US4937618A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Alignment and exposure apparatus and method for manufacture of integrated circuits
Assignee: Canon Inc
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Filing: 1989-06-20
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Granted: 1990-06-26
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Expires: 2009-06-20
Abstract
Abstract An alignment apparatus including a first off-axis alignment optical system having a magnification, and a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, wherein the apparatus is operable in a global alignment mode using the second off-axis alignment optical system. In another aspect, there is provided an alignment apparatus which includes a first off-axis alignment optical system having a magnification, a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, and a TTL alignment optical system, wherein the alignment apparatus is operable in a global alignment mode using the second off-axis alignment optical system and is operable in another global alignment mode using the TTL optical alignment system.
Inventors
- 👤 Naoki Ayata
- 👤 Mitsugu Yamamura
- 👤 Bunei Hamasaki
- 👤 Masao Kosugi
- 👤 Kazuo Takahashi
- 👤 Mitsuaki Seki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 19:10
CPC Classifications
G; G03; G03F; G03F9/00; G03F9/70; G03F9/7088; G03F7/00; G03F7/70; G03F7/70058; G03F7/70691; G03F7/70716; G03F7/70725; G03F9/7003; G03F9/7023; G03F9/7049; G03F9/7053; G03F9/7057
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
53 words
An alignment and exposure apparatus, usable with a wafer and a reticle having a circuit pattern and an alignment mark formed in a peripheral portion around the circuit pattern, said apparatus comprising: light-intercepting means having a movable blade effective to define a variable-shape aperture for allowing passage of light to the reticle; and
Claim 2
Dependent Claim
53 words
An alignment and exposure apparatus, usable with a wafer and a reticle having a circuit pattern and an alignment mark formed in a peripheral portion around the circuit pattern, said apparatus comprising: light-intercepting means having a movable blade effective to define a variable-shape aperture for allowing passage of light to the reticle; and
Claim 3
Dependent Claim
41 words
means for moving said movable blade to change the shape of said aperture of the light-intercepting means, such that the alignment mark on the reticle is selectively transferred onto the wafer during exposure thereof to the circuit pattern of the reticle.
Claim 4
Dependent Claim
41 words
means for moving said movable blade to change the shape of said aperture of the light-intercepting means, such that the alignment mark on the reticle is selectively transferred onto the wafer during exposure thereof to the circuit pattern of the reticle.
Claim 5
Dependent Claim
228 words
An exposure method, for sequentially exposing at least two areas on a wafer to light, said method comprising the steps of: detecting surface-position information with respect to a first one of the at least two areas on the wafer, on the basis of distance information related to plural points on the wafer; changing the surface-position of the wafer in accordance with the result of detection so that the surface of the first area of the wafer is brought into a predetermined relation with a focus of exposure light; exposing the first area on the wafer to the exposure light; moving the wafer to a position for allowing exposure of a second one of the at least two areas on the wafer, and moving the surface position of the wafer, in accordance with a portion of said distance information which portion is related to one of said plural points on the wafer closest to the second area; detecting surface position information with respect to the second area on the wafer on the basis of distance information related to plural points on the wafer; changing the surface position of the wafer with respect to the second area so that the surface of the second area is brought into a predetermined relation with the focus of the exposure light; and exposing the second area of the wafer to the exposure light.
Claim 6
Dependent Claim
228 words
An exposure method, for sequentially exposing at least two areas on a wafer to light, said method comprising the steps of: detecting surface-position information with respect to a first one of the at least two areas on the wafer, on the basis of distance information related to plural points on the wafer; changing the surface-position of the wafer in accordance with the result of detection so that the surface of the first area of the wafer is brought into a predetermined relation with a focus of exposure light; exposing the first area on the wafer to the exposure light; moving the wafer to a position for allowing exposure of a second one of the at least two areas on the wafer, and moving the surface position of the wafer, in accordance with a portion of said distance information which portion is related to one of said plural points on the wafer closest to the second area; detecting surface position information with respect to the second area on the wafer on the basis of distance information related to plural points on the wafer; changing the surface position of the wafer with respect to the second area so that the surface of the second area is brought into a predetermined relation with the focus of the exposure light; and exposing the second area of the wafer to the exposure light.
Claim 7
Dependent Claim
67 words
An exposure apparatus usable with a reticle and a wafer, for exposing the wafer to radiation passed through the reticle, said apparatus comprising: means for exposing the wafer to the radiation passed through the reticle; means for reading an identification mark formed on the reticle; means for recording an identification mark on the wafer; and means for reading an identification mark formed or recorded on the wafer.
Claim 8
Dependent Claim
67 words
An exposure apparatus usable with a reticle and a wafer, for exposing the wafer to radiation passed through the reticle, said apparatus comprising: means for exposing the wafer to the radiation passed through the reticle; means for reading an identification mark formed on the reticle; means for recording an identification mark on the wafer; and means for reading an identification mark formed or recorded on the wafer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-25 | 1993-12-25 | 1994-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-25 | 1997-12-25 | 1998-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-25 | 2001-12-25 | 2002-06-26 | $7700.00 | Window Closed / Lapsed |