US4887758A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for connecting external leads
Assignee: Shinkawa Ltd
•
Filing: 1989-01-26
•
Granted: 1989-12-19
•
Expires: 2009-01-26
Abstract
Abstract An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.
Inventors
- 👤 Yasunobu Suzuki
- 👤 Motohiko Kato
- 👤 Akio Bando
- 👤 Hisao Ishida
- 👤 Akihiro Nishimura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:28
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; H10W; H10W72/00; H10W72/01; H10W72/0198; H10W72/701
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
247 words
An apparatus for connecting external leads comprising: a punch-out means which removes solid-state devices from a film carrier by punching them out; a raising and lowering arm provided with a suction-adhesion head which holds said punched-out devices by suction adhesion; a lead frame feeding means which feeds lead frames, on which said solid-state devices are to be mounted, along a predetermined path; an X-Y table which carries said raising and lowering arm and moves longitudinally and laterally so that it conveys said raising and lowering arm to a point above a first bonding station on said lead frame conveyance path; a vertical driving mechanism provided on said X-Y table, said vertical driving mechanism driving.said raising and lowering arm up and down; a first bonding means provided on said first bonding station and equipped with a bonding tool which has an escape part formed therein so that it does not interfere with the suction-adhesion head part of said raising and lowering arm, said first bonding tool simultaneously bonding the leads provided along two opposite sides of each of said solid-state device to one of said lead frames while said solid-state device is pressed against said lead frame by said suction-adhesion head; and a second bonding means provided on a second bonding station on said lead frame conveyance path, said second bonding means being provided with a bonding tool which simultaneously bonds leads provided on the other two opposite sides of each solid-state device to the said lead frame.
Claim 2
Independent Claim
247 words
An apparatus for connecting external leads comprising: a punch-out means which removes solid-state devices from a film carrier by punching them out; a raising and lowering arm provided with a suction-adhesion head which holds said punched-out devices by suction adhesion; a lead frame feeding means which feeds lead frames, on which said solid-state devices are to be mounted, along a predetermined path; an X-Y table which carries said raising and lowering arm and moves longitudinally and laterally so that it conveys said raising and lowering arm to a point above a first bonding station on said lead frame conveyance path; a vertical driving mechanism provided on said X-Y table, said vertical driving mechanism driving.said raising and lowering arm up and down; a first bonding means provided on said first bonding station and equipped with a bonding tool which has an escape part formed therein so that it does not interfere with the suction-adhesion head part of said raising and lowering arm, said first bonding tool simultaneously bonding the leads provided along two opposite sides of each of said solid-state device to one of said lead frames while said solid-state device is pressed against said lead frame by said suction-adhesion head; and a second bonding means provided on a second bonding station on said lead frame conveyance path, said second bonding means being provided with a bonding tool which simultaneously bonds leads provided on the other two opposite sides of each solid-state device to the said lead frame.
Claim 3
Independent Claim
300 words
An apparatus for connecting external leads comprising: a punch-out means which removes solid-state devices from a film carrier by punching them out; a raising and lowering arm provided with a suction-adhesion head which holds said punched-out devices by suction adhesion; a lead frame feeding means which conveys lead frames, to which said devices are to be mounted, along a predetermined path; an X-Y table which carries said raising and lowering arm and moves longitudinally and laterally so that it conveys said raising and lowering arm to a point above a first bonding station on said lead frame conveyance path; a vertical driving mechanism provided on said X-Y table, said vertical driving mechanism driving said raising and lowering arm up and down; a first bonding means provided on said first bonding station and equipped with a bonding tool which has an escape part formed thereon so that it does not interfere with the suction-adhesion head part of said raising and lowering arm, said bonding tool simultaneously bonding the leads provided along two opposite sides of each of said solid-state devices to one of said lead frames while said solid-state device is pressed against said lead frame by said suction-adhesion head; a second bonding means provided on a second bonding station on said lead frame conveyance path, said second bonding means being provided with a bonding tool which simultaneously bonds leads provided on the other two opposite sides of said solid-state device to said lead frame; a first camera installed above a transfer path of each of said solid-state device held by said suction-adhesion head, said first camera detecting any discrepancy in the position of said solid-state device; and a second camera installed directly above said first bonding position, said second camera detecting any discrepancy in the position of said lead frame.
Claim 4
Independent Claim
300 words
An apparatus for connecting external leads comprising: a punch-out means which removes solid-state devices from a film carrier by punching them out; a raising and lowering arm provided with a suction-adhesion head which holds said punched-out devices by suction adhesion; a lead frame feeding means which conveys lead frames, to which said devices are to be mounted, along a predetermined path; an X-Y table which carries said raising and lowering arm and moves longitudinally and laterally so that it conveys said raising and lowering arm to a point above a first bonding station on said lead frame conveyance path; a vertical driving mechanism provided on said X-Y table, said vertical driving mechanism driving said raising and lowering arm up and down; a first bonding means provided on said first bonding station and equipped with a bonding tool which has an escape part formed thereon so that it does not interfere with the suction-adhesion head part of said raising and lowering arm, said bonding tool simultaneously bonding the leads provided along two opposite sides of each of said solid-state devices to one of said lead frames while said solid-state device is pressed against said lead frame by said suction-adhesion head; a second bonding means provided on a second bonding station on said lead frame conveyance path, said second bonding means being provided with a bonding tool which simultaneously bonds leads provided on the other two opposite sides of said solid-state device to said lead frame; a first camera installed above a transfer path of each of said solid-state device held by said suction-adhesion head, said first camera detecting any discrepancy in the position of said solid-state device; and a second camera installed directly above said first bonding position, said second camera detecting any discrepancy in the position of said lead frame.
Claim 5
Dependent Claim
29 words
An apparatus for connecting external leads according to claim 2 wherein said first camera picks up an image of shadows of said external leads via light applied from underneath.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-18 | 1993-06-19 | 1993-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-18 | 1997-06-19 | 1997-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-18 | 2001-06-19 | 2001-12-19 | $7700.00 | Window Closed / Lapsed |