Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
139 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent and a solvent wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the amounts of said polybasic acid anhydride and said alkyl ketene dimer included is said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g.
Claim 2
Dependent Claim
139 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent and a solvent wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the amounts of said polybasic acid anhydride and said alkyl ketene dimer included is said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g.
Claim 3
Dependent Claim
20 words
The composition of claim 1 wherein the hydroxyl value of said photocurable resin ranges between 0 to 5 mg KOH/g.
Claim 4
Dependent Claim
13 words
The composition of claim 1 wherein m+n=0.95 to 1.15 and n/(m+n)=0.2 to 0.4.
Claim 5
Dependent Claim
20 words
The composition of claim 1 wherein the acid value of said photocurable resin ranges between 50 to 160 mg KOH/g.
Claim 6
Dependent Claim
13 words
The composition of claim 1 wherein said unsaturated monobasic acid is acrylic acid.
Claim 7
Dependent Claim
18 words
The composition of claim 1 wherein said polybasic acid anhydride is selected from hexahydrophthalic anhydride and succinic anhydride.
Claim 8
Dependent Claim
12 words
The composition of claim 1 wherein said alkyl ketene dimer is diketene.
Claim 9
Dependent Claim
12 words
The composition of claim 1 wherein said photo polymerization initiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1.
Claim 10
Dependent Claim
29 words
The composition of claim 1 wherein said photo polymerization initiator comprises 2-methyl-1-4[(methylothio)phenyl]-2-morpholino-propane-1 and at least one composition selected from the group consisting of 2,4-diethylthioxanthone, ethyl-4-dimethylaminobenzoate, and the derivatives thereof.
Claim 11
Dependent Claim
160 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and a thermosetting component, wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene diner, wherein the amounts of said polybasic anhydride and said alkyl ketene dimer included in said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g and further wherein said thermosetting component is an epoxy compound having at least two epoxy groups per molecule thereof.
Claim 12
Dependent Claim
160 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and a thermosetting component, wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene diner, wherein the amounts of said polybasic anhydride and said alkyl ketene dimer included in said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g and further wherein said thermosetting component is an epoxy compound having at least two epoxy groups per molecule thereof.
Claim 13
Dependent Claim
20 words
The composition of claim 10 wherein the acid value of said photocurable resin ranges between 50 to 160 mg KOH/g.
Claim 14
Dependent Claim
39 words
The compostion of claim 10 wherein said thermosetting component is selected from the group consisting of a bis-phenol A epoxy resin, a bis-phenol F epoxy resin, a phenol novolak epoxy resin, a cresol novolak epoxy resin and mixtures thereof.
Claim 15
Dependent Claim
34 words
The composition of claim 10 wherein said thermocurable component is added in an amount ranging between about 5 to about 100 parts by weight, based upon 100 parts by weight of said photocurable resin.