US4942454A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin sealed semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1988-08-02
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Granted: 1990-07-17
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Expires: 2008-08-02
Abstract
Abstract A resin-sealed semiconductor device comprises a die pad which has through holes. Thin metal films are provided on the surfaces of the die pad except for the wall surfaces of the holes. A resin, which is used for integral molding of the die pad and a semiconductor element, flows into the holes during molding. The semiconductor device so mounted does not induce cracks in the resin and, thus, has good moisture resistance.
Inventors
- 👤 Ryuichiro Mori
- 👤 Katsuyuki Fukudome
- 👤 Tatsuhiko Akiyama
- 👤 Yoshitaka Takemoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W72/00; H10W72/01; H10W72/013; H10W72/071; H10W72/073; H10W72/07331; H10W72/07351; H10W72/07353; H10W72/075; H10W72/30; H10W72/331; H10W72/334; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
88 words
A packaged semiconductor device comprising: a die pad having a main surface and through holes having walls that extend to said main surface; a metal film having a composition different from that of said die pad disposed on said main surface but not on said walls; a semiconductor element mounted on said metal film with a fixing material that wets said die pad relatively poorly and that wets said metal film relatively well; and a resin encapsulating said die pad and semiconductor element and disposed in said holes.
Claim 2
Dependent Claim
88 words
A packaged semiconductor device comprising: a die pad having a main surface and through holes having walls that extend to said main surface; a metal film having a composition different from that of said die pad disposed on said main surface but not on said walls; a semiconductor element mounted on said metal film with a fixing material that wets said die pad relatively poorly and that wets said metal film relatively well; and a resin encapsulating said die pad and semiconductor element and disposed in said holes.
Claim 3
Dependent Claim
25 words
The packaged semiconductor device of claim 1 wherein said through holes are disposed proximate the periphery of a semiconductor mounting portion of said die pad.
Claim 4
Dependent Claim
26 words
The packaged semiconductor device of claim 1 wherein said pad is an iron-based alloy, said metal film is silver, and the fixing material is a solder.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-16 | 1994-01-15 | 1994-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-16 | 1998-01-15 | 1998-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-16 | 2002-01-15 | 2002-07-17 | $7700.00 | Window Closed / Lapsed |