US4939316A — Aluminum alloy semiconductor packages

Claim 1

Independent Claim 69 words

A package for encasing an electronic device, comprising: an aluminum or aluminum alloy base component; an aluminum or aluminum alloy cover component; said base component and said cover component defining a cavity; a leadframe disposed between and adapted to be bonded to said base component and to said cover component; and an anodization layer covering at least that portion of said base and cover components exposed to the atmosphere.

Claim 2

Dependent Claim 69 words

A package for encasing an electronic device, comprising: an aluminum or aluminum alloy base component; an aluminum or aluminum alloy cover component; said base component and said cover component defining a cavity; a leadframe disposed between and adapted to be bonded to said base component and to said cover component; and an anodization layer covering at least that portion of said base and cover components exposed to the atmosphere.

Claim 3

Dependent Claim 25 words

The package of claim 1 wherein the thickness of the anodization layer is in the range of from about 10 microinches to about 2000 microinches.

Claim 4

Dependent Claim 25 words

The package of claim 2 wherein the thickness of the anodization layer is in the range of from about 50 microinches to about 200 microinches.

Claim 5

Dependent Claim 21 words

The package of claim 2 wherein the seal area of said base and cover components is covered by an anodization layer.

Claim 6

Dependent Claim 27 words

The package of claim 4 wherein said leadframe is bondable to said base component and to said cover component by a sealing glass or a polymer adhesive.

Claim 7

Dependent Claim 19 words

The package of claim 5 wherein the surface of the anodization layer has been roughened to improve bond strength.

Claim 8

Dependent Claim 23 words

The package of claim 6 wherein said leadframe is bondable to said base component and to said cover component by a resin adhesive.

Claim 9

Dependent Claim 27 words

The package of claim 6 wherein said electronic device is bonded to said base component and electrically connected to said base component and to said cover component.

Claim 10

Dependent Claim 25 words

The package of claim 2 wherein substantially the entire surface of the base component and of the cover component are covered with an anodization layer.

Claim 11

Dependent Claim 40 words

The package of claim 2 wherein substantially the entire surface of the base component and of the cover component except for the surface of the base component to be bonded to said electronic device is covered with an anodization layer.

Claim 12

Dependent Claim 40 words

The package of claim 2 wherein substantially the entire surface of the base component and of the cover component except for a portion of the surface of said cover component enclosed within said cavity is covered with an anodization layer.

Claim 13

Dependent Claim 28 words

The package of claim 2 wherein said base component and said cover component are comprised of an aluminum based alloy containing up to about 1.5% by weight manganese.

Claim 14

Dependent Claim 32 words

The package of claim 12 wherein said base component and said cover component are comprised of an aluminum based alloy containing about 0.12% by weight copper and about 1.2% by weight manganese.

Claim 15

Dependent Claim 93 words

A package for encasing an electronic device, comprising: an aluminum or aluminum alloy base component; a window frame component having first and second surfaces; said base component and said window frame component defining a cavity; a leadframe disposed between and adapted to be bonded to said base component and to the first surface of said window frame component; a cover component adapted to be bonded to the second surface of said window frame component; and an anodization layer covering at least that portion of said base and cover components exposed to the atmosphere.

Claim 16

Dependent Claim 93 words

A package for encasing an electronic device, comprising: an aluminum or aluminum alloy base component; a window frame component having first and second surfaces; said base component and said window frame component defining a cavity; a leadframe disposed between and adapted to be bonded to said base component and to the first surface of said window frame component; a cover component adapted to be bonded to the second surface of said window frame component; and an anodization layer covering at least that portion of said base and cover components exposed to the atmosphere.

Claim 17

Dependent Claim 19 words

The package of claim 14 wherein said window frame component is comprised of aluminum or an aluminum based alloy.

Claim 18

Dependent Claim 26 words

The package of claim 15 wherein said window frame component contains an anodization layer over at least that portion of the surface exposed to the atmosphere.

Claim 19

Dependent Claim 25 words

The package of claim 16 wherein the thickness of the anodization layer is in the range of from about 10 microinches to about 2000 microinches.

Claim 20

Dependent Claim 25 words

The package of claim 17 wherein the thickness of the anodization layer is in the range of from about 50 microinches to about 200 microinches.

Claim 21

Dependent Claim 32 words

The package of claim 17 wherein said leadframe is bondable to said base component and to said first side of said window frame component by a sealing glass or a polymer adhesive.

Claim 22

Dependent Claim 28 words

The package of claim 19 wherein the seal area of said base component and said first side of said window frame component is covered by an anodization layer.

