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US4925723A Expired / Lapsed US ⏱️ 0.0 years remaining

Microwave integrated circuit substrate including metal filled via holes and method of manufacture

Assignee: Microwave Power Inc
•
Filing: 1988-09-29
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Granted: 1990-05-15
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Expires: 2008-09-29
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Abstract

Abstract The present invention is directed to a microwave integrated circuit formed on a substrate having via holes for either electrical grounding or heat dissipation or both and more particularly to a substrate including via holes which are filled with metal.

Inventors

  • 👤 Marina Bujatti
  • 👤 Franco N. Sechi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 21:46
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H10; H10W; H10W44/00; H10W44/20; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/016; H05K2203/06; H05K2203/066; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K2203/11; H05K2203/1105; H05K3/10; H05K3/20; H05K3/205; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 53 words
A microwave integrated circuit substrate comprising: a body of insulating material having upper and lower surfaces with one or more holes formed in said body to extend between the upper and lower surface; and a metal substantially filling all of said holes and extending between and coplanar with the upper and lower surfaces.
Claim 2
Dependent Claim 53 words
A microwave integrated circuit substrate comprising: a body of insulating material having upper and lower surfaces with one or more holes formed in said body to extend between the upper and lower surface; and a metal substantially filling all of said holes and extending between and coplanar with the upper and lower surfaces.
Claim 3
Dependent Claim 11 words
A microwave integrated circuit with via holes filled with plated metal.
Claim 4
Dependent Claim 11 words
A microwave integrated circuit with via holes filled with plated metal.
Claim 5
Dependent Claim 14 words
A substrate as in claims 1 or 2 in which the substrate is ceramic.
Claim 6
Dependent Claim 14 words
A substrate as in claim 1 or 2 in which the substrate is alumina.
Claim 7
Independent Claim 79 words
The method of forming a substrate for microwave integrated circuits comprising: forming holes or vias at selected locations in a substrate; closing one end of said holes or vias with a conductive film which extends on the surface of the substrate; plating metal through the holes or vias onto said conductive film until the holes or vias are filled with plated metal; and removing said conductive film to leave a substrate with vias or holes filled with plated metal.
Claim 8
Independent Claim 79 words
The method of forming a substrate for microwave integrated circuits comprising: forming holes or vias at selected locations in a substrate; closing one end of said holes or vias with a conductive film which extends on the surface of the substrate; plating metal through the holes or vias onto said conductive film until the holes or vias are filled with plated metal; and removing said conductive film to leave a substrate with vias or holes filled with plated metal.

References Cited (Backward Citations)

US3205298A Cited
US3562009A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-05-14 1993-11-13 1994-05-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-05-14 1997-11-13 1998-05-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-05-14 2001-11-13 2002-05-15 $7700.00 Window Closed / Lapsed

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