Integrated acoustic receiver or projector

Claim 2

An acoustic element assembly for an acoustic transducer, comprising: a substrate; micro-electronic circuitry formed in a center section of said substrate and being integral therewith; bidirectional movement means for permitting bidirectional movement of said center section of said substrate; two piezoelectric ceramic elements, each of said elements having a positively poled surface and a negatively poled surface, said elements being bonded to opposite sides of said substrate with a non-conductive material; contact pads formed on opposite sides of said substrate, said piezoelectric ceramic elements being electrically connected to said contact pads with a conductive bonding material; and conductive lines formed on opposite sides of said substrate for electrically connecting said piezoelectric ceramic elements to said micro-electronic circuitry.

Claim 3

An acoustic element assembly as recited in claim 1 wherein said bidirectional movement means comprises slots cut through said substrate, said slots positioned around the periphery of said micro-electronic circuitry, said slots permitting bidirectional movement of said center section of said substrate.

Claim 4

An acoustic element assembly as recited in claim 1, further comprising a glass dielectric coated over said conductive lines, said glass dielectric insulating said conductive lines from said piezoelectric ceramic elements.

Claim 5

An acoustic element assembly as recited in claim 1 wherein said contact pads are comprised of two groups, a first group of contact pads consisting of pads which are electrically connected to said positively poled surface of said piezoelectric ceramic elements, a second group of contact pads consisting of pads which are electrically connected to said negatively poled surface of said piezoelectric ceramic elements.

Claim 6

An acoustic assembly as recited in claim 4 further comprising a means for interconnecting a first contact pad selected from said first group of contact pads with a second contact pad selected from said second group of contact pads.

Claim 7

An acoustic element assembly as recited in claim 1 wherein said piezoelectric elements are hemispherically shaped.

Claim 8

An acoustic element assembly as recited in claim 1 wherein said piezoelectric elements are cylindrically shaped.

Claim 9

An acoustic element assembly as recited in claim 7 further comprising a protective cover positioned over said micro-electronic circuitry formed in said center section of said substrate.

Claim 10

An acoustic element assembly as recited in claim 1 wherein said substrate comprises an alumina ceramic disk.

Claim 11

An acoustic element assembly for an acoustic transducer, comprising: a disk shaped substrate with slots cut therethrough at a selected radial distance; micro-electronic circuitry formed on first and second sides of said substrate in a center section, said micro-electronic circuitry being integral with said substrate, said center section being positioned inside said selected radial distance; two hollow piezoelectric ceramic cylinders having larger inside diameters than said selected radial distance, a first of said cylinders having a positively poled outside surface and a negatively poled inside surface, a second of said cylinders having a positively poled inside surface and a negatively poled outside surface, said first cylinder being bonded with a non-conductive material to said first side of said substrate, said second cylinder being bonded with said nonconductive material to said second side of said substrate; contact pads formed on said first and second sides of said substrate, said first and second cylinders being electrically connected to said contact pads with a conductive bonding material; conductive lines formed on said first and second sides of said substrate for electrically connecting said first and second cylinders to said micro-electronic circuitry; and protective covers for protecting said microelectronic circuitry, said covers bonded to said first and second sides of said substrate, said protective covers having a diameter smaller than said selected radial distance.

Claim 12

An acoustic element assembly for an acoustic transducer, comprising: a disk shaped substrate with slots cut therethrough at a selected radial distance; micro-electronic circuitry formed on first and second sides of said substrate in a center section, said micro-electronic circuitry being integral with said substrate, said center section being positioned inside said selected radial distance; two hollow piezoelectric ceramic cylinders having larger inside diameters than said selected radial distance, a first of said cylinders having a positively poled outside surface and a negatively poled inside surface, a second of said cylinders having a positively poled inside surface and a negatively poled outside surface, said first cylinder being bonded with a non-conductive material to said first side of said substrate, said second cylinder being bonded with said nonconductive material to said second side of said substrate; contact pads formed on said first and second sides of said substrate, said first and second cylinders being electrically connected to said contact pads with a conductive bonding material; conductive lines formed on said first and second sides of said substrate for electrically connecting said first and second cylinders to said micro-electronic circuitry; and protective covers for protecting said microelectronic circuitry, said covers bonded to said first and second sides of said substrate, said protective covers having a diameter smaller than said selected radial distance.

Claim 13

An acoustic element assembly as recited in claim 10 wherein said substrate is comprised of alumina ceramic.

Claim 14

An acoustic element assembly as recited in claim 10 further comprising a glass dielectric coated over said conductive lines, said glass dielectric insulating said conductive lines from said first and second piezoelectric cylinders.

Claim 15

An acoustic element assembly as recited in claim 10 wherein said contact pads are comprised of two groups, a first group of contact pads consisting of pads which are electrically connected to said outside surfaces of said first and second cylinders, a second group of contact pads consisting of pads which are electrically connected to said inside surfaces of said first and second cylinders.

Claim 16

An acoustic element assembly as recited in claim 13 further comprising a means for interconnecting said second group of contact pads.

Claim 17

An automated method for manufacturing an acoustic element assembly for a hydrophone, comprising the steps of: cutting slots in a circular disk, said slots being a selected radial distance from the center of said circular disk; fabricating micro-electronic circuitry on a first and second side of said disk, said microelectronic circuitry being fabricated inside said selected radial distance; forming contact pads at a position outside said selected radial distance, a first pair of said contact pads being connected to said micro-electronic circuitry by conductive lines formed on said disk, said first pair of contact pads being positioned on opposite sides of said disk, a second pair of said contact pads being electrically interconnected, said second pair of contact pads being positioned on opposite sides of said disk; and bonding a pair of piezoelectric elements on opposite sides of said disk, said elements being bonded to said disk at a position outside said selected radial distance, said elements being bonded to said contact pads with a conductive bonding material and being bonded to bare portions of said disk with a non-conductive bonding material.

Claim 18

An automated method for manufacturing an acoustic element assembly for a hydrophone, comprising the steps of: cutting slots in a circular disk, said slots being a selected radial distance from the center of said circular disk; fabricating micro-electronic circuitry on a first and second side of said disk, said microelectronic circuitry being fabricated inside said selected radial distance; forming contact pads at a position outside said selected radial distance, a first pair of said contact pads being connected to said micro-electronic circuitry by conductive lines formed on said disk, said first pair of contact pads being positioned on opposite sides of said disk, a second pair of said contact pads being electrically interconnected, said second pair of contact pads being positioned on opposite sides of said disk; and bonding a pair of piezoelectric elements on opposite sides of said disk, said elements being bonded to said disk at a position outside said selected radial distance, said elements being bonded to said contact pads with a conductive bonding material and being bonded to bare portions of said disk with a non-conductive bonding material.