US4908933A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a substrate for mounting electronic components
Assignee: Ibiden Co Ltd
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Filing: 1989-04-28
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Granted: 1990-03-20
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Expires: 2009-04-28
Abstract
Abstract A method of manufacturing a substrate for mounting electronic components according to this invention comprises the steps of forming a mask on a portion to be electrically connected to an exterior of a lead frame, of forming resin layers on both side surfaces of the lead frame by prepregs or the like, of removing the resin layer on the mask, and of removing the mask, and in the substrate for mounting electronic components manufactured according to this method, the substrate is integrally formed with the lead frame, and the electrical connection of the substrate to the lead frame is performed by through hole plating without using fine metal wiring.
Inventors
- 👤 Katsumi Sagisaka
- 👤 Atsushi Hiroi
- 👤 Mitsuhiro Kondo
- 👤 Takeshi Takeyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 03:20
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H05; H05K; H05K3/00; H05K3/40; H05K3/4092; H05K3/44; H05K3/445; H05K3/46; H05K3/4611; H05K3/4641; H10W; H10W70/00; H10W70/40; H10W70/479; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0352; H05K2201/0388; H05K2201/0397; H05K2201/09; H05K2201/09145; H05K2201/0919; H05K2201/09209; H05K2201/09654; H05K2201/09754; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10924; H05K2203/00; H05K2203/02; H05K2203/0264; H05K3/10; H05K3/20; H05K3/202; H05K3/42; H05K3/425; H05K3/427; H05K3/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
117 words
A method of manufacturing a substrate for mounting electronic components comprising a substrate having a conductor circuit necessary to mount the electronic components, and a lead frame for electrically connecting the electronic components to the exterior, said substrate being integrally formed with said lead frame, the electrical connection of said electronic component to said lead frame being at least performed by a through hole plating, the method comprising the steps of: (1) forming a mask on a portion to be electrically connected to an exterior of said lead frame; (2) forming resin layers on both side surfaces of said lead frame by a prepreg; (3) removing the resin layer on said mask; and (4) removing said mask.
Claim 2
Independent Claim
117 words
A method of manufacturing a substrate for mounting electronic components comprising a substrate having a conductor circuit necessary to mount the electronic components, and a lead frame for electrically connecting the electronic components to the exterior, said substrate being integrally formed with said lead frame, the electrical connection of said electronic component to said lead frame being at least performed by a through hole plating, the method comprising the steps of: (1) forming a mask on a portion to be electrically connected to an exterior of said lead frame; (2) forming resin layers on both side surfaces of said lead frame by a prepreg; (3) removing the resin layer on said mask; and (4) removing said mask.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-19 | 1993-09-18 | 1994-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-19 | 1997-09-18 | 1998-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-19 | 2001-09-18 | 2002-03-20 | $7700.00 | Window Closed / Lapsed |