US4900501A
Expired / Lapsed
US
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Method and apparatus for encapsulating semi-conductors
Assignee: Renesas Technology Corp
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Filing: 1986-10-30
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Granted: 1990-02-13
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Expires: 2006-10-30
Abstract
Abstract A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavities being filled with a molding resin fed under pressure from said pots, with a part to be molded placed in each cavity. The process and apparatus of this invention prevent the molding defects resulting from the excessive flow resistance of resin and greatly improves the use efficiency of resin.
Inventors
- 👤 Junichi Saeki
- 👤 Aizo Kaneda
- 👤 Masakazu Ozawa
- 👤 Takashi Nakagawa
- 👤 Kunihiko Nishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 07:49
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H10P; H10P72/00; H10P72/04; H10P72/0448; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/01; H10W72/0198; B29C45/17; B29C45/26; B29C45/27; B29C45/2701; B29C45/2708; B29C2045/2712; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
161 words
In a method for producing resin-encapsulated semiconductors the steps comprising; providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at an end of each runner, wherein a first cavity in each series located at the nearest position from a pot is connected to a runner through a gate, and each further cavity in each series is connected to each adjacent cavity in each series only through a slit formed as a flow channel in a lead frame interposed between a top part and a bottom part of said mold; discharging said resin from said pots into said runners such that said resin is fed only to said first cavity of each series through said gate; and discharging said resin from a cavity to an adjacent cavity only through said slit sequentially up to the last cavity in each series.
Claim 2
Dependent Claim
161 words
In a method for producing resin-encapsulated semiconductors the steps comprising; providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at an end of each runner, wherein a first cavity in each series located at the nearest position from a pot is connected to a runner through a gate, and each further cavity in each series is connected to each adjacent cavity in each series only through a slit formed as a flow channel in a lead frame interposed between a top part and a bottom part of said mold; discharging said resin from said pots into said runners such that said resin is fed only to said first cavity of each series through said gate; and discharging said resin from a cavity to an adjacent cavity only through said slit sequentially up to the last cavity in each series.
Claim 3
Independent Claim
116 words
An apparatus for producing resin-molded semiconductors which comprises a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, each of said runners being connected directly only to a first of said cavities in an associated series, a first of said cavities in each series being connected with one of said runners through a gate, and further of said cavities in each series being connectable with adjacent cavities in each series only through slits formed in a lead frame interposed between a top part and a bottom part of said mold.
Claim 4
Independent Claim
116 words
An apparatus for producing resin-molded semiconductors which comprises a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, each of said runners being connected directly only to a first of said cavities in an associated series, a first of said cavities in each series being connected with one of said runners through a gate, and further of said cavities in each series being connectable with adjacent cavities in each series only through slits formed in a lead frame interposed between a top part and a bottom part of said mold.
Claim 5
Independent Claim
134 words
An apparatus for producing resin-encapsulated semiconductors which comprises a mold having a plurality of pots from which a resin is fed under pressure, mutually independent runners extending from each pot, a plurality of cavities serially disposed at the end of each runner, each of said runners being connected directly only to a first of said cavities in an associated series, the mold having a top part and a bottom part, said top part and said bottom part being provided so as to hold a lead frame interposed therebetween, the top and bottom mold parts being provided such that a lead frame having a plurality of lead frame sections each associated with a chip, said lead frame sections being arranged to extend in two directions, can be held between the top and bottom mold parts.
Claim 6
Independent Claim
134 words
An apparatus for producing resin-encapsulated semiconductors which comprises a mold having a plurality of pots from which a resin is fed under pressure, mutually independent runners extending from each pot, a plurality of cavities serially disposed at the end of each runner, each of said runners being connected directly only to a first of said cavities in an associated series, the mold having a top part and a bottom part, said top part and said bottom part being provided so as to hold a lead frame interposed therebetween, the top and bottom mold parts being provided such that a lead frame having a plurality of lead frame sections each associated with a chip, said lead frame sections being arranged to extend in two directions, can be held between the top and bottom mold parts.
Claim 7
Independent Claim
102 words
A method for producing resin-encapsulated semiconductors which comprises: providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner; interposing a lead frame between a top part and a bottom part of said mold; and discharging said resin from said pots into said runners to fill said cavities sequentially. wherein said lead frame comprises a plurality of lead frame sections, each associated with a chip, said lead frame sections being arranged to extend in two directions.
Claim 8
Independent Claim
102 words
A method for producing resin-encapsulated semiconductors which comprises: providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner; interposing a lead frame between a top part and a bottom part of said mold; and discharging said resin from said pots into said runners to fill said cavities sequentially. wherein said lead frame comprises a plurality of lead frame sections, each associated with a chip, said lead frame sections being arranged to extend in two directions.
References Cited (Backward Citations)
US3716764A
Cited
US3440027A
Cited
US3484533A
Cited
JPS4637098Y1
Cited
US3672046A
Cited
US3651448A
Cited
US3698074A
Cited
US3611061A
Cited
US4368168A
Cited
JPS5612741A
Cited
US4404744A
Cited
US4599062A
Cited
JPS58217313A
Cited
US4513942A
Cited
US4632653A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-12 | 1993-08-14 | 1994-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-12 | 1997-08-14 | 1998-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-12 | 2001-08-14 | 2002-02-13 | $7700.00 | Window Closed / Lapsed |