Amplifier package using vertical power transistors with ungrounded common terminals

Claim 1

A transistor package, comprising: a plurality of transistor chips each having a plurality of vertical power transistor cells; a first and second input lead providing electrical pathways to external circuits; a first input pad having electrical connections to said first input lead; a second input pad having electrical connections to said second input lead; a flange serving as a heatsink for said transistor chips wherein said chips are bonded directly to said flange; said first input pad being separated from said second input pad by an insulating pad to form a stacked arrangement which is mounted on said flange; each of said transistor cells having a first electrode connected to said first input pad, a second electrode connected to said flange, and a third electrode connected to said second input pad wherein said first and third electrodes are terminals of an input circuit and said first and second electrodes are terminals of an output circuit wherein said first electrode serves as a common node between said input circuit and said output circuit, thereby establishing separate electrical paths between said common node and said associated input circuit and between said common node and said associated output circuit; means for providing a floating input signal across the terminals of each respective input circuit such that their potential is floating relative to ground; an output pad having electrical connections to said output terminal of each transistor cell for receiving a transistor output signal from each of said transistor cells; and a plurality of output leads for providing connections to external circuits wherein each output lead has electrical connections to said output pad; whereby negative feedback is not present in each of said transistor cells due to the establishment of said separate electrical paths between said respective common node and said associated input and output circuits.