Claim 23

Dependent Claim 19 words

The package of claim 20 wherein the surface of the anodization layer has been roughened to improve bond strength.

Claim 24

Dependent Claim 23 words

The package of claim 21 wherein said leadframe is bonded to said base component and to said window frame by a resin adhesive.

Claim 25

Dependent Claim 27 words

The package of claim 22 wherein said leadframe is disposed between and bonded to said base component and to said first side of said window frame component.

Claim 26

Dependent Claim 36 words

The package of claim 23 wherein said second surface of said window frame is adapted to be bonded to said cover component by a bonding agent selected from the group consisting of thermoset and thermoplastic adhesives.

Claim 27

Dependent Claim 36 words

The package of claim 24 wherein said electronic device is bonded to said base component and electrically connected to said leadframe; and said cover component is bonded to said second surface of said window frame component.

Claim 28

Dependent Claim 25 words

The package of claim 17 wherein substantially the entire surface of the base component and of the cover component are covered with an additional layer.

Claim 29

Dependent Claim 40 words

The package of claim 17 wherein substantially the entire surface of the base component and of the cover component except for the surface of said base component to be bonded to said electronic device is covered with an anodization layer.

Claim 30

Dependent Claim 36 words

The package of claim 17 wherein substantially the entire surface of the base component and of the cover component except for the surface of said cover component enclosed within said cavity covered with an anodization layer.

Claim 31

Dependent Claim 26 words

The package of claim 17 wherein said base, window frame and cover components are comprised of an aluminum based alloy containing up to about 1.5% manganese.

Claim 32

Dependent Claim 32 words

The package of claim 29 wherein said base, window frame and cover components are comprised of an aluminum based alloy containing about 0.12% by weight copper and about 1.2% by weight manganese.

Claim 33

Dependent Claim 92 words

A process for assembling a package for encasing an electronic device, comprising the steps of: providing a base component and a cover component, said base and cover components comprised of aluminum or an aluminum based alloy; anodizing at least that portion of the surfaces of said base and cover components exposed to the atmosphere; disposing a leadframe between said base component and said cover component; and bonding said leadframe to said base component and to said cover component subsequent to connecting said electronic device to said base component and to said leadframe.

Claim 34

Dependent Claim 92 words

A process for assembling a package for encasing an electronic device, comprising the steps of: providing a base component and a cover component, said base and cover components comprised of aluminum or an aluminum based alloy; anodizing at least that portion of the surfaces of said base and cover components exposed to the atmosphere; disposing a leadframe between said base component and said cover component; and bonding said leadframe to said base component and to said cover component subsequent to connecting said electronic device to said base component and to said leadframe.

Claim 35

Dependent Claim 13 words

The process of claim 31 including the step of sealing said anodization layer.

Claim 36

Dependent Claim 23 words

The process of claim 32 including masking a portion of either said base component or said cover component or both prior to anodization.

Claim 37

Dependent Claim 25 words

The process of claim 32 including anodizing the entire surfaces of the base and cover components and subsequently removing a portion of said anodization layer.

Claim 38

Dependent Claim 18 words

The process of claim 32 including anodizing the seal area of the base component and the cover component.

Claim 39

Dependent Claim 17 words

The process of claim 35 including the step of increasing the surface roughness of the anodization layer.

Claim 40

Dependent Claim 57 words

The process of claim 36 including said bonding step comprises disposing a resin adhesive between said leadframe and said base component and said leadframe and said cover component and heating to a temperature of from about 145° C. to about 155° C. for a time in the range of from about 1 hour to about 2 hours.

Claim 41

Dependent Claim 31 words

The process of claim 36 including disposing a window frame component between said leadframe and said cover component and bonding said window frame to said leadframe and to said cover component.

Claim 42

Dependent Claim 24 words

The process of claim 38 including bonding said cover component to said window frame component subsequent to bonding said window frame to said leadframe.

Claim 43

Dependent Claim 17 words

The process of claim 38 including selecting said window frame to be aluminum or an aluminum alloy.

Claim 44

Dependent Claim 31 words

The process of claim 40 including selecting said window frame, said base component and said cover component to be an aluminum based alloy containing up to about 1.5% by weight manganese.

Claim 45

Dependent Claim 35 words

The process of claim 41 including selecting said window frame, said base component and said cover component to be an aluminum based alloy containing about 0.12% by weight copper and about 1.2% by weight manganese.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1993-07-02	1994-01-01	1994-07-03	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1997-07-02	1998-01-01	1998-07-03	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2001-07-02	2002-01-01	2002-07-03	$7700.00	Window Closed / Lapsed

Aluminum alloy semiconductor packages

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