US4875138A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Variable pitch IC bond pad arrangement
Assignee: Frontgrade Colorado Springs LLC
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Filing: 1988-06-24
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Granted: 1989-10-17
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Expires: 2008-06-24
Abstract
Abstract The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic at variable pitch with the bond pad widths (47) increasing as a function of the distance (49) of each pad from an alignment point (40), whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the alignment point (40) of the package have the narrowest width.
Inventors
- 👤 Michael D. Cusack
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 09:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H10W70/01; H10W70/05; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/094; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
81 words
A ceramic package comprising: a ceramic substrate of ceramic having a shrinkage tolerance during firing; a plurality of spaced bond pads for registration with an electric circuit module; a selected alignment point associated with said bond pads; said bond pads having varying widths increasing incrementally from a minimum width adjacent to said alignment point through a plurality of spaced pads beyond the pad closest to said alignment point to a maximum width for the pad located furthest from said alignment point.
Claim 2
Dependent Claim
81 words
A ceramic package comprising: a ceramic substrate of ceramic having a shrinkage tolerance during firing; a plurality of spaced bond pads for registration with an electric circuit module; a selected alignment point associated with said bond pads; said bond pads having varying widths increasing incrementally from a minimum width adjacent to said alignment point through a plurality of spaced pads beyond the pad closest to said alignment point to a maximum width for the pad located furthest from said alignment point.
Claim 3
Dependent Claim
23 words
A ceramic package as in claim 1: said plurality of spaced pads located with substantially equal spacing between adjacent edges of adjacent pads.
Claim 4
Dependent Claim
22 words
A ceramic package as in claim 1: said selected alignment point being at the center of said plurality of spaced bond pads.
Claim 5
Dependent Claim
22 words
A ceramic package as in claim 1: said selected alignment point being at the center of said plurality of spaced bond pads.
Claim 6
Dependent Claim
114 words
A ceramic package and electric circuit module comprising: a ceramic package including a substrate of ceramic having a shrinkage tolerance during firing; a plurality of spaced bond pads on said ceramic packaging; a plurality of spaced bond pads on said electric circuit module for registration with said bond pads on said ceramic package; a selected alignment point associated with each of said plurality of bond pads; one of said plurality of bond pads having varying widths increasing incrementally from a minimum width adjacent to said alignment point through a plurality of spaced pads beyond the pad closest to said alignment point to a maximum width for the pad located furthest from said alignment point.
Claim 7
Dependent Claim
114 words
A ceramic package and electric circuit module comprising: a ceramic package including a substrate of ceramic having a shrinkage tolerance during firing; a plurality of spaced bond pads on said ceramic packaging; a plurality of spaced bond pads on said electric circuit module for registration with said bond pads on said ceramic package; a selected alignment point associated with each of said plurality of bond pads; one of said plurality of bond pads having varying widths increasing incrementally from a minimum width adjacent to said alignment point through a plurality of spaced pads beyond the pad closest to said alignment point to a maximum width for the pad located furthest from said alignment point.
Claim 8
Dependent Claim
30 words
A ceramic package and electric circuit module as in claim 5: said one of said plurality of spaced pads located with substantially equal spacing between adjacent edges of adjacent pads.
Claim 9
Dependent Claim
28 words
A ceramic package and electric circuit module as in claim 6: said selected alignment point being at the center of each of said plurality of spaced bond pads.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-16 | 1993-04-17 | 1993-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-16 | 1997-04-17 | 1997-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-16 | 2001-04-17 | 2001-10-17 | $7700.00 | Window Closed / Lapsed |