 14
Dependent Claim
32 words
The method of claim 9, 10 or 11, wherein said contacting of said measuring probes to said leads occurs in the vicinity of the edge of said opening in said insulating sheet.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-21 | 1993-02-20 | 1993-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-21 | 1997-02-20 | 1997-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-21 | 2001-02-20 | 2001-08-22 | $7700.00 | Window Closed / Lapsed |