US4980016A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing electric circuit board
Assignee: Canon Inc
•
Filing: 1986-08-01
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Granted: 1990-12-25
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Expires: 2006-08-01
Abstract
Abstract A process for producing an electric circuit board comprises utilizing a transfer sheet, bearing an electric circuit pattern composed of a metal foil adhered onto a sheet substrate by means of an adhesive material, and transferring said electric circuit pattern onto a surface of an insulating resin substrate simultaneously with the molding thereof.
Inventors
- 👤 Naoko Tada
- 👤 Kunihiko Maeoka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:52
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14827; B29C45/14639; H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; B29K; B29K2995/00; B29K2995/0003; B29K2995/0005; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0156; H05K3/22; H05K3/28; H05K3/40; H05K3/4007
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
142 words
A process for producing an electric circuit board comprising the steps of: adhering an electric circuit pattern composed of a metal foil onto a sheet substrate of a transfer sheet by means of an adhesive material disposed on the non-connector portions of the electric circuit pattern; and transferring said electric circuit pattern onto a surface of an insulating resin substrate simultaneously with the molding thereof, and transferring the adhesive material onto a surface of the insulating resin substrate simultaneously with the transfer of said electric circuit pattern onto a surface of the insulating resin substrate, wherein said transfer step comprises the steps of: charging said transfer sheet in a metal mold for molding the insulating resin substrate; and filling said metal mold with resin to effect the transfer of the electric circuit pattern simultaneously with the molding of the insulating resin substrate.
Claim 2
Dependent Claim
142 words
A process for producing an electric circuit board comprising the steps of: adhering an electric circuit pattern composed of a metal foil onto a sheet substrate of a transfer sheet by means of an adhesive material disposed on the non-connector portions of the electric circuit pattern; and transferring said electric circuit pattern onto a surface of an insulating resin substrate simultaneously with the molding thereof, and transferring the adhesive material onto a surface of the insulating resin substrate simultaneously with the transfer of said electric circuit pattern onto a surface of the insulating resin substrate, wherein said transfer step comprises the steps of: charging said transfer sheet in a metal mold for molding the insulating resin substrate; and filling said metal mold with resin to effect the transfer of the electric circuit pattern simultaneously with the molding of the insulating resin substrate.
Claim 3
Dependent Claim
23 words
A process for producing an electric circuit board according to claim 1, wherein said electric circuit pattern is composed of a copper pattern.
Claim 4
Dependent Claim
26 words
A process for producing an electric circuit board according to claim 1, wherein said electric circuit pattern is formed by selective etching of a metal foil.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-12-24 | 1994-06-25 | 1994-12-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-24 | 1998-06-25 | 1998-12-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-24 | 2002-06-25 | 2002-12-25 | $7700.00 | Window Closed / Lapsed |