US4872260A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making pre-formed lead-ins for an IC package
Assignee: Osram Sylvania Inc
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Filing: 1988-01-19
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Granted: 1989-10-10
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Expires: 2008-01-19
Abstract
Abstract Lead-ins for IC packages are pre-formed before attachment to a package substrate. The process comprises forming lead-in segments in continuous strip with the lead-ins being maintained in position by oppositely disposed, removable rails. A segment is separated from the strip and one end of the lead-ins is formed into, e.g., a "J" shape. One rail is removed during the forming process. The last rail is not removed until the segment is mounted upon a substrate.
Inventors
- 👤 Robert R. Johnson
- 👤 Robert S. Orbanic
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:35
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
184 words
The method of making pre-formed lead-ins for an IC package comprising, in sequence, the steps of: (a) preparing a longitudinal strip containing a plurality of substantially identical lead frame segments, each lead frame segment having a multiplicity of lead-ins connected to opposing, first and second continuous rails, said lead-ins having spaces therebetween with the spaces being wider adjacent said second rail than adjacent said first rail; (b) removing from between segments a section of said second rail; (c) forming a first right angled bend in said lead-ins of said lead-frame segment, adjacent said second rail to provide a normal portion of said lead-ins; (d) forming a second right angled bend in said normal portion of said lead-ins of said lead-frame segment to form a bight and a parallel portion of said lead-ins; (e) removing said second rail; and (f) forming a re-entrant portion in said parallel portion of said leads of said lead-frame segment to substantially complete said pre-formed lead-ins; (g) separating said lead-frame segment from said strip; (h) affixing said lead-frame segment to a lead frame support; and (i) removing said first rail.
Claim 2
Independent Claim
184 words
The method of making pre-formed lead-ins for an IC package comprising, in sequence, the steps of: (a) preparing a longitudinal strip containing a plurality of substantially identical lead frame segments, each lead frame segment having a multiplicity of lead-ins connected to opposing, first and second continuous rails, said lead-ins having spaces therebetween with the spaces being wider adjacent said second rail than adjacent said first rail; (b) removing from between segments a section of said second rail; (c) forming a first right angled bend in said lead-ins of said lead-frame segment, adjacent said second rail to provide a normal portion of said lead-ins; (d) forming a second right angled bend in said normal portion of said lead-ins of said lead-frame segment to form a bight and a parallel portion of said lead-ins; (e) removing said second rail; and (f) forming a re-entrant portion in said parallel portion of said leads of said lead-frame segment to substantially complete said pre-formed lead-ins; (g) separating said lead-frame segment from said strip; (h) affixing said lead-frame segment to a lead frame support; and (i) removing said first rail.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-09 | 1993-04-10 | 1993-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-09 | 1997-04-10 | 1997-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-09 | 2001-04-10 | 2001-10-10 | $7700.00 | Window Closed / Lapsed |