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US4933259A Expired / Lapsed US ⏱️ 0.0 years remaining

Alkaline developable liquid photoimageable solder resist ink composition

Assignee: Arakawa Chemical Industries Ltd
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Filing: 1988-08-24
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Granted: 1990-06-12
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Expires: 2008-08-24
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Abstract

Abstract A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the hydroxyl value of the photocurable resin is not more than 10 carbons. Coating films formed from the subject composition have excellent adhesion, heat resistance, moisture insulation resistance and alkaline developable properties.

Inventors

  • 👤 Machio Chihara
  • 👤 Mitsukazu Funahashi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 03:33
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287; G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0388; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/0793; Y; Y10; Y10S; Y10S525/00; Y10S525/922

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 139 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent and a solvent wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the amounts of said polybasic acid anhydride and said alkyl ketene dimer included is said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g.
Claim 2
Dependent Claim 139 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent and a solvent wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the amounts of said polybasic acid anhydride and said alkyl ketene dimer included is said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g.
Claim 3
Dependent Claim 20 words
The composition of claim 1 wherein the hydroxyl value of said photocurable resin ranges between 0 to 5 mg KOH/g.
Claim 4
Dependent Claim 13 words
The composition of claim 1 wherein m+n=0.95 to 1.15 and n/(m+n)=0.2 to 0.4.
Claim 5
Dependent Claim 20 words
The composition of claim 1 wherein the acid value of said photocurable resin ranges between 50 to 160 mg KOH/g.
Claim 6
Dependent Claim 13 words
The composition of claim 1 wherein said unsaturated monobasic acid is acrylic acid.
Claim 7
Dependent Claim 18 words
The composition of claim 1 wherein said polybasic acid anhydride is selected from hexahydrophthalic anhydride and succinic anhydride.
Claim 8
Dependent Claim 12 words
The composition of claim 1 wherein said alkyl ketene dimer is diketene.
Claim 9
Dependent Claim 12 words
The composition of claim 1 wherein said photo polymerization initiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1.
Claim 10
Dependent Claim 29 words
The composition of claim 1 wherein said photo polymerization initiator comprises 2-methyl-1-4[(methylothio)phenyl]-2-morpholino-propane-1 and at least one composition selected from the group consisting of 2,4-diethylthioxanthone, ethyl-4-dimethylaminobenzoate, and the derivatives thereof.
Claim 11
Dependent Claim 160 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and a thermosetting component, wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene diner, wherein the amounts of said polybasic anhydride and said alkyl ketene dimer included in said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g and further wherein said thermosetting component is an epoxy compound having at least two epoxy groups per molecule thereof.
Claim 12
Dependent Claim 160 words
A composition useful as an alkaline developable liquid photoimageable solder resist ink consisting essentially of a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and a thermosetting component, wherein said photocurable resin is a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene diner, wherein the amounts of said polybasic anhydride and said alkyl ketene dimer included in said composition are m mole and n mole respectively, based upon one equivalent of hydroxyl groups of said epoxy vinyl ester resin, wherein said m and said n are positive numbers which satisfy the equations: m+n=0.90 to 1.10 and n/(m+n)=0.1 to 0.4 and wherein the hydroxyl value of said photocurable resin ranges between 0 to 10 mg KOH/g and further wherein said thermosetting component is an epoxy compound having at least two epoxy groups per molecule thereof.
Claim 13
Dependent Claim 20 words
The composition of claim 10 wherein the acid value of said photocurable resin ranges between 50 to 160 mg KOH/g.
Claim 14
Dependent Claim 39 words
The compostion of claim 10 wherein said thermosetting component is selected from the group consisting of a bis-phenol A epoxy resin, a bis-phenol F epoxy resin, a phenol novolak epoxy resin, a cresol novolak epoxy resin and mixtures thereof.
Claim 15
Dependent Claim 34 words
The composition of claim 10 wherein said thermocurable component is added in an amount ranging between about 5 to about 100 parts by weight, based upon 100 parts by weight of said photocurable resin.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-06-11 1993-12-11 1994-06-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-06-11 1997-12-11 1998-06-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-06-11 2001-12-11 2002-06-12 $7700.00 Window Closed / Lapsed

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