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US4877718A Expired / Lapsed US ⏱️ 0.0 years remaining

Positive-working photosensitive polyimide operated by photo induced molecular weight changes

Assignee: International Business Machines Corp
•
Filing: 1988-09-26
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Granted: 1989-10-31
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Expires: 2008-09-26
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Abstract

Abstract An insoluble photosensitive polyimide having the formula ##STR1## can be exposed by a pattern of light to render the exposed areas soluble. The exposed areas can then be dissolved using a solvent to leave the pattern which can be used directly as an insulator layer in a semiconductor device. A process for preparing the photosensitive soluble polyimide utilizes maleic anhydride which is irradiated by ultraviolet light to form a cyclobutane unit which is reacted with oxydianiline to form polymic acid. The polymic acid is cured using heat into the photosensitive soluble polyimide.

Inventors

  • 👤 James A. Moore
  • 👤 Andrew N. Dasheff
  • 👤 Frank B. Kaufman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 23:28
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/039; Y; Y10; Y10S; Y10S430/00; Y10S430/1053; Y10S430/1055; Y10S430/106; Y10S430/107

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 61 words
A method of forming a patterned layer for a semiconductor structure comprising: forming a layer of insoluble polyimide having the formula: ##STR5## irradiating the layer with a pattern of ultraviolet light to produce exposed and unexposed areas in the layer, the exposed areas becoming soluble; and dissolving the exposed areas from the layer using a solvent to form the patterned layer.
Claim 2
Independent Claim 61 words
A method of forming a patterned layer for a semiconductor structure comprising: forming a layer of insoluble polyimide having the formula: ##STR5## irradiating the layer with a pattern of ultraviolet light to produce exposed and unexposed areas in the layer, the exposed areas becoming soluble; and dissolving the exposed areas from the layer using a solvent to form the patterned layer.
Claim 3
Dependent Claim 14 words
A method according to claim 1 wherein the solvent is a polar aprotic solvent.
Claim 4
Dependent Claim 35 words
A method according to claim 1 including irradiating the layer with ultraviolet light having a wavelength from about 230 to 254 nm and an incident dosage of from about 10 to 1000 mJ/cm 2 .
Claim 5
Dependent Claim 42 words
A method according to claim 1 wherein the insoluble polyimide is formed by irradiating maleic anhydride to form cyclobutane tetracarboxylic dianhydride, reacting the cyclobutane tetracarboxylic dianhydride with oxydianiline to form polyamic acid and curing the polyamic acid to form the insoluble polyimide.
Claim 6
Dependent Claim 18 words
A method according to claim 4 including curing the polyamic acid into polyimide by heating the polyamic acid.
Claim 7
Dependent Claim 30 words
A method according to claim 5 including reacting the cyclobutane tetracarboxylic dianhydride with the oxydianiline in the presence of a solvent chosen from a group consisting of dimethylformamide and dimethylacetamide.

References Cited (Backward Citations)

US4112139A Cited
US4568632A Cited
US4579809A Cited
US4414059A Cited
EP0130481A1 Cited
US4508749A Cited
US4612275A Cited
US4655874A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-10-30 1993-05-01 1993-10-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-10-30 1997-05-01 1997-10-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-10-30 2001-05-01 2001-10-31 $7700.00 Window Closed / Lapsed

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