US4967950A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Soldering method
Assignee: International Business Machines Corp
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Filing: 1989-10-31
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Granted: 1990-11-06
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Expires: 2009-10-31
Abstract
Abstract A method is described for attaching circuit chips to a flexible substrate (laminate) using controlled chip collapse connection technology (C-4). The substrate is "tinned" with an alloy of eutectic composition in its contact region with the solder balls on the base of the chip. The alloy and the solder are chosen such that they are miscible. The system temperature is raised above the alloy melting point thus causing the alloy and the solder to mix, the mixture composition moving away from the eutectic composition with time and thus raising its melting point. Eventually the mixture melting point is higher than the temperature at which the system is maintained and the mixture solidifies to form a contact. In this way contact between the chip and the flexible substrate can be effected at a temperature below the melting point of the pure solder and lower than one which would result in degradation of the laminate adhesive.
Inventors
- 👤 Stephen P. Legg
- 👤 Gustav Schrottke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 09:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
70 words
A soldering method for direct attachment of electronic chips to a flexible circuitized substrate comprising the steps of: providing a first solid solder on contacts of said chips; providing a second solder in which said first solder is miscible on contact pads on said flexible substrate; placing said chips at corresponding pads on said flexible circuitized substrate; heating where said first and second solders interface for effecting eutectic bonding therebetween.
Claim 2
Dependent Claim
70 words
A soldering method for direct attachment of electronic chips to a flexible circuitized substrate comprising the steps of: providing a first solid solder on contacts of said chips; providing a second solder in which said first solder is miscible on contact pads on said flexible substrate; placing said chips at corresponding pads on said flexible circuitized substrate; heating where said first and second solders interface for effecting eutectic bonding therebetween.
Claim 3
Dependent Claim
23 words
The method of claim 1 wherein providing said first solder includes: providing a tin-lead solder, with tin forming between 3% and 10% thereof.
Claim 4
Dependent Claim
28 words
The method of claim 1 wherein providing said second solder includes: choosing from tin-lead solders, one having a reflow temperature in the range from about 175-190 deg. C.
Claim 5
Independent Claim
23 words
The method of claims 1, 2 or 3 wherein providing said second solder includes: providing solder composed of 63% tin and 37% lead.
Claim 6
Independent Claim
28 words
The method of claims 1, 2 or 3 wherein said heating step includes: using a thermode for applying heat at said interface of said first and second solders.
Claim 7
Dependent Claim
30 words
The method of claim 1 including an additional step of: simultaneously with said heating step, applying uniform pressure at every point along said interface of said first and second solders.
Claim 8
Dependent Claim
21 words
The method of claim 6 wherein said applying step includes: using a mass associated with said thermode for applying uniform pressure.
Claim 9
Dependent Claim
39 words
The methods of claim 1 or 6 wherein said heating step comprises: providing an atmosphere surrounding said interface at an elevated temperature sufficient to reflow said second solder; and said applying step includes providing a weight on said chip.
Claim 10
Dependent Claim
95 words
A soldering method for direct attachment of electronic chips to a flexible, circuitized laminated substrate comprising the steps of: coating contacts on said chips with a tin-lead solder, with tin comprising about 3-10% thereof; covering contact pads on said substrate with 63% tin, 37% lead solder; placing said chips on said substrate so as to align chip contacts and corresponding contact pads on said substrate; and heating said solder covering said contact pads to a temperature for reflowing said solder, while applying uniform pressure, and effecting a eutectic bond between said chip and said substrate.
Claim 11
Dependent Claim
95 words
A soldering method for direct attachment of electronic chips to a flexible, circuitized laminated substrate comprising the steps of: coating contacts on said chips with a tin-lead solder, with tin comprising about 3-10% thereof; covering contact pads on said substrate with 63% tin, 37% lead solder; placing said chips on said substrate so as to align chip contacts and corresponding contact pads on said substrate; and heating said solder covering said contact pads to a temperature for reflowing said solder, while applying uniform pressure, and effecting a eutectic bond between said chip and said substrate.
Claim 12
Dependent Claim
19 words
The method of claim 9 wherein said heating step includes: bringing a weighted thermode into contact with said chips.
Claim 13
Dependent Claim
30 words
The method of claim 5 including an additional step of: simultaneously with said heating step applying uniform pressure at every point along said interface of said first and second solders.
References Cited (Backward Citations)
US4033503A
Cited
JPS5336312A
Cited
JPS5372756A
Cited
US4418857A
Cited
US4465223A
Cited
US4518112A
Cited
DD240347A1
Cited
JPS62117346A
Cited
JPS62143435A
Cited
US4876617A
Cited
DD258314A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-11-05 | 1994-05-07 | 1994-11-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-11-05 | 1998-05-07 | 1998-11-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-11-05 | 2002-05-07 | 2002-11-06 | $7700.00 | Window Closed / Lapsed